Thermal management systems with acoustic isolation
Thermal management systems and associated methods are provided with acoustic isolation. An example system includes a computing device that defines a first housing supporting one or more processing units and a thermal management system. The thermal management system includes a pressure generation mechanism and one or more cooling conduits operably coupled with the pressure generation mechanism, and the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism. The pressure generation mechanism causes circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units, and the pressure generation mechanism is acoustically isolated from the computing device.
1 . A system comprising:
a computing device, wherein the computing device defines a first housing supporting one or more processing units and defining one or more engagement cages each positioned with a corresponding one of the one or more processing units; and
a thermal management system comprising:
a pressure generation mechanism; and
one or more cooling conduits operably coupled with the pressure generation mechanism, wherein the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism,
wherein the pressure generation mechanism is configured to cause circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units,
wherein the pressure generation mechanism is acoustically isolated from the computing device,
wherein the one or more engagement cages are defined at respective physical interfaces between the one or more cooling conduits and the first housing of the computing device and are configured to removably attach the one or more cooling conduits with the first housing of the computing device.
2 . The system of claim 1 , wherein the thermal management system further comprises a second housing configured to support at least the pressure generation mechanism.
3 . The system of claim 1 , wherein the pressure generation mechanism comprises an air compressor configured to cause air to be circulated via the one or more cooling conduits.
4 . The system of claim 3 , wherein the thermal management system further comprises a plenum assembly in fluid communication with the pressure generation mechanism and the one or more cooling conduits.
5 . The system of claim 1 , wherein the pressure generation mechanism comprises a pump configured to cause liquid to be circulated via the one or more cooling conduits.
6 . The system of claim 1 , wherein the one or more engagement cages are further configured to be removably attached with one or more fan assemblies at a physical interface between the one or more fan assemblies and the first housing of the computing device.
7 . The system of claim 1 , wherein the one or more engagement cages further comprise one or more locking mechanisms configured to removably attach the one or more cooling conduits with the one or more engagement cages.
8 . The system of claim 1 , wherein the one or more cooling conduits comprise a plurality of cooling conduits and wherein each of the plurality of cooling conduits is configured to be removably coupled with respective engagement cages of the first housing.
9 . The system of claim 1 , further comprising a controller operably coupled with the computing device and the thermal management system, the controller configured to modify operation of the pressure generation mechanism in response to one or more characteristics of the one or more processing units of the computing device.
10 . The system of claim 1 , wherein at least one of the one or more cooling conduits is configured to be removably attached with the one or more engagement cages in an absence of a fan assembly at the physical interface between the first housing and the at least one of the one or more cooling conduits.
11 . The system of claim 8 , wherein at least one of the plurality of cooling conduits is configured to be removably attached with one of the one or more engagement cages in an absence of a fan assembly at the physical interface between the first housing and the at least one of the one or more cooling conduits.
12 . The system of claim 8 , wherein each of the plurality of cooling conduits comprises physically separate hose assemblies.
13 . The system of claim 8 , wherein each of the plurality of cooling conduits is fluidically isolated from one another at the physical interface between each of the plurality of cooling conduits and the first housing.
14 . A thermal management system comprising:
a pressure generation mechanism; and
one or more cooling conduits operably coupled with the pressure generation mechanism,
wherein the one or more cooling conduits provide fluid communication between a computing device defining a first housing supporting one or more processing units and defining one or more engagement cages each positioned with a corresponding one of the one or more processing units and the pressure generation mechanism,
wherein the pressure generation mechanism is configured to cause circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units,
wherein the pressure generation mechanism is acoustically isolated from the computing device,
wherein the one or more engagement cages are defined at respective physical interfaces between the one or more cooling conduits and the first housing of the computing device and are configured to removably attach the one or more cooling conduits with the first housing of the computing device.
15 . The thermal management system of claim 14 , further comprising a second housing configured to support at least the pressure generation mechanism.
16 . The thermal management system of claim 14 , wherein the pressure generation mechanism comprises an air compressor configured to cause air to be circulated via the one or more cooling conduits.
17 . The thermal management system of claim 16 , further comprising a plenum assembly in fluid communication with the pressure generation mechanism and the one or more cooling conduits.
18 . The thermal management system of claim 14 , wherein the pressure generation mechanism comprises a pump configured to cause liquid to be circulated via the one or more cooling conduits.
19 . The thermal management system of claim 14 , wherein the one or more engagement cages are further configured to be removably attached with one or more fan assemblies at a physical interface between the one or more fan assemblies and the first housing of the computing device.
20 . The thermal management system of claim 14 , wherein, in operation, a sound level of an ambient environment proximate the computing device is less than approximately 85 decibels.