Vacuum sealing integrity of cryogenic electrostatic chucks using non-contact surface temperature measuring probes
The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.
1 . A substrate temperature measurement apparatus, comprising:
a substrate support assembly comprising an electrostatic chuck and one or more plates;
a probe assembly disposed within the substrate support assembly and extending through one or more of the one or more plates, the probe assembly comprising:
an optical probe sensor;
an optical fiber coupled to the optical probe sensor; and
an insulating sheath surrounding the optical fiber; and
a probe target in contact with the electrostatic chuck, the probe target comprising a coating of photoluminescent material, wherein the probe target is spaced from the probe assembly.
2 . The substrate temperature measurement apparatus of claim 1 , wherein the probe assembly further comprises a seal disposed on a housing, the housing disposed within the one or more plates.
3 . The substrate temperature measurement apparatus of claim 2 , wherein the seal is disposed around the optical fiber and is configured to maintain a vacuum around the electrostatic chuck.
4 . The substrate temperature measurement apparatus of claim 2 , wherein the housing further comprises a sealant disposed within a void within the housing and surrounding the insulating sheath.
5 . The substrate temperature measurement apparatus of claim 1 , wherein the coating is disposed on a core of the probe target.
6 . The substrate temperature measurement apparatus of claim 5 , wherein the core comprises a ceramic material.
7 . The substrate temperature measurement apparatus of claim 1 , wherein the optical fiber is directed at the coating of the probe target.
8 . The substrate temperature measurement apparatus of claim 1 , wherein the probe assembly is connected to a probe controller.
9 . A substrate support assembly, comprising:
an electrostatic chuck and one or more plates;
a probe assembly disposed within the electrostatic chuck, the probe assembly extending through one or more of the one or more plates, the probe assembly comprising:
an optical probe sensor;
an optical fiber coupled to the optical probe sensor; and
an insulating sheath surrounding the optical fiber; and
a probe target in contact with the electrostatic chuck and a distance away from a tip of the optical fiber, the probe target comprising a coating of photoluminescent material.
10 . The substrate support assembly of claim 9 , wherein probe target is disposed on a bottom surface of the electrostatic chuck.
11 . The substrate support assembly of claim 9 , wherein a target core of the probe target comprises a metallic alloy infused with the photoluminescent material.
12 . The substrate support assembly of claim 9 , wherein probe target comprises a ceramic core and a photoluminescent material disposed between the optical fiber and the ceramic core.
13 . The substrate support assembly of claim 9 , wherein the optical fiber is directed at the coating of the probe target.
14 . The substrate support assembly of claim 9 , wherein the probe assembly is connected to a probe controller.
15 . The substrate support assembly of claim 9 , wherein the probe assembly further comprises a housing comprising a sealant disposed within a void within the housing and surrounding the insulating sheath.
16 . The substrate support assembly of claim 15 , wherein the probe assembly further comprises a seal disposed on a housing, the housing disposed within the one or more plates.
17 . The substrate support assembly of claim 16 , wherein the seal is disposed around the optical fiber and is configured to maintain a vacuum around the electrostatic chuck.
18 . A substrate support assembly, comprising:
an electrostatic chuck and one or more plates;
a probe assembly disposed within the substrate support assembly and extending through one or more of the one or more plates, the probe assembly comprising:
an optical probe sensor;
an optical fiber coupled to the optical probe sensor;
an insulating sheath surrounding the optical fiber;
a housing disposed within the electrostatic chuck, the housing comprising:
a seal disposed in a seal recess of the housing; and
a cavity within the housing, the optical fiber and insulating sheath disposed through the cavity; and
a sealant disposed within the cavity surrounding the insulating sheath; and
a probe target in contact with a bottom surface of the electrostatic chuck and a distance away from a tip of the optical fiber, the probe target comprising a coating of photoluminescent material.
19 . The substrate support assembly of claim 18 , wherein a target core of the probe target comprises a metallic alloy infused with the photoluminescent material.
20 . The substrate support assembly of claim 18 , wherein probe target comprises a ceramic core and a photoluminescent material disposed between the optical fiber and the ceramic core.
21 . The substrate temperature measurement apparatus of claim 1 , wherein the probe assembly is configured to enable measurement of temperatures less than about 10° Celsius.
22 . The substrate temperature measurement apparatus of claim 1 , wherein the probe assembly is configured to measure temperatures between about 100° Celsius to about −50° Celsius.
23 . The substrate support assembly of claim 9 , wherein the probe assembly is configured to enable measurement of temperatures less than about 10° Celsius.
24 . The substrate support assembly of claim 9 , wherein the probe assembly is configured to measure temperatures between about 100° Celsius to about −50═ Celsius.