IP Library Granted Patent US 12,725,936
Granted Patent B2
US 12,725,936 · App. 18/841,290 · Granted Sep 1, 2026

Array antenna device

Inventor: Minoru Fujishima (Higashihiroshima, JP)
Assignee: HIROSHIMA UNIVERSITY
H01Q21/065H01Q3/42H03D7/165
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Quick Facts
Patent No.
US 12,725,936
App. No.
18/841,290
Granted
Sep 1, 2026
Kind
B2
Abstract

An array antenna device for use in a 300 GHz band includes a first layer in which antenna elements are arranged in a grid shape and a second layer stacked on the first layer. The second layer includes mixers that are arranged in grid regions overlapping the antenna elements in plan view, that each include an LO signal terminal, an IF signal terminal, and an RF signal terminal, with the RF signal terminals being electrically connected to the antenna elements. The second layer also includes LO signal lines provided to respective columns of the mixers. Each LO signal line is commonly connected to the LO signal terminal of the mixers of the same column. The second layer further includes IF signal lines provided to respective rows of the mixers. Each IF signal line is commonly connected to the IF signal terminal of the mixer of the same row.

Claims (26)

1 . An array antenna device, comprising:

a first layer in which a plurality of antenna elements is arranged in a grid pattern; and

a second layer stacked on the first layer, wherein the second layer includes:

a plurality of mixers disposed in a plurality of grid areas overlapping with the plurality of antenna elements in plan view, each mixer including an LO signal terminal, an IF signal terminal, and an RF signal terminal, the RF signal terminals being electrically connected to the plurality of antenna elements,

a plurality of LO signal lines provided for each column of the plurality of mixers, the LO signal terminals of the mixers in a same column being commonly connected to the LO signal lines, and

a plurality of IF signal lines provided for each row of the plurality of mixers, the IF signal terminals of the mixers in a same row being commonly connected to the IF signal lines,

wherein the second layer includes a plurality of phase shifters connected to at least one of the plurality of LO signal lines and the plurality of IF signal lines, and the plurality of phase shifters is disposed outside the plurality of grid areas.

2 . The array antenna device according to claim 1 , wherein the second layer includes a controller that controls signal phase adjustment by the phase shifters, and the controller is disposed outside the plurality of grid areas.

3 . The array antenna device according to claim 1 , wherein the plurality of phase shifters is connected in series.

4 . The array antenna device according to claim 3 , wherein the plurality of phase shifters is arranged at a same pitch as the plurality of mixers.

5 . The array antenna device according to claim 1 , wherein the plurality of LO signal lines is arranged in parallel at equal intervals.

6 . The array antenna device according to claim 1 , wherein the plurality of IF signal lines is arranged in parallel at equal intervals.

7 . The array antenna device according to claim 1 , wherein the first layer is a printed circuit board, and the second layer is a semiconductor substrate.

8 . The array antenna device according to claim 7 , wherein the semiconductor substrate is a compound semiconductor substrate or BiCMOS, and amplifiers are provided between the antenna elements and the mixers, the amplifiers being disposed in the grid regions.

9 . The array antenna device according to claim 7 , wherein the array antenna device is a transceiver integrated device.

10 . The array antenna device according to claim 9 , wherein the semiconductor substrate is a compound semiconductor substrate or BiCMOS, and amplifiers are provided between the antenna elements and the mixers, the amplifiers being disposed in the grid regions.

11 . An array antenna device, comprising:

a first layer in which a plurality of antenna elements is arranged in a grid pattern; and

a second layer stacked on the first layer, wherein the second layer includes:

a plurality of mixers disposed in a plurality of grid areas overlapping with the plurality of antenna elements in plan view, each mixer including an LO signal terminal, an IF signal terminal, and an RF signal terminal, the RF signal terminals being electrically connected to the plurality of antenna elements,

a plurality of LO signal lines provided for each column of the plurality of mixers, the LO signal terminals of the mixers in a same column being commonly connected to the LO signal lines, and

a plurality of IF signal lines provided for each row of the plurality of mixers, the IF signal terminals of the mixers in a same row being commonly connected to the IF signal lines, wherein:

the first layer is a printed circuit board,

the second layer is a photo-electronic substrate,

the mixers are Uni-Travelling Carrier Photodiodes, and

signals connected to the LO signal lines and the IF signal lines are optical signals.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2024
From: FUJISHIMA, MINORU
To: HIROSHIMA UNIVERSITY
Reel/Frame 068401/0803 →
Priority Claims (1)
JP 2022-026801 · Feb 24, 2022 · national
Continuity (1)
Related Publication 20250167458A1 · May 22, 2025
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