IP Library › Granted Patent US 12,733,138
Granted Patent B2
US 12,733,138 · App. 18/166,494 · Granted Sep 8, 2026

Heat dissipation housing for AC power adapter

Inventors: Wenshuai Wang (Shanghai, CN); Xiaojun Chen (Shanghai, CN)
Assignee: Delta Electronics (Shanghai) Co., Ltd.
H05K7/209H05K7/20436
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Quick Facts
Patent No.
US 12,733,138
App. No.
18/166,494
Granted
Sep 8, 2026
Kind
B2
Abstract

The present disclosure provides a heat dissipation housing for an AC power adapter, including a housing and a heat sink disposed on an inner surface of the housing, and integrally formed with the housing. The heat sink includes an upper surface which is in close contact with the housing, and a lower surface which is exposed to the inside of the heat dissipation housing. The heat sink includes at least one securing structure which is formed by the upper surface of the heat sink.

Claims (23)

1 . An AC power adapter, comprising:

a heat dissipation housing, comprising:

a housing; and

a heat sink disposed on an inner surface of the housing, and integrally formed with the housing; and

an inner heat sink,

wherein the heat sink comprises an upper surface which is in contact with the housing, and a lower surface which is exposed to an inside of the heat dissipation housing,

wherein the heat sink comprises at least one securing structure which is formed by the upper surface of the heat sink,

wherein the heat sink is embedded into at least a portion of the inner surface of the housing,

wherein the entire heat sink is disposed inside the housing,

wherein the housing is made of plastic,

wherein the heat sink is integrally formed with the housing by injection molding,

wherein the inner heat sink has a tubular shape, and is integrally formed or formed by buckling two U-shaped heat sinks, and

wherein one or more surfaces of the inner heat sink is in direct contact with the lower surface of the heat sink of the heat dissipation housing.

2 . The AC power adapter according to claim 1 , wherein the at least one securing structure is formed in a barb structure.

3 . The AC power adapter according to claim 2 , wherein the barb structure comprises at least one of a T-shaped structure, an inverted trapezoidal structure, or a rod-shaped structure at a certain angle to a surface of the heat sink.

4 . The AC power adapter according to claim 1 , wherein the heat sink is disposed on all or part of the inner surface of the housing.

5 . The AC power adapter according to claim 1 , wherein the heat sink has a tubular shape.

6 . The AC power adapter according to claim 1 , wherein the heat sink is made of copper or aluminum.

7 . The AC power adapter according to claim 1 , further comprising:

a power supply assembly disposed inside a cavity formed by the heat dissipation housing, and comprising a circuit board and an electronic element arranged on the circuit board, and

wherein the inner heat sink disposed on a periphery of the power supply assembly and secured to the power supply assembly.

8 . The AC power adapter according to claim 7 , wherein the inner heat sink comprises one or more inner heat sinks, each being disposed corresponding to a surface of the power supply assembly.

9 . The AC power adapter according to claim 7 , wherein an insulating part is disposed between the inner heat sink and the power supply assembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2023
From: WANG, WENSHUAI; CHEN, XIAOJUN
To: DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
Reel/Frame 062647/0268 →
Priority Claims (1)
CN 202210420003.5 · Apr 20, 2022 · national
Continuity (1)
Related Publication 20230345679A1 · Oct 26, 2023
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