Wafer test cassette, wafer test system and wafer test method
A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to each other by which a test space is defined. The first housing includes a probe card, and the second housing carries a wafer. When the first housing and the second housing are coupled, a probe is electrically in contact with a pad of the wafer. The first fluid port is disposed in the first housing or the second housing, and receives an external gas to the test space. After the test space receives the external gas, an air pressure value thereof is greater than an atmospheric pressure.
1 . A wafer test cassette, comprising:
a first housing including a first magnetic member;
a second housing including a second magnetic member, the second magnetic member being arranged corresponding to the first magnetic member so as to enable the first housing and the second housing to be tightly coupled to each other by which a test space is defined, a magnetic shielding assembly movably disposed in the second housing;
wherein the first housing includes a probe card including at least one probe, and the second housing is configured to carry a wafer; wherein, when the first housing and the second housing are coupled to each other, the at least one probe is configured to be in contact with at least one pad of the wafer;
a first fluid port disposed on the first housing or the second housing, and configured to receive an external gas to the test space; and
a gas supply device having a first fluid path connected to the first fluid port, the gas supply device being configured to supply the external gas to the test space through the first fluid path;
wherein after the test space receives the external gas, an air pressure value of the test space is greater than an atmospheric pressure outside the wafer test cassette;
wherein a shielding assembly includes a pair of recess that corresponds to the second magnetic member, wherein when the shielding assembly moves to cover the second magnetic member, the recess accommodates the second magnetic member.
2 . The wafer test cassette according to claim 1 , wherein the external gas includes an inert gas.
3 . The wafer test cassette according to claim 1 , wherein a magnetic attraction between the first magnetic member and the second magnetic member is determined according to the air pressure value of the test space.
4 . The wafer test cassette according to claim 3 , wherein one of the first magnetic member and the second magnetic member is a non-permanent magnet, the magnetic attraction between the first magnetic member and the second magnetic member increases with an increase of the air pressure value, such that a pin pressure caused by an electrical contact between the at least one probe and the at least one pad of the wafer is unchanged.
5 . The wafer test cassette according to claim 1 , further comprising a switching device disposed between the first fluid port and the gas supply device; wherein the switching device is configured to enable the external gas to enter the test space or release from the test space through the first fluid path.
6 . The wafer test cassette according to claim 5 , further comprising a second fluid port disposed on the first housing or the second housing and connected to the gas supply device; wherein the second fluid port is configured to enable the external gas to enter the test space or release from the test space.
7 . The wafer test cassette according to claim 6 , wherein the gas supply device has a second fluid path connected to the second fluid port.
8 . The wafer test cassette according to claim 6 , wherein each of the first fluid port and the second fluid port is configured to enable the external gas to enter the test space or release from the test space, or one of the first fluid port and the second fluid port is configured to enable the external gas to enter the test space and another of the first fluid port and the second fluid port is configured to enable the external gas to release from the test space.
9 . The wafer test cassette according to claim 1 , wherein after a test process is performed by applying the probe card of the wafer test cassette to test the wafer, the external gas is configured to be released, and the first housing and the second housing are released from a tightly coupled state.
10 . The wafer test cassette according to claim 1 , further comprising a seal member disposed between the first housing and the second housing and arranged around the test space.
11 . A wafer test system, comprising:
the wafer test cassette as claimed in claim 1 ;
a discharge transducer disposed at a side of the first housing or a side of the second housing, and configured to detect whether or not a corona discharge occurs on the at least one probe; and
a pressure transducer configured to detect the air pressure value of the test space.
12 . The wafer test system according to claim 11 , further comprising a control circuit correspondingly connected to the discharge transducer and the pressure transducer.
13 . A wafer test method, comprising:
a detection step of detecting an air pressure value of a test space in a wafer test cassette as claimed in claim 1 during a test process being performed;
a monitoring step of monitoring a probe in the wafer test cassette for a corona discharge; and
a control step of maintaining or increasing the air pressure value in the test space according to a result of the monitoring step.