Submodule
The present disclosure relates to a submodule. An enclosure 20 may form the exterior of the submodule 10 of the present disclosure. A first opening 25 may be formed on one side surface 24 of the enclosure 20 . A heat sink 30 may be installed in the first opening 25 . The inner surface of the heat sink 30 faces the inside of the enclosure 20 , and the outer surface of the heat sink 30 may form one outer surface of the enclosure 20 . A heating element such as a power semiconductor 32 or a control board may be installed on the heat sink 30 . An inlet 34 and an outlet 36 may be provided at one side edge of the heat sink 30 to communicate with a flow path formed therein and allow cooling fluid to flow in and out.
1 . A submodule comprising:
an enclosure in which parts are installed, and an opening is formed on one outer surface thereof; and
a heat sink installed in the opening of the enclosure, having an inner surface inside the enclosure on which at least one of the parts is installed, and the other surface being outside the enclosure,
wherein a first terminal for electrical connection with an adjacent submodule is installed on a front plate of the enclosure, and a second terminal is provided on the heat sink, and
wherein the opening is formed on a bottom plate of the enclosure to install the heat sink.
2 . The submodule of claim 1 , wherein a flow path through which cooling fluid flows is formed inside the heat sink, and
wherein the flow path communicates with the outside through an inlet and an outlet installed at one side of the heat sink.
3 . A submodule comprising:
an enclosure having a hexahedral shape in which parts are installed therein and an opening is formed on one outer surface thereof; and
a heat sink installed in the opening of the enclosure, having an inner surface inside the enclosure on which at least one of the parts is installed and forming an outer surface of one side of the enclosure,
wherein a flow path through which cooling fluid flows is formed inside the heat sink, and the flow path communicates with the outside through an inlet and an outlet installed at one side of the heat sink,
wherein a first terminal for electrical connection with an adjacent submodule is positioned on a front plate of the enclosure, and a second terminal for electrical connection with an adjacent submodule is positioned on the heat sink, and
wherein the opening is formed in any one of a top plate, a side plate, and a bottom plate of the enclosure, and the heat sink is installed to cover the opening to form one outer surface of the enclosure.