IP Library › Granted Patent US 12,734,597
Granted Patent B2
US 12,734,597 · App. 18/845,529 · Granted Sep 15, 2026

Cut member processing device and cutting system

Inventor: Shoji Aihara (Kanagawa, JP)
Assignees: AMADA CO., LTD.; AMADA MACHINERY CO., LTD.
B23D59/003B23D45/003B23D47/00B23D47/042
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Quick Facts
Patent No.
US 12,734,597
App. No.
18/845,529
Granted
Sep 15, 2026
Kind
B2
Abstract

A cut member processing device includes a marking device configured to put a mark on a cut surface of a cut member cut out from a metal long workpiece by a cutting device; and a product length acquisition unit configured to measure and store a product length of the cut member. The product length acquisition unit is configured to measure the product length under a state where the cut member is located at a position that allows the marking device to put the mark on the cut surface.

Claims (14)

1 . A cut member processing device, comprising:

a table main body that is movable vertically and on which a cut member, which is cut out from a metal long workpiece by a cutting device, is to be placed so that a cut surface of the cut member is directed upward;

a laser marking device configured to put a mark on the cut surface of the cut member placed on the table main body; and

a product length measuring device provided with a position sensor for detecting the cut surface located at a predetermined marking position, the product length measuring device being configured to determine a product length of the cut member based on the predetermined marking position and a vertical position of the table main body when the position sensor detects the cut surface located at the predetermined marking position,

a vertical focal point position of a laser beam emitted from the laser marking device is set at the predetermined marking position.

2 . The cut member processing device according to claim 1 ,

wherein the position sensor is an optical sensor device configured to emit and receive a light beam horizontally at the predetermined marking position above the table main body,

wherein the laser marking device is configured to put the mark on the cut surface located at the predetermined marking position by emitting the laser beam from above.

3 . The cut member processing device according to claim 1 , further comprising

a mass sensor capable of measuring a mass of the cut member based on the position sensor detecting that the cut surface is located at the predetermined marking position.

4 . A cutting system, comprising:

a cutting device configured to cut out a cut member from a metal long workpiece;

a cut member processing device according to claim 1 ; and

a robot hand device configured to load the cut member cut out by the cutting device into the cut member processing device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: AIHARA, SHOJI
To: AMADA CO., LTD.; AMADA MACHINERY CO., LTD.
Reel/Frame 068538/0990 →
Priority Claims (1)
JP 2022-039471 · Mar 14, 2022 · national
Continuity (1)
Related Publication 20250187088A1 · Jun 12, 2025
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