IP Library › Granted Patent US 12,726,178
Granted Patent B2
US 12,726,178 · App. 18/227,332 · Granted Sep 1, 2026

Acoustic wave device

Inventor: Takuro Okada (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/25H03H9/145
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,726,178
App. No.
18/227,332
Granted
Sep 1, 2026
Kind
B2
Abstract

An acoustic wave device includes a piezoelectric film directly or indirectly provided on a high acoustic-velocity material layer, a dielectric film on the piezoelectric film, and an IDT electrode on the dielectric film. The dielectric film is made of one of silicon oxide, silicon nitride, alumina, and amorphous silicon. When a wavelength determined based on an electrode finger pitch of the IDT electrode is denoted as λ, a duty of the IDT electrode is denoted as y, and a film thickness normalized by the wavelength λ of the dielectric film is denoted as x (%), x and y are in each range of Table 1, Table 2, Table 3, or Table 4 below depending on a material of the dielectric film.

Claims (91)

1 . An acoustic wave device comprising:

a high acoustic-velocity material layer made of a high acoustic-velocity material;

a piezoelectric film directly or indirectly provided on the high acoustic-velocity material layer; and

an IDT electrode on the piezoelectric film; wherein

the high acoustic-velocity material is a material in which an acoustic velocity of a bulk wave propagating therethrough is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric film;

the acoustic wave device further includes a dielectric film between the IDT electrode and the piezoelectric film; and

the dielectric film is made of one of silicon oxide, silicon nitride, alumina, and amorphous silicon, and when a wavelength determined based on an electrode finger pitch of the IDT electrode is denoted as λ, a duty of the IDT electrode is denoted as y, and a film thickness normalized by the wavelength λ of the dielectric film is denoted as x (%), the film thickness x of the dielectric film and the duty y of the IDT electrode are in a range of Table 1 below in a structure in which the dielectric film is made of silicon oxide, the film thickness x and the duty y are in a range of Table 2 below in a structure in which the dielectric film is made of silicon nitride, the film thickness x and the duty y are in a range of Table 3 below in a structure in which the dielectric film is made of alumina, and the film thickness x and the duty y are in a range of Table 4 below in a structure in which the dielectric film is made of amorphous silicon:

TABLE 1

When 0.2 ≤ x < 0.3, 0.5 < y ≤ 0.51

When 0.3 ≤ x < 0.4, 0.5 < y ≤ 0.54

When 0.4 ≤ x < 0.5, 0.5 < y ≤ 0.58

When 0.5 ≤ x < 0.6, 0.5 < y ≤ 0.61

When 0.6 ≤ x < 0.7, 0.5 < y ≤ 0.64

When 0.7 ≤ x < 0.8, 0.5 < y ≤ 0.66

When 0.8 ≤ x < 0.9, 0.5 < y ≤ 0.67

When 0.9 ≤ x < 1.0, 0.5 < y ≤ 0.69

When 1.0 ≤ x < 1.2, 0.5 < y ≤ 0.70

When 1.2 ≤ x < 1.3, 0.5 < y ≤ 0.71

When 1.3 ≤ x < 1.6, 0.5 < y ≤ 0.72

When 1.6 ≤ x < 2.0, 0.5 < y ≤ 0.73

When 2.0 ≤ x, 0.5 < y ≤ 0.74;

TABLE 2

When 0.4 ≤ x < 0.5, 0.5 < y ≤ 0.51

When 0.5 ≤ x < 0.6, 0.5 < y ≤ 0.53

When 0.6 ≤ x < 0.7, 0.5 < y ≤ 0.55

When 0.7 ≤ x < 0.8, 0.5 < y ≤ 0.57

When 0.8 ≤ x < 0.9, 0.5 < y ≤ 0.58

When 0.9 ≤ x < 1.0, 0.5 < y ≤ 0.59

When 1.0 ≤ x < 1.1, 0.5 < y ≤ 0.61

When 1.1 ≤ x < 1.2, 0.5 < y ≤ 0.62

When 1.2 ≤ x < 1.3, 0.5 < y ≤ 0.63

When 1.3 ≤ x < 1.5, 0.5 < y ≤ 0.64

When 1.5 ≤ x < 1.7, 0.5 < y ≤ 0.65

When 1.7 ≤ x < 2.0, 0.5 < y ≤ 0.66

When 2.0 ≤ x < 2.7, 0.5 < y ≤ 0.67

When 2.7 ≤ x, 0.5 < y ≤ 0.68;

TABLE 3

When 0.5 ≤ x < 0.6, 0.5 < y ≤ 0.52

When 0.6 ≤ x < 0.7, 0.5 < y ≤ 0.53

When 0.7 ≤ x < 0.8, 0.5 < y ≤ 0.54

When 0.8 ≤ x < 0.9, 0.5 < y ≤ 0.56

When 0.9 ≤ x < 1.0, 0.5 < y ≤ 0.57

When 1.0 ≤ x < 1.2, 0.5 < y ≤ 0.59

When 1.2 ≤ x < 1.3, 0.5 < y ≤ 0.60

When 1.3 ≤ x < 1.4, 0.5 < y ≤ 0.61

When 1.4 ≤ x < 1.5, 0.5 < y ≤ 0.62

When 1.5 ≤ x < 1.7, 0.5 < y ≤ 0.63

When 1.7 ≤ x < 2.0, 0.5 < y ≤ 0.64

When 2.0 ≤ x < 2.5, 0.5 < y ≤ 0.65

When 2.5 ≤ x, 0.5 < y ≤ 0.66;

 and

TABLE 4

When 0.5 ≤ x < 0.6, 0.5 < y ≤ 0.52

When 0.6 ≤ x < 0.7, 0.5 < y ≤ 0.53

When 0.7 ≤ x < 0.8, 0.5 < y ≤ 0.54

When 0.8 ≤ x < 0.9, 0.5 < y ≤ 0.56

When 0.9 ≤ x < 1.0, 0.5 < y ≤ 0.57

When 1.0 ≤ x < 1.1, 0.5 < y ≤ 0.58

When 1.1 ≤ x < 1.2, 0.5 < y ≤ 0.59

When 1.2 ≤ x < 1.3, 0.5 < y ≤ 0.60

When 1.3 ≤ x < 1.4, 0.5 < y ≤ 0.61

When 1.4 ≤ x < 1.5, 0.5 < y ≤ 0.62

When 1.5 ≤ x < 1.7, 0.5 < y ≤ 0.63

When 1.7 ≤ x < 2.0, 0.5 < y ≤ 0.64

When 2.0 ≤ x < 2.7, 0.5 < y ≤ 0.65

When 2.7 ≤ x, 0.5 < y ≤ 0.66.

2 . The acoustic wave device according to claim 1 , further comprising a support substrate laminated on a surface of the high acoustic-velocity material layer opposite to a surface on a piezoelectric film side of the high acoustic-velocity material layer.

3 . The acoustic wave device according to claim 2 , further comprising:

a low acoustic-velocity film laminated between the high acoustic-velocity material layer and the piezoelectric film and made of a low acoustic-velocity material; wherein

the low acoustic-velocity material is a material in which an acoustic velocity of a bulk wave propagating therethrough is lower than an acoustic velocity of a bulk wave propagating through the piezoelectric film.

4 . The acoustic wave device according to claim 3 , wherein the low acoustic-velocity material is made of silicon oxide.

5 . The acoustic wave device according to claim 2 , wherein the support substrate is made of the high acoustic-velocity material, and the support substrate and the high acoustic-velocity material layer are integrated with each other.

6 . The acoustic wave device according to claim 1 , wherein the support substrate is made of Si.

7 . The acoustic wave device according to claim 1 , wherein the high acoustic-velocity material is made of silicon nitride.

8 . The acoustic wave device according to claim 1 , wherein the piezoelectric film is made of lithium tantalate.

9 . An acoustic wave device comprising:

a high acoustic-velocity material layer made of a high acoustic-velocity material;

a piezoelectric film directly or indirectly on the high acoustic-velocity material layer; and

an IDT electrode on the piezoelectric film; wherein

the high acoustic-velocity material is a material in which an acoustic velocity of a bulk wave propagating therethrough is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric film;

the acoustic wave device further includes a dielectric film between the IDT electrode and the piezoelectric film; and

the dielectric film is made of one of silicon oxide, silicon nitride, alumina, and amorphous silicon, and when a wavelength determined based on an electrode finger pitch of the IDT electrode is denoted as λ, duty of the IDT electrode is denoted as y, and a film thickness normalized by the wavelength λ of the dielectric film is denoted as x (%), the duty y of the IDT electrode and the film thickness x of the dielectric film are within a hatched area in FIG. 4 when the dielectric film is made of silicon oxide, FIG. 5 when the dielectric film is made of silicon nitride, FIG. 6 when the dielectric film is made of alumina, and FIG. 7 when the dielectric film is made of amorphous silicon.

10 . The acoustic wave device according to claim 9 , further comprising a support substrate laminated on a surface of the high acoustic-velocity material layer opposite to a surface on a piezoelectric film side of the high acoustic-velocity material layer.

11 . The acoustic wave device according to claim 10 , further comprising:

a low acoustic-velocity film laminated between the high acoustic-velocity material layer and the piezoelectric film and made of a low acoustic-velocity material; wherein

the low acoustic-velocity material is a material in which an acoustic velocity of a bulk wave propagating therethrough is lower than an acoustic velocity of a bulk wave propagating through the piezoelectric film.

12 . The acoustic wave device according to claim 11 , wherein the low acoustic-velocity material is made of silicon oxide.

13 . The acoustic wave device according to claim 10 , wherein the support substrate is made of the high acoustic-velocity material, and the support substrate and the high acoustic-velocity material layer are integrated with each other.

14 . The acoustic wave device according to claim 9 , wherein the support substrate is made of Si.

15 . The acoustic wave device according to claim 9 , wherein the high acoustic-velocity material is made of silicon nitride.

16 . The acoustic wave device according to claim 9 , wherein the piezoelectric film is made of lithium tantalate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2023
From: OKADA, TAKURO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 064414/0046 →
Priority Claims (1)
JP 2021-069675 · Apr 16, 2021 · national
Continuity (2)
Continuation PCTJP2022017510 · Apr 11, 2022
Related Publication 20230370049A1 · Nov 16, 2023
References Cited (47)
US 10886896B2 · Yamane · 2021 [cited by examiner]
US 11496226B2 · Nakagawa · 2022 [cited by examiner]
US 11588469B2 · Daimon · 2023 [cited by examiner]
US 12021500B2 · Daimon · 2024 [cited by examiner]
US 12088273B2 · Iwamoto · 2024 [cited by examiner]
US 12113509B2 · Nagatomo · 2024 [cited by examiner]
US 12149223B2 · Taniguchi · 2024 [cited by examiner]
US 12191839B2 · Iwamoto · 2025 [cited by examiner]
US 12424997B2 · Daimon · 2025 [cited by examiner]
US 12512809B2 · Iwamoto · 2025 [cited by examiner]
US 20120187799A1 · Nakahashi · 2012 [cited by examiner]
US 20180159497A1 · Iwamoto · 2018 [cited by examiner]
US 20190363697A1 · Yamane · 2019 [cited by applicant]
US 20200328728A1 · Nakagawa et al. · 2020 [cited by applicant]
US 20200328823A1 · Nakagawa et al. · 2020 [cited by applicant]
US 20200403603A1 · Daimon · 2020 [cited by examiner]
US 20220014175A1 · Nagatomo · 2022 [cited by examiner]
US 20220123711A1 · Taniguchi · 2022 [cited by examiner]
US 20220224311A1 · Daimon · 2022 [cited by examiner]
US 20220368305A1 · Iwamoto · 2022 [cited by examiner]
US 20220407493A1 · Iwamoto · 2022 [cited by examiner]
US 20230143523A1 · Miyamoto · 2023 [cited by examiner]
US 20230198500A1 · Okada · 2023 [cited by examiner]
US 20230208391A1 · Daimon · 2023 [cited by examiner]
US 20230261638A1 · Daimon · 2023 [cited by examiner]
US 20230353120A1 · Daimon · 2023 [cited by examiner]
US 20230370049A1 · Okada · 2023 [cited by examiner]
US 20230378932A1 · Okada · 2023 [cited by examiner]
US 20240243728A1 · Okada · 2024 [cited by examiner]
US 20240356522A1 · Ito · 2024 [cited by examiner]
US 20240396524A1 · Nakagawa · 2024 [cited by examiner]
US 20240396525A1 · Nakagawa · 2024 [cited by examiner]
US 20250096777A1 · Noguchi · 2025 [cited by examiner]
US 20250192753A1 · Kimura · 2025 [cited by examiner]
US 20250337385A1 · Iwamoto · 2025 [cited by examiner]
US 20260031789A1 · Yanagitani · 2026 [cited by examiner]
CN 114830533A · 2022 [cited by examiner]
CN 117917005A · 2024 [cited by examiner]
JP 2015119258A · 2015 [cited by applicant]
JP 7231015B2 · 2023 [cited by examiner]
WO 2018146883A1 · 2018 [cited by applicant]
WO 2019138810A1 · 2019 [cited by applicant]
WO 2019138812A1 · 2019 [cited by applicant]
WO WO2022173038A1 · 2022 [cited by examiner]
WO WO2023033032A1 · 2023 [cited by examiner]
International Search Report in PCT/JP2022/017510, mailed Jul. 5, 2022, 3 pages. [cited by applicant]
Written Opinion in PCT/JP2022/017510, mailed Jul. 5, 2022, 3 pages. [cited by applicant]