Granted Patent
B2
US 12,720,673 · App. 18/060,432 · Granted Aug 25, 2026
Methods and apparatus to increase rigidity of printed circuit boards
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Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Dec 1, 2022
From: GO, JIA YAN; CHUAH, TIN POAY; PAAVOLA, JUHA; LOO, TWAN SING; HEINISUO, SAMI; MANSUKOSKI, KARI
To: INTEL CORPORATION
Reel/Frame 062034/0976 →
Continuity (1)
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