Package with solder mask
An electronic device package may include a solder mask that is positioned to mitigate leakage of resin or other adhesive material from the region of a die and die bond pad onto other surfaces of the package, such as surfaces of wire bond pads. One or more wire bond pads of the package may be formed from the same conductive layer as the die bond pad, and the solder mask may be positioned over a portions of the conductive layer located directly between such wire bond pads and the die bond pad. The solder mask may include portions disposed at one or more sides of the die bond pad. The solder mask may be formed over the package substrate prior to attachment of the die to the die bond pad.
1 . An electronic device package comprising:
a package substrate;
a metal layer disposed on the package substrate, the metal layer comprising:
a die bond pad;
at least one wire bond pad; and
a metal region connected between the die bond pad and the at least one wire bond pad; and
a solder mask disposed over the package substrate, wherein a first portion of the solder mask is disposed directly on the metal region of the metal layer.
2 . The electronic device package of claim 1 , further comprising adhesive material disposed on the die bond pad, wherein the solder mask is positioned to mitigate leakage of the adhesive material from the die bond pad onto the at least one wire bond pad.
3 . The electronic device package of claim 2 , wherein the adhesive material comprises electrically conductive epoxy.
4 . The electronic device package of claim 2 , further comprising:
a die attached to the die bond pad via the adhesive material; and
a wire bond coupled between the at least one wire bond pad and at least one corresponding wire bond pad disposed on the die, wherein the wire bond overlaps the first portion of the solder mask.
5 . The electronic device package of claim 1 , wherein the first portion of the solder mask is disposed between a first surface of the die bond pad and a second surface of the at least one wire bond pad.
6 . The electronic device package of claim 1 , wherein the first portion of the solder mask has a width of between 0.1 mm and 0.2 mm.
7 . The electronic device package of claim 1 , wherein the solder mask comprises non-electrically-conductive epoxy material.
8 . A package comprising:
a package substrate;
a metal layer formed on the package substrate, wherein the metal layer includes:
a die bond pad disposed on the package substrate;
at least one wire bond pad disposed on the package substrate and coupled to the die bond pad; and
a metal region that electrically connects the die bond pad to the at least one wire bond pad; and
a solder mask having a first portion disposed between a first surface of the die bond pad and a second surface of the at least one wire bond pad, wherein the solder mask is positioned to block leakage of adhesive material from the first surface of die bond pad to the second surface of the at least one wire bond pad, and the first portion of the solder mask is disposed directly on a top surface of the metal region.
9 . The package of claim 8 , wherein the adhesive material comprises electrically conductive silver epoxy.
10 . The package of claim 8 , wherein the first portion of the solder mask has a width of between 0.1 mm and 0.2 mm.
11 . The package of claim 8 , further comprising a die that is attached to the die bond pad via the adhesive material.
12 . The package of claim 11 , further comprising at least one wire bond that connects the at least one wire bond pad to at least one corresponding wire bond pad on the die.
13 . The package of claim 8 , wherein the solder mask comprises non-electrically-conductive epoxy material.