Surface emitting laser device
The present technology provides a surface emitting laser device capable of reducing resistance. The present technology provides a surface emitting laser device including: a first wiring group including a plurality of first wiring lines insulated from each other; a second wiring group including a plurality of second wiring lines insulated from each other; a first board provided with a plurality of light emitting units electrically connected to any one of the plurality of first wiring lines and electrically connected to any one of the plurality of second wiring lines; and a second board disposed to face the first board and provided with the first wiring group and/or the second wiring group.
1 . A surface emitting laser device, comprising:
a first wiring group including a plurality of first wiring lines insulated from each other;
a second wiring group including a plurality of second wiring lines insulated from each other;
a first board including a plurality of light emitting units electrically connected to one of the plurality of first wiring lines and electrically connected to one of the plurality of second wiring lines; and
a second board that faces the first board and includes at least one of the first wiring group or the second wiring group, wherein
each of the plurality of light emitting units is joined to a corresponding wiring line of a wiring group provided on the second board among the first wiring group and the second wiring group,
each of the plurality of light emitting units has a mesa protruding toward the second board,
a first electrode provided at a top portion of the mesa of each light emitting unit among the plurality of light emitting units is joined via a first bump to a corresponding first wiring line of the plurality of first wiring lines,
a second electrode provided in a peripheral portion of each light emitting unit among the plurality of light emitting units on the first board is joined via a second bump to a corresponding second wiring line of the plurality of second wiring lines, and
each of the plurality of second wiring lines includes:
a first portion provided along the first board; and
a second portion provided along a pedestal portion on the first board, wherein the second portion of each of the plurality of second wiring lines is joined via the second bump to the corresponding wiring line provided on the second board.
2 . The surface emitting laser device according to claim 1 , further comprising a conductor disposed along at least a part of the first wiring group or the second wiring group and insulated from both the first wiring group and the second wiring group.
3 . The surface emitting laser device according to claim 2 , wherein the conductor is on at least one of the first board or the second board.
4 . The surface emitting laser device according to claim 2 , wherein the conductor is connected to a reference potential.
5 . The surface emitting laser device according to claim 2 , wherein the conductor is one of metal or an alloy.
6 . The surface emitting laser device according to claim 2 , wherein the conductor is a semiconductor containing impurities.
7 . The surface emitting laser device according to claim 2 , further comprising:
a third wiring line on the second board and insulated from both the first wiring group and the second wiring group, wherein
the conductor is on the first board, and
the conductor and the third wiring line are joined via a third bump.
8 . The surface emitting laser device according to claim 7 , wherein the third wiring line is along at least a part of the first wiring group or the second wiring group.
9 . The surface emitting laser device according to claim 1 , further comprising:
a third wiring line on at least one of the first board or the second board and insulated from both the first wiring group and the second wiring group, wherein
the third wiring line is along at least a part of the first wiring group or the second wiring group.
10 . The surface emitting laser device according to claim 1 , wherein a total of a number of the plurality of first wiring lines and a number of the plurality of second wiring lines is less than twice a number of the plurality of light emitting units.
11 . The surface emitting laser device according to claim 1 , wherein each of the plurality of light emitting units includes a layered structure in which a first multilayer film reflector, an active layer, and a second multilayer film reflector are layered in this order on the first board.
12 . The surface emitting laser device according to claim 1 , wherein both the first wiring group and the second wiring group are connected to an electronic circuit.
13 . The surface emitting laser device according to claim 1 , wherein
the second board contains an insulating material,
an electronic circuit is on the second board or in the second board, and
the first wiring group and the second wiring group are connected to the electronic circuit.
14 . The surface emitting laser device according to claim 13 , further comprising a conductor that is disposed along at least a part of the first wiring group or the second wiring group and insulated from both the first wiring group and the second wiring group.