IP Library › Granted Patent US 12,730,414
Granted Patent B2
US 12,730,414 · App. 18/462,807 · Granted Sep 8, 2026

Electronic device with side frame serving as an antenna and heat dissipation member

Inventors: Hunyoung Ryu (Suwon-si, KR); Kijung Kim (Suwon-si, KR); Jonggwang Jang (Suwon-si, KR); Dasol Jun (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G04G17/04G04G17/02G04G17/08G04G19/00H01Q1/273H01Q1/44H05K7/2039
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Quick Facts
Patent No.
US 12,730,414
App. No.
18/462,807
Granted
Sep 8, 2026
Kind
B2
Abstract

In various embodiments, an electronic device may comprise: a housing including a front plate, a rear plate opposite to the front plate, and a side frame surrounding the space between the front plate and the rear plate; and a printed circuit board disposed in the space and having a front end module (FEM) and a heating element comprising a thermally conductive material mounted thereon, wherein the side frame is segmented into at least a first metal portion and a second metal portion, a segmentation member comprising a non-conductive material is disposed between the first metal portion and the second metal portion, and the first metal portion is electrically connected to the front end module, and the second metal portion is connected to the heating element by heat transfer members comprising a thermal interface material.

Claims (44)

1 . An electronic device, comprising:

a housing comprising a front plate, a rear plate facing an opposite direction to the front plate, and a side frame surrounding a space between the front plate and the rear plate;

a printed circuit board (PCB) disposed in the space and comprising a front-end module (FEM) and a heating element comprising a thermally conductive material mounted thereon,

wherein the side frame is segmented into at least a first metal portion and a second metal portion, wherein, between the first metal portion and the second metal portion, a segmentation member comprising a non-conductive material is disposed, and

wherein the first metal portion is electrically connected to the FEM, and the second metal portion is connected to the heating element through a heat transfer structure and first and second heat transfer members each comprising a thermal interface material;

a battery disposed behind the PCB in the space; and

the heat transfer structure comprising a thermal interface material and comprising a front portion disposed on a front surface of the battery and connected to the heating element, and a side portion extending from the front portion along a side surface of the battery and connected to the second metal portion,

wherein the first heat transfer member is disposed between the heating element and the front portion, and the second heat transfer member is disposed between the side portion and the second metal portion.

2 . The electronic device of claim 1 , wherein the first metal portion and the second metal portion segment the side frame in a front-back direction.

3 . The electronic device of claim 2 , wherein the first metal portion is disposed before the second metal portion.

4 . The electronic device of claim 2 , wherein a volume of the second metal portion is greater than a volume of the first metal portion.

5 . The electronic device of claim 1 , wherein the first metal portion and the second metal portion segment the side frame in a circumferential direction.

6 . The electronic device of claim 5 , wherein a circumferential length of the second metal portion is greater than a circumferential length of the first metal portion.

7 . The electronic device of claim 1 , wherein the first metal portion and the second metal portion segment the side frame in an inward-outward direction and in a front-back direction.

8 . The electronic device of claim 7 , wherein the second metal portion comprises an inner portion disposed further inward than the first metal portion and an outer portion extending outward from at least a part of the inner portion and exposed to the outside.

9 . The electronic device of claim 1 , further comprising:

a wireless charging coil disposed behind the battery in the space,

wherein the heat transfer structure further comprises a rear portion extending from the side portion along a rear surface of the battery and connected to the wireless charging coil.

10 . The electronic device of claim 1 , further comprising:

a shield can surrounding the heating element mounted on the PCB,

wherein the heat transfer member is disposed between the heating element and the shield can.

11 . The electronic device of claim 1 , wherein the segmentation member comprises an insulating material or a non-conductive material.

12 . The electronic device of claim 1 , wherein the heating element is at least one of a power amplifier module (PAM) comprising a power amplifier, a power unit comprising power circuitry, an application processor (AP), or a communication processor (CP).

13 . An electronic device, comprising:

a housing comprising a front plate, a rear plate facing an opposite direction to the front plate, and a side frame surrounding a space between the front plate and the rear plate;

a printed circuit board (PCB) disposed in the space and comprising a front-end module FEM) and a heating element comprising a thermally conductive material mounted thereon,

wherein the side frame is electrically connected to the FEM in a first portion and connected to the heating element through a heat transfer structure and first and second heat transfer members each comprising a thermal interface material in a second portion;

a battery disposed behind the PCB; and

the heat transfer structure comprising a front portion disposed on a front surface of the battery and connected to the heating element, and a side portion extending from the front portion along a side surface of the battery and connected to the second portion of the side frame,

wherein the first heat transfer member is disposed between the heating element and the front portion, and the second heat transfer member is disposed between the side portion and the second portion of the side frame.

14 . The electronic device of claim 13 , wherein the FEM is electrically connected to the first portion of the side frame through a connecting member comprising a conductive material,

the heating element is connected to the second portion of the side frame through the heat transfer structure and the first and second heat transfer members, and

the connecting member is disposed to have elasticity in an inward-outward direction, and at least one of the first and second heat transfer members are disposed to have elasticity in a front-back direction.

15 . The electronic device of claim 13 , wherein at least a portion of an area near the side frame of the PCB comprises a fill-cut area in which a metal layer is not formed, or at least one of the first and second heat transfer members comprises a non-conductive material.

16 . The electronic device of claim 13 , wherein the side frame is integrally formed.

17 . An electronic device, comprising:

a housing comprising a front plate, a rear plate facing an opposite direction to the front plate, and a side frame surrounding a space between the front plate and the rear plate;

a printed circuit board (PCB) disposed in the space and comprising a front-end module (FEM) and a heating element comprising a thermally conductive material mounted thereon,

wherein the side frame is segmented into at least a first metal portion and a second metal portion in a front-back direction, wherein, between the first metal portion and the second metal portion, a segmentation member comprising a non-conductive material is disposed,

wherein the first metal portion is disposed before the second metal portion and is electrically connected to the FEM and configured to function as an antenna, and

the second metal portion has a greater volume than a volume of the first metal portion and is connected to the heating element through a heat transfer structure and first and second heat transfer members each comprising a thermal interface material, the second metal portion being configured to function as a heat sink;

a battery disposed behind the PCB; and

the heat transfer structure comprising a front portion disposed on a front surface of the battery and connected to the heating element, and a side portion extending from the front portion along a side surface of the battery and connected to the second metal portion,

wherein the first heat transfer member is disposed between the heating element and the front portion, and the second heat transfer member is disposed between the side portion and the second metal portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2023
From: RYU, HUNYOUNG; KIM, KIJUNG; JANG, JONGGWANG; JUN, DASOL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064830/0211 →
Priority Claims (1)
KR 10-2021-0065214 · May 21, 2021 · national
Continuity (2)
Continuation PCTKR2022004036 · Mar 23, 2022
Related Publication 20230418240A1 · Dec 28, 2023
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