Electronics packaging for moving platforms
In accordance with at least one aspect of this disclosure, a system includes one or more electronics boards and one or more plates configured to interleave the one or more electronics boards in a stack along an axis. When in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of a moving platform. Each of the one or more plates includes an inner diameter and an outer diameter, where the outer surface has an outer circumference at the outer diameter.
1 . A system, comprising:
one or more electronics boards; and
one or more plates configured to interleave the one or more electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the one or more electronic boards;
wherein, in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of an exterior surface of a moving platform, and
wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates.
2 . The system according to claim 1 , wherein each of the one or more plates includes an inner diameter.
3 . The system according to claim 2 , wherein the outer surface of the one or more plates is configured to be machined to alter a profile of the outer mold line without changing a profile of the inner diameter of the one or more plates.
4 . The system according to claim 2 , wherein the one or more plates are formed from a thermally conductive material.
5 . The system according to claim 4 , wherein the one or more plates are configured to dissipate heat from the one or more electronics boards at a center of the one or more plates radially outward towards the outer surface of the one or more plates and to an ambient atmosphere.
6 . The system according to claim 4 , wherein the one or more plates are configured to thermally conduct heat from the one or more electronics boards at a center of the one or more plates radially outward towards the outer diameter of the one or more plates to store heat in the outer circumference of the outer surface.
7 . The system according to claim 2 , wherein each of the one or more plates includes at least one keyway and at least one key defining the inner diameter and the outer diameter, each keyway configured to accept a respective key of a joining plate of the one or more plates in the stack.
8 . The system according to claim 7 , wherein, in the stack, the at least one keyway and the at least one key are configured to prevent rotation of the one or more plates about the axis.
9 . The system according to claim 7 , wherein, in the stack, the one or more electronics boards are seated within the inner diameter of the one or more plates such that multiple keys enclose the one or more electronics boards.
10 . The system according to claim 9 , wherein, in the stack, the one or more electronics boards are shielded from external impacts.
11 . The system according to claim 9 , wherein, in the stack, the majority of the face of each of the one or more electronics boards seats against the face of a respective plate of the one or more plates to prevent bending of the one or more electronics boards during acceleration of the moving platform.
12 . The system according to claim 11 , wherein each of the one or more plates further includes one or more vias defined therethrough, the one or more vias configured to allow communication between the one or more electronics boards through the one or more plates.
13 . The system according to claim 1 , further comprising the moving platform, wherein, in the stack, the one or more plates are configured to form at least a portion of an exterior surface of a nose of the moving platform.
14 . The system according to claim 13 , wherein the moving platform includes a guided munition.
15 . The system according to claim 14 , wherein the one or more electronics boards form at least a portion of a sensor package of a seeker.
16 . A system, comprising:
multiple electronics boards; and
multiple plates configured to interleave the electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the multiple electronic boards;
wherein, in the stack, outer surfaces of the plates form an outer mold line of a portion of an exterior surface of a movable platform; and
wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates.
17 . The system according to claim 16 , wherein each of the plates includes an inner diameter.
18 . The system according to claim 16 , wherein the plates are configured to dissipate heat from the electronics boards radially outward.
19 . The system according to claim 16 , wherein:
each of the plates includes at least one keyway and at least one key; and
for each plate, the at least one keyway is configured to accept the at least one key of an adjacent one of the plates in the stack.
20 . The system according to claim 16 , wherein the plates further include vias configured to allow communication between the electronics boards through the plates.