IP Library › Granted Patent US 12,733,325
Granted Patent B2
US 12,733,325 · App. 18/100,153 · Granted Sep 8, 2026

Display device

Inventors: Kwangjae Lee (Suwon-si, KR); Sungsoo Jung (Suwon-si, KR); Pilyong Oh (Suwon-si, KR); Jeongin Han (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H10H20/8583B32B7/022B32B7/027B32B7/12B32B15/04B32B17/06H05K7/20963H10W90/00B32B5/18B32B15/20B32B27/06B32B27/40B32B2457/20
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,733,325
App. No.
18/100,153
Granted
Sep 8, 2026
Kind
B2
Abstract

A display device a plurality of display modules, each of the plurality of display modules including: a substrate having a mounting surface and a rear surface opposite the mounting surface; a plurality of inorganic light emitting diodes provided on the mounting surface of the substrate; and a frame supporting the plurality of display modules arranged in a matrix, the frame including: a first frame layer contacting the plurality of display modules and including a material having material properties similar to material properties of the substrate; a second frame layer provided behind the first frame layer, and including a metal material; and a third frame layer provided between the first frame layer and the second frame layer and bonding the first frame layer and the second frame layer.

Claims (34)

1 . A display device comprising:

a plurality of display modules, each of the plurality of display modules comprising:

a substrate having a mounting surface and a rear surface opposite the mounting surface;

a plurality of inorganic light emitting diodes provided on the mounting surface of the substrate; and

a frame supporting the plurality of display modules arranged in a matrix, the frame comprising:

a first frame layer contacting the plurality of display modules and comprising a material having a thermal expansion coefficient corresponding to a thermal expansion coefficient of a material of the substrate;

a second frame layer provided behind the first frame layer, and comprising a metal material; and

a third frame layer provided between the first frame layer and the second frame layer and bonding the first frame layer and the second frame layer.

2 . The display device of claim 1 , wherein the substrate and the first frame layer comprise the same material.

3 . The display device of claim 1 , wherein a ductility of the third frame layer is greater than a ductility of the first frame layer and a ductility of the second frame layer.

4 . The display device of claim 3 , wherein a coefficient of thermal expansion of the first frame layer is less than a coefficient of thermal expansion of the second frame layer.

5 . The display device of claim 1 , wherein the third frame layer comprises:

a first adhesive layer bonded to the first frame layer;

a second adhesive layer bonded to the second frame layer; and

a high ductility layer provided between the first adhesive layer and the second adhesive layer, and varying in thickness in a direction in which the mounting surface faces.

6 . The display device of claim 1 , wherein a thickness of the first frame layer in a direction in which the mounting surface faces is less than a thickness of the second frame layer in the direction in which the mounting surface faces.

7 . The display device of claim 1 , wherein each of the plurality of display modules further comprises:

a metal plate configured to dissipate heat generated from the substrate and facing the rear surface of the substrate; and

an adhesive member bonding the plurality of display modules to the first frame layer.

8 . The display device of claim 7 , wherein each of the plurality of display modules further comprises an adhesive layer provided between the rear surface of the substrate and the metal plate to bond the rear surface of the substrate and the metal plate, and

wherein a ductility of the adhesive layer is greater than a ductility of the substrate and the metal plate.

9 . The display device of claim 7 , wherein the adhesive member is provided on the metal plate to bond the metal plate to the first frame layer.

10 . The display device of claim 7 , wherein the adhesive member is provided on the rear surface of the substrate to bond the substrate to the first frame layer.

11 . A display device comprising:

a plurality of display modules, each of the plurality of display modules comprising:

a substrate comprising a glass material and having a mounting surface; and

a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate; and

a frame supporting the plurality of display modules arranged in a matrix, the frame comprising a glass layer to which the plurality of display modules is bonded.

12 . The display device of claim 11 , wherein the frame further comprises:

a support layer provided behind the glass layer and supporting the glass layer; and

an adhesive layer provided between the glass layer and the support layer and bonding the glass layer and the support layer.

13 . The display device of claim 12 , wherein a coefficient of thermal expansion of the glass layer is less than a coefficient of thermal expansion of the support layer.

14 . The display device of claim 13 , wherein the support layer comprises a metal material.

15 . The display device of claim 12 , wherein a ductility of the adhesive layer is greater than a ductility of the glass layer and a ductility of the support layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2023
From: LEE, KWANGJAE; JUNG, SUNGSOO; OH, PILYONG; HAN, JEONGIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 062453/0263 →
Priority Claims (1)
KR 10-2020-0097125 · Aug 4, 2020 · national
Continuity (2)
Continuation PCTKR2021008744 · Jul 8, 2021
Related Publication 20230155100A1 · May 18, 2023
References Cited (49)
US 6913502B2 · Park et al. · 2005 [cited by applicant]
US 7742120B2 · Bayley et al. · 2010 [cited by applicant]
US 8240857B2 · Hemphill et al. · 2012 [cited by applicant]
US 9378671B2 · Kline et al. · 2016 [cited by applicant]
US 9414503B2 · Lee et al. · 2016 [cited by applicant]
US 10429684B2 · Naas et al. · 2019 [cited by applicant]
US 10651159B2 · Adema et al. · 2020 [cited by applicant]
US 10978626B2 · Park et al. · 2021 [cited by applicant]
US 11282820B2 · Takeya et al. · 2022 [cited by applicant]
US 11495560B2 · Prevatte et al. · 2022 [cited by applicant]
US 20070132778A1 · Gallen et al. · 2007 [cited by applicant]
US 20120236509A1 · Cope · 2012 [cited by examiner]
US 20120273808A1 · Kim et al. · 2012 [cited by applicant]
US 20170178892A1 · Sato · 2017 [cited by applicant]
US 20170307922A1 · Naas et al. · 2017 [cited by applicant]
US 20180017993A1 · Brooks · 2018 [cited by applicant]
US 20210043812A1 · Oh et al. · 2021 [cited by applicant]
US 20210183837A1 · Shin et al. · 2021 [cited by applicant]
JP 7146516A · 1995 [cited by applicant]
JP 8329861A · 1996 [cited by applicant]
JP 2005524876A · 2005 [cited by applicant]
JP 4145472B2 · 2008 [cited by applicant]
JP 4465862B2 · 2010 [cited by applicant]
JP 5300034B2 · 2013 [cited by applicant]
JP 5419577B2 · 2014 [cited by applicant]
JP 2014112220A · 2014 [cited by applicant]
JP 2017112220A · 2017 [cited by applicant]
JP 2020030409A · 2020 [cited by applicant]
KR 1020070028297A · 2007 [cited by applicant]
KR 100934636B1 · 2009 [cited by applicant]
KR 1020140035738A · 2014 [cited by applicant]
KR 1020170020485A · 2017 [cited by applicant]
KR 1020170093781A · 2017 [cited by applicant]
KR 101789126B1 · 2017 [cited by applicant]
KR 101846609B1 · 2018 [cited by applicant]
KR 1020180095224A · 2018 [cited by applicant]
KR 1020190026617A · 2019 [cited by applicant]
KR 1020190083173A · 2019 [cited by applicant]
KR 1020190143085A · 2019 [cited by applicant]
KR 1020200004688A · 2020 [cited by applicant]
KR 1020200021399A · 2020 [cited by applicant]
KR 1020210017519A · 2021 [cited by applicant]
KR 1020210075820A · 2021 [cited by applicant]
KR 1020210131769A · 2021 [cited by applicant]
WO WO2005054935A2 · 2005 [cited by examiner]
Interview Agenda (Year: 2026). [cited by examiner]
Communication dated Jul. 28, 2025 issued by the Korean Intellectual Property Office in Korean Patent Application No. 10-2020-0097125. [cited by applicant]
International Search Report (ISA/210) issued Oct. 27, 2021 by the International Searching Authority in International Application No. PCT/KR2021/008744. [cited by applicant]
Written Opinion (ISA/237) issued Oct. 27, 2021 by the International Searching Authority in International Application No. PCT/KR2021/008744. [cited by applicant]