Method and apparatus for silicon photonics testing
A first photonics integrated circuit (PIC) chip originates from a PIC wafer. The first PIC chip includes a substrate, and one or more optical communication components fabricated on the substrate. Optical testing components are also fabricated on the substrate. The optical testing components are configured to, prior to die singulation of the PIC wafer, transfer light to a second PIC chip on the PIC wafer for testing one or more operational attributes of optical components disposed on the second PIC chip Prior to die singulation of the PIC wafer, the second PIC chip was adjacent to the first PIC chip on the PIC wafer.
1 . A first photonics integrated circuit (PIC) chip, the first PIC chip having originated from a PIC wafer, the first PIC chip comprising:
a substrate;
one or more optical communication components fabricated on the substrate, the one or more optical components including i) at least one optical modulator, and ii) at least one first edge coupler configured to output modulated light from the at least one optical modulator, the at least one first edge coupler located at one or more edges of the first PIC chip; and
optical testing components fabricated on the substrate, the optical testing components including:
a second edge coupler located at a first edge of the first PIC chip, the second edge coupler configured to, prior to die singulation of the PIC wafer, transfer light to a second PIC chip on the PIC wafer for testing at least a first operational attribute among operational attributes of optical components disposed on the second PIC chip, wherein the second PIC chip was adjacent to the first PIC chip on the PIC wafer prior to die singulation of the PIC wafer.
2 . The first PIC chip of claim 1 , wherein
the second edge coupler is configured to, prior to die singulation of the PIC wafer, transfer light to a second edge coupler of the second PIC chip.
3 . The first PIC chip of claim 1 , wherein the optical testing components further comprise:
an optical coupler fabricated on the substrate, the optical coupler being configured to receive light from an optical testing probe; and
a waveguide fabricated on the substrate, the waveguide optically coupled to the optical coupler and the second edge coupler, the waveguide being configured to transfer light between the optical coupler and the second edge coupler.
4 . The first PIC chip of claim 3 , wherein:
the optical coupler comprises a grating coupler.
5 . The first PIC chip of claim 1 , wherein the optical testing components further comprise:
a third edge coupler fabricated on the substrate, the third edge coupler configured to, prior to die singulation of the PIC wafer, receive light from a fourth edge coupler of the second PIC chip for testing at least a second operational attribute among the one or more operational attributes of the optical components disposed on the second PIC chip.
6 . The first PIC chip of claim 5 , wherein the optical testing components further comprise:
an optical coupler fabricated on the substrate, the optical coupler being configured to transfer light to an optical testing probe; and
a waveguide fabricated on the substrate, the waveguide optically coupled to the optical coupler and the third edge coupler, the waveguide being configured to transfer light between the third edge coupler and the optical coupler.
7 . The first PIC chip of claim 5 , wherein the optical testing components further comprise:
a photodiode fabricated on the substrate; and
a waveguide fabricated on the substrate, the waveguide optically coupled to the photodiode and the third edge coupler, the waveguide being configured to transfer light between the third edge coupler and the photodiode;
wherein the photodiode is configured to, prior to die singulation of the PIC wafer, generate an electrical signal based on light from the fourth edge coupler of the second PIC chip, the electrical signal associated with the second operational attribute of the optical components disposed on the second PIC chip.
8 . The first PIC chip of claim 1 , further comprising electrical testing components fabricated on the substrate, the electrical testing components including one or more electrical pads and being configured to, prior to die singulation of the PIC wafer:
generate one or more electrical signals associated with at least a second operational attribute among the one or more operational attributes of the optical components disposed on the second PIC chip; and
provide the one or more electrical signals to the one or more electrical pads for output to an electrical testing probe mechanism.
9 . A method for manufacturing photonics integrated circuit (PIC) chips, the method comprising:
fabricating a plurality of PIC chips on a PIC wafer having a substrate, including, for each PIC chip among multiple PIC chips of the PIC wafer:
fabricating on the substrate one or more optical components and one or more electrical components corresponding to at least one of i) an optical communication transmitter, and ii) an optical communication receiver, the one or more optical components including i) at least one optical modulator, and ii) at least one first edge coupler configured to output modulated light from the at least one optical modulator, the at least one first edge coupler located at one or more edges of the first PIC chip, and
fabricating on the substrate testing components distinct from the one or more optical components and the one or more electrical components corresponding to the at least one of i) the optical communication transmitter, and ii) the optical communication receiver, the testing components configured to, while the PIC chip and another PIC chip adjacent to the PIC chip are integral with the PIC wafer, transfer light to the other PIC chip for testing one or more operational attributes of optical components disposed on the other PIC chip, the fabricating of the testing components including:
fabricating a second edge coupler on the substrate located at a first edge of the first PIC chip, the second edge coupler configured to, prior to die singulation of the PIC wafer, transfer light to the other PIC chip for testing at least a first operational attribute among the one or more operational attributes of the optical components disposed on the other PIC chip.
10 . The method for manufacturing PIC chips of claim 9 , wherein, for each PIC chip among multiple PIC chips of the PIC wafer, fabricating the testing components comprises:
fabricating the second edge coupler on the substrate to be optically aligned with a third edge coupler of the other PIC chip.
11 . The method for manufacturing PIC chips of claim 9 , wherein, for each PIC chip among multiple PIC chips of the PIC wafer, fabricating the testing components further comprises:
fabricating an optical coupler on the substrate, the optical coupler being configured to receive light from an optical testing probe; and
fabricating a waveguide on the substrate that is optically coupled to the optical coupler and the second edge coupler, the waveguide being configured to transfer light between the optical coupler and the second edge coupler.
12 . The method for manufacturing PIC chips of claim 9 , wherein, for each PIC chip among multiple PIC chips of the PIC wafer, fabricating the testing components further comprises:
fabricating a third edge coupler on the substrate to be optically aligned with a fourth edge coupler of the other PIC chip, the third edge coupler configured to, prior to die singulation of the PIC wafer, receive light from the fourth edge coupler of the second PIC chip for testing at least a second operational attribute among the one or more operational attributes of the optical components disposed on the second PIC chip.
13 . The method for manufacturing PIC chips of claim 12 , wherein, for each PIC chip among multiple PIC chips of the PIC wafer, fabricating the testing components further comprises:
fabricating an optical coupler on the substrate, the optical coupler being configured to transfer light to an optical testing probe; and
fabricating a waveguide on the substrate, the waveguide optically coupled to the optical coupler and the third edge coupler, the waveguide being configured to transfer light between the third edge coupler and the optical coupler.
14 . The method for manufacturing PIC chips of claim 12 , wherein, for each PIC chip among multiple PIC chips of the PIC wafer, fabricating the testing components further comprises:
fabricating a photodiode fabricated on the substrate; and
fabricating a waveguide on the substrate, the waveguide optically coupled to the photodiode and the third edge coupler, the waveguide being configured to transfer light between the third edge coupler and the photodiode;
wherein the photodiode is configured to, prior to die singulation of the PIC wafer, generate an electrical signal based on light from the fourth edge coupler of the second PIC chip, the electrical signal associated with the second operational attribute of the optical components disposed on the second PIC chip.
15 . The method for manufacturing PIC chips of claim 9 , further comprising, for each PIC chip among the multiple PIC chips of the PIC wafer:
fabricating at least a first optical coupler on the substrate, the at least the first optical coupler among the testing components of the PIC chip;
fabricating one or more waveguides on the substrate, the one or more waveguides configured to transfer light between the first optical coupler of the PIC chip and the second edge coupler;
maneuvering a testing probe apparatus over the PIC wafer proximate to the at least the first optical coupler of the PIC chip;
providing light from the testing probe apparatus to the at least the first optical coupler of the PIC chip;
transferring light of the testing probe apparatus from the at least the first optical coupler to optical components disposed on the other PIC chip via the one or more waveguides of the PIC chip and via the second edge coupler; and
using the light transferred from the testing probe apparatus to the optical components disposed on the other PIC to test one or more operational attributes of the optical components disposed on the other PIC chip.
16 . The method for manufacturing PIC chips of claim 15 , wherein:
fabricating at least the first optical coupler on the substrate comprises fabricating a grating coupler on the substrate;
providing light from the testing probe apparatus to the at least the first optical coupler of the PIC chip comprises providing light from the testing probe apparatus to the grating coupler of the PIC chip; and
transferring light from the at least the first optical coupler comprises transferring light from the grating coupler to the optical components disposed on the other PIC chip via the one or more waveguides of the first PIC chip and the second edge coupler.
17 . The method for manufacturing PIC chips of claim 15 , further comprising, for each PIC chip among the multiple PIC chips of the PIC wafer:
fabricating the second edge coupler to be optically aligned with a third edge coupler of the other PIC chip;
wherein transferring light to optical components disposed on the other PIC chip via the optical testing components of the first PIC chip comprises:
transferring light from the at least the first optical coupler of the PIC chip to the second edge coupler of the PIC chip via the one or more waveguides, and
transferring light from the second edge coupler of the PIC chip to the third edge coupler of the other PIC chip.
18 . The method for manufacturing PIC chips of claim 17 , wherein using the light provided from the testing probe apparatus to test one or more operational attributes of the optical components disposed on the other PIC chip comprises:
using light provided from the testing probe apparatus and transferred from the second edge coupler of the PIC chip to the third edge coupler of the other PIC chip to test at least an operational attribute of the third edge coupler of the other PIC chip.
19 . The method for manufacturing PIC chips of claim 17 , further comprising, for each PIC chip among the multiple PIC chips of the PIC wafer:
fabricating a fourth edge coupler on the substrate, the third fourth edge coupler being optically aligned with a fifth edge coupler of the other PIC chip;
fabricating a sixth edge coupler on the substrate, the fifth sixth edge coupler being optically aligned with a seventh edge coupler of the other PIC chip;
transferring light from the fifth edge coupler of the other PIC chip to the fourth edge coupler of the PIC chip;
transferring light from the fourth edge coupler of the PIC chip to the sixth edge coupler of the PIC chip; and
transferring light from the sixth edge coupler of the PIC chip to the seventh edge coupler of the other PIC chip.
20 . The method for manufacturing PIC chips of claim 19 , wherein using the light provided from the testing probe apparatus to test one or more operational attributes of the optical components disposed on the other PIC chip comprises:
using light transferred from the sixth edge coupler of the PIC chip to the seventh edge coupler of the other PIC chip to test at least an operational attribute of the seventh edge coupler of the other PIC chip.
21 . The method for manufacturing PIC chips of claim 17 , further comprising, for each PIC chip among the multiple PIC chips of the PIC wafer:
fabricating a fourth edge coupler on the substrate, the fourth edge coupler being optically aligned with a fifth edge coupler of the other PIC chip;
fabricating a second optical coupler on the substrate;
transferring light from the fifth edge coupler of the other PIC chip to the fourth edge coupler of the PIC chip;
transferring light from the fourth edge coupler of the first PIC chip to the second optical coupler of the PIC chip; and
receiving, at the testing probe apparatus, light from the other PIC chip that is output by the second optical coupler of the PIC chip.
22 . The method for manufacturing PIC chips of claim 21 , further comprising:
using light from the second optical coupler of the PIC chip that is received by the testing probe apparatus to test at least an operational attribute of an optical component of the other PIC chip.
23 . The method for manufacturing PIC chips of claim 22 , wherein using light from the second optical coupler of the PIC chip that is received by the testing probe apparatus to test at least the operational attribute of the optical component of the other PIC chip comprises:
using light from the second optical coupler of the PIC chip that is received by the testing probe apparatus to test at least an operational attribute of the fifth edge coupler of the other PIC chip.
24 . The method for manufacturing PIC chips of claim 15 , further comprising:
performing die singulation for the PIC wafer to separate at least some of the PIC chips of the PIC wafer.
25 . The method for manufacturing PIC chips of claim 24 , further comprising:
packaging PIC chips separated from the PIC wafer in respective PIC packages.