IP Library Granted Patent US 12,726,094
Granted Patent B2
US 12,726,094 · App. 18/472,822 · Granted Sep 1, 2026

Method for manufacturing a wiring component

Inventors: Jun Umetsu (Tokyo, JP); Noriyuki Takahashi (Tokyo, JP)
Assignee: Proterial, Ltd.
H02K15/33H02K15/12
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Quick Facts
Patent No.
US 12,726,094
App. No.
18/472,822
Granted
Sep 1, 2026
Kind
B2
Abstract

A wiring component is provided with a plurality of electric wires, and a holding portion that batch holds respective portions of the plurality of electric wires. The holding portion includes a holder that supports the plurality of electric wires in a predetermined positional relationship, and a resin mold portion composed of resin molded to cover the holder and the respective portions of the plurality of electric wires. The holder includes a substrate portion and a plurality of wire-holding portions formed protruding from the substrate portion. The plurality of electric wires are supported by the plurality of wire-holding portions, respectively. A notch or a through-hole is formed in the substrate portion corresponding to a portion into which molten resin is injected when forming the resin mold portion.

Claims (10)

1 . A method for manufacturing a wiring component including a plurality of electric wires and a holding portion including a holder supporting the plurality of electric wires in a predetermined positional relationship and molded with resin covering respective portions of the plurality of electric wires, the method comprising:

a placement step for placing the plurality of electric wires and the holder in a cavity of a mold; and

a molding step for injecting molten resin into the cavity to perform the molding,

wherein the holder including a substrate portion and a plurality of wire-holding portions formed protruding from the substrate portion and formed with a notch or a through-hole in the substrate portion is used as the holder,

wherein the plurality of electric wires are supported by the plurality of wire-holding portions in the placement step, and the molten resin is injected toward a portion where the notch or the through-hole is formed in the molding step.

2 . The method, according to claim 1 , wherein a gate that serves as an entrance of the molten resin into the cavity and a flow path that guides the molten resin to the gate are formed in the mold, and wherein an extension in a direction of flow of the molten resin passing through a center of the gate does not intersect the substrate portion.

3 . The method, according to claim 2 , wherein the molten resin is injected into the cavity in the molding step from the gate in a direction perpendicular to the substrate portion and when viewed at the substrate portion from a gate side along the direction perpendicular to the substrate portion, a peripheral edge of a tip end of the gate does not intersect the substrate portion.

4 . The method, according to claim 3 , wherein the tip end of the gate is circular and the notch is formed in a partial circular shape with a diameter larger than a diameter of the tip end of the gate.

5 . The method, according to claim 1 , wherein some wires of the plurality of electric wires are placed on one face-side of the substrate portion, and wherein some other wires of the plurality of electric wires are placed on an other face-side of the substrate portion, and the molten resin flows from the one face-side to the other face-side through the notch or the through-hole in the molding step.

6 . The method, according claim 1 , wherein the plurality of electric wires are bent in a thickness direction of the substrate portion within the cavity, and wherein the notch is located at an end of the substrate portion on a side opposite to bending portions where the plurality of electric wires are bent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2023
From: UMETSU, JUN; TAKAHASHI, NORIYUKI
To: PROTERIAL, LTD.
Reel/Frame 065002/0612 →
Priority Claims (1)
JP 2022-157377 · Sep 30, 2022 · national
Continuity (1)
Related Publication 20240113602A1 · Apr 4, 2024
References Cited (5)
US 11705254B2 · Takahashi · 2023 [cited by examiner]
JP 2002075291A · 2002 [cited by applicant]
JP 2020011481A · 2020 [cited by applicant]
JP 2021141642A · 2021 [cited by examiner]
“Notice of Reasons for Refusal” Office Action issued in JP 2022-157377; mailed by the Japanese Patent Office on Feb. 3, 2026. [cited by applicant]