Display device, method of manufacturing the same, and tiled display device having the same
A display device includes: a substrate having a display area configured to display an image; a pixel on a first surface of the substrate in the display area and including a display element layer and a pixel circuit layer; a first driver on a second surface of the substrate facing the first surface of the substrate in the display area; and a first connection portion passing through the substrate between the first surface and the second surface of the substrate in the display area to electrically connect a first signal line of the pixel circuit layer and the first driver to each other. The display element layer includes: a first electrode and a second electrode on the same layer and spaced from each other; and a light emitting element between the first electrode and the second electrode.
1 . A method of manufacturing a display device, the method comprising:
forming a display element layer and a pixel circuit layer on a first surface of a substrate, the display element layer comprising a light emitting element;
forming an opening passing through the substrate with the display element layer formed thereon from a second surface facing the first surface to the first surface of the substrate to expose at least a portion of the pixel circuit layer;
filling the opening from the second surface of the substrate and forming a connection portion contacting the exposed portion of the pixel circuit layer; and
forming a capping layer having a pad opening exposing a portion of the connection portion on the second surface of the substrate,
wherein the opening is formed in a display area of the substrate at where an image is displayed,
wherein the capping layer covers another portion of the connection portion on the second surface of the substrate,
wherein the forming of the pixel circuit layer comprises:
forming a semiconductor layer on the first surface of the substrate;
forming a gate electrode on the semiconductor layer;
forming a signal line disposed on a same layer as the gate electrode; and
forming a first transistor electrode and a second transistor electrode disposed on the gate electrode and electrically connected to the semiconductor layer,
wherein the forming of the opening comprises exposing the signal line,
wherein the forming of the connection portion comprises forming a through electrode filling the opening and a fan-out electrode covering the second surface of the substrate, and
wherein the through electrode extends continuously in a thickness direction of the substrate between the signal line and the fan-out electrode, and comprises a through end portion contacting a flat bottom surface of the signal line.
2 . The method according to claim 1 , further comprising disposing a connection film and a driver electrically connected to the connection portion through the pad opening.
3 . The method according to claim 1 , wherein the forming of the display element layer comprises:
forming a first electrode and a second electrode spaced apart from each other on the same layer; and
disposing a light emitting element between the first electrode and the second electrode.
4 . The method according to claim 3 , wherein the forming of the display element layer comprises:
forming a wavelength conversion layer on the light emitting element; and
forming a color filter layer on the wavelength conversion layer,
wherein the wavelength conversion layer comprises a wavelength conversion particle and a scattering particle.
5 . The method according to claim 1 , wherein the filling of an opening comprises:
filling a first opening and forming a first connection portion; and
filling a second opening spaced apart from the first opening and forming a second connection portion.
6 . The method according to claim 5 , wherein the forming of the capping layer comprises:
forming a first pad opening exposing a portion of the first connection portion; and
forming a second pad opening exposing a portion of the second connection portion and spaced apart from the first pad opening.
7 . The method according to claim 5 , wherein the first connection portion has a first through electrode and a first fan-out electrode, and the second connection portion has a second through electrode and a second fan-out electrode.
8 . The method according to claim 7 , wherein the first fan-out electrode and the second fan-out electrode contact the second surface of the substrate.
9 . The method according to claim 7 , wherein the capping layer covers a portion of the first and second fan-out electrodes.
10 . The method according to claim 6 , further comprising:
disposing a first connection film and a first driver electrically connected to the first connection portion through the first pad opening; and
disposing a second connection film and a second driver electrically connected to the second connection portion through the second pad opening,
wherein the first and second connection films and the first and second drivers are disposed below the second surface of the substrate.
11 . The method according to claim 10 , wherein the first driver is a scan driver, and the second driver is a data driver.
12 . The method according to claim 1 , wherein the capping layer is formed of an inorganic material.