IP Library Granted Patent US 12,721,997
Granted Patent B2
US 12,721,997 · App. 18/974,954 · Granted Sep 1, 2026

Haptic apparatus for stimulating users' skin

Inventors: Xinge Yu (Hong Kong, CN); Zijian Zheng (Hong Kong, CN); Kuanming Yao (Hong Kong, CN); Qiuna Zhuang (Hong Kong, CN); Qiang Zhang (Hong Kong, CN); Jingkun Zhou (Hong Kong, CN)
Assignees: City University of Hong Kong; The Hong Kong Polytechnic University
A61N1/0476A61N1/0496A61N1/36034G08B6/00H05K1/0298H05K1/092H05K1/115A61N1/0484H05K2201/09563
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Quick Facts
Patent No.
US 12,721,997
App. No.
18/974,954
Granted
Sep 1, 2026
Kind
B2
Abstract

A haptic apparatus is provided for stimulating a skin of a user to provide haptic feedback to the user. The haptic apparatus comprises an elastomeric substrate layer and multilayered electrical circuits comprising hydrogel electrodes for contacting the skin and electro-stimulating the skin to generate the haptic feedback. The multilayered electrical circuits are arranged on the elastomeric substrate layer, thereby avoiding forming the multilayered electrical circuits on a printed circuit board.

Claims (36)

1 . A haptic apparatus for stimulating a skin of a user to provide haptic feedback to the user, the haptic apparatus comprising:

an elastomeric substrate layer; and

multilayered electrical circuits comprising hydrogel electrodes for contacting the skin and electro-stimulating the skin to generate the haptic feedback,

wherein the multilayered electrical circuits are arranged on the elastomeric substrate layer, thereby avoiding forming the multilayered electrical circuits on a printed circuit board.

2 . The haptic apparatus of claim 1 , wherein the multilayered electrical circuits are monolithically formed on the elastomeric substrate layer.

3 . The haptic apparatus of claim 1 , wherein the elastomeric substrate layer comprises an elastomeric fiber mat.

4 . The haptic apparatus of claim 1 , wherein the multilayered electrical circuits comprise patterned liquid metal (LM) traces.

5 . The haptic apparatus of claim 4 , wherein the hydrogel electrodes comprise:

LM pads disposed on the patterned LM traces; and

a bioadhesive hydrogel disposed on the LM pads for establishing an electrically conducive path to the skin.

6 . The haptic apparatus of claim 5 , wherein the hydrogel electrodes further comprise a paste mask layer sandwiched between the LM pads and the bioadhesive hydrogel, and the paste mask layer is configured to allow the bioadhesive hydrogel to penetrate at least partially through the paste mask layer, thereby contacting the LM pads.

7 . The haptic apparatus of claim 6 , wherein the paste mask layer comprises fiber mat.

8 . The haptic apparatus of claim 1 , wherein the multilayered electrical circuits comprise:

a first circuit layer comprising first patterned liquid metal (LM) traces;

a second circuit layer comprising second patterned LM traces; and

LM interconnects for electrically connecting the first circuit layer and the second circuit layer.

9 . The haptic apparatus of claim 8 , wherein the LM interconnects comprise vertical interconnect accesses (VIAs), and the VIAs comprise fluidic LM for electrically contacting both the first patterned LM traces and the second patterned LM traces.

10 . The haptic apparatus of claim 8 , wherein the multilayered electrical circuits comprise electronic components disposed on the second circuit layer, and the electronic components electrically contact the second patterned LM traces through hybrid LM (hLM) solders.

11 . The haptic apparatus of claim 10 , wherein the hLM solders comprise:

fluidic LM electrically contacting the electronic components; and

an oxidized LM (oLM) paste sandwiched between the fluidic LM and the second patterned LM traces, thereby to electrically connect the electronic components to the second circuit layer.

12 . The haptic apparatus of claim 1 , further comprising an elastomeric encapsulation layer for at least partially encapsulating the multilayered electrical circuits.

13 . The haptic apparatus of claim 12 , wherein the elastomeric encapsulation layer comprises an elastomeric fiber mat.

14 . The haptic apparatus of claim 1 , wherein the hydrogel electrodes comprise a plurality of channels, and the multilayered electrical circuits comprise a control circuit for generating pulsed voltage signals for feeding into the plurality of channels for stimulating the skin of the user.

15 . The haptic apparatus of claim 14 , wherein the control circuit comprises:

a power management module for generating a regulated voltage;

a voltage booster module for boosting up the regulated voltage to yield a boosted voltage;

a plurality of multiplexers for controllably switching on and off the boosted voltage to generate pulsed voltage signals; and

a microcontroller unit (MCU) configured to at least control the plurality of multiplexers in switching the boosted voltage for generating an individual pulsed voltage signal with a desired pulse frequency and a desired duty cycle.

16 . The haptic apparatus of claim 15 , wherein the power management module comprises:

a battery for providing a battery supplied electrical voltage; and

a regulator for regulating the battery supplied electrical voltage to the regulated voltage.

17 . The haptic apparatus of claim 16 , wherein the battery is a rechargeable battery, and the power management module further comprises a QI wireless charging module for recharging the rechargeable battery.

18 . The haptic apparatus of claim 15 , wherein the control circuit further comprises a current control module controllable by the MCU for monitoring and limiting a return current received by a common electrode from the user to avoid the user from getting an electric shock.

19 . The haptic apparatus of claim 18 , wherein the current control module comprises a current mirror that electrically connects to the MCU through either an operational amplifier or a digital-to-analog converter.

20 . The haptic apparatus of claim 1 , wherein the hydrogel electrodes have a highest electrode density of 2.26 units/cm 2 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2024
From: YU, XINGE; YAO, KUANMING; ZHANG, QIANG; ZHOU, JINGKUN
To: CITY UNIVERSITY OF HONG KONG
Reel/Frame 069534/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2024
From: ZHENG, ZIJIAN; ZHUANG, QIUNA
To: THE HONG KONG POLYTECHNIC UNIVERSITY
Reel/Frame 069534/0503 →
Continuity (1)
Related Publication 20260158265A1 · Jun 11, 2026
References Cited (12)
US 9956393B2 · Perez · 2018 [cited by examiner]
US 10079391B2 · Kjeang · 2018 [cited by examiner]
US 11786150B1 · Mujeeb-U-Rahman · 2023 [cited by examiner]
M. Ying, A. P. Bonifas, N. Lu, Y. Su, R. Li, H. Cheng, A. Ameen, Y. Huang, J. A. Rogers, Silicon nanomembranes for fingertip electronics. Nanotechnology 23, 344004 (2012). [cited by applicant]
A. Withana, D. Groeger, J. Steimle, “Tacttoo: A thin and feel-through tattoo for on-skin tactile output” in UIST 2018—Proceedings of the 31st Annual ACM Symposium on User Interface Software and Technology (2018), pp. 36… [cited by applicant]
A. Akhtar, J. Sombeck, B. Boyce, T. Bretl, Controlling sensation intensity for electrotactile stimulation in human-machine interfaces. Science Robotics 3, eaap9770 (2018). [cited by applicant]
B. Xu, A. Akhtar, Y. Liu, H. Chen, W. H. Yeo, S. Park, B. Boyce, H. Kim, J. Yu, H. Y. Lai, S. Jung, Y. Zhou, J. Kim, S. Cho, Y. Huang, T. Bretl, J. A. Rogers, An Epidermal Stimulation and Sensing Platform for Sensorimot… [cited by applicant]
Y. Shi, F. Wang, J. Tian, S. Li, E. Fu, J. Nie, R. Lei, Y. Ding, X. Chen, Z. L. Wang, Self-powered electro-tactile system for virtual tactile experiences. Science Advances, 1-11 (2021). [cited by applicant]
Y. Tanaka, A. Shen, A. Kong, P. Lopes, “Full-hand Electro-Tactile Feedback without Obstructing Palmar Side of Hand” in Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (Association for Comput… [cited by applicant]
S.-Y. Teng, A. Gupta, P. Lopes, “Haptic Permeability: Adding Holes to Tactile Devices Improves Dexterity” in CHI '24 (Honolulu, HI, USA, 2024). [cited by applicant]
W. Lin, D. Zhang, W. W. Lee, X. Li, Y. Hong, Q. Pan, R. Zhang, G. Peng, H. Z. Tan, Z. Zhang, L. Wei, Z. Yang, Super-resolution wearable electrotactile rendering system. Science Advances 8, eabp8738 (2022). [cited by applicant]
Y. Luo, C. Liu, Y. J. Lee, J. DelPreto, K. Wu, M. Foshey, D. Rus, T. Palacios, Y. Li, A. Torralba, W. Matusik, Adaptive tactile interaction transfer via digitally embroidered smart gloves. Nat Commun 15, 868 (2024). [cited by applicant]