Apparatuses, systems, and methods for three-dimensional, in-situ inspection of an additively manufactured component
The present disclosure is directed to an additive manufacturing system configured to generate an electron beam directed toward a target to generate x-ray flux. The x-ray flux is directed toward the component through at least one plate with a pinhole. Interactions between the component and the x-ray flux generate x-ray radiation. The at least one detector is configured to detect the x-ray radiation through a pinhole. An analysis component is configured to generate an image comprising a three-dimensional component based on the x-ray radiation detected by the at least detector.
1 . An apparatus for in-situ inspection, comprising:
an electron emitter configured to emit electrons such that the electrons penetrate a component, wherein the electrons move along an electron path between the electron emitter and the component;
a target positioned between the electron emitter and the component at an angle with respect to the component such that interaction between the target and the electrons generates a multidirectional x-ray flux;
a plate defining a pinhole therethrough, positioned along the electron path between the target and the component such that the multidirectional x-ray flux is directed through the pinhole toward the component positioned with respect to the angle to direct an x-ray flux onto the component; and
at least one detector positioned to detect x-ray radiation from the x-ray flux that penetrates the component, wherein the x-ray radiation is converted to coordinates that correspond to a spatial reference comprising a three-dimensional area of the component.
2 . The apparatus of claim 1 , wherein the electron emitter is an electron gun comprising at least at least one astigmatism coil, at least one focusing coil, or at least one deflection coil, or a combination thereof.
3 . The apparatus of claim 1 , further comprising an enclosure surrounding the target and the plate such that the at least one detector is disposed outside of the enclosure.
4 . The apparatus of claim 1 , further comprising a bending coil configured to deflect the electrons emitted from the electron emitter to the target, wherein the bending coil is positioned along the electron path between the electron emitter and the target.
5 . The apparatus of claim 1 , further comprising a second plate defining a second pinhole therethrough positioned between the component and the at least one detector such that the x-ray radiation passes through the second pinhole prior to detection by the at least one detector.
6 . The apparatus of claim 1 , wherein the coordinates comprise a depth of the component such that the at least one detector may generate images of one or more voids, pores, trapped powder, porosity, cracks or lack-of-fusion within the component.
7 . The apparatus of claim 1 , further comprising an arm configured to move a transmission target horizontally, wherein the transmission target comprises the target and a low-density material, wherein the transmission target is positioned parallel to the component.
8 . An additive manufacturing system, comprising:
a process chamber for manufacturing a component; and
an apparatus for in-situ inspection, comprising:
an electron beam source configured to emit an electron beam such that the electron beam penetrates the component, wherein the electron beam moves along an electron beam path between the electron beam source and the component;
a target positioned along the electron beam path between the electron beam source and the component at an angle with respect to the component such that interaction between the target and the electron beam generates a multidirectional x-ray flux;
a plate defining a pinhole therethrough, positioned along the electron beam path between the target and the component such that the multidirectional x-ray flux is directed through the pinhole toward a component positioned with respect to the angle to direct an x-ray flux onto the component; and
at least one detector positioned to detect x-ray radiation generated from the x-ray flux that penetrates the component, wherein the x-ray radiation is converted to coordinates that correspond to a spatial reference comprising a three-dimensional area of the component.
9 . The system of claim 8 , wherein the at least one detector is disposed outside of the process chamber.
10 . The system of claim 8 , further comprising a bending coil configured to deflect the electron beam emitted from the electron beam source to the target, wherein the bending coil is positioned along the electron beam path between the electron beam source and the target.
11 . The system of claim 8 , further comprising a second plate defining a second pinhole positioned between the component and the at least one detector such that the x-ray radiation can pass through the second pinhole prior to detection by the at least one detector.
12 . The system of claim 8 , wherein the coordinates comprise a depth of the component such that the at least one detector may generate images of one or more voids, pores, trapped powder, porosity, cracks or lack-of-fusion within the component.
13 . The system of claim 8 , further comprising an arm configured to move a transmission target horizontally, wherein the transmission target comprises the target and a low-density material, wherein the transmission target is positioned parallel to the component.
14 . A method of in-situ inspection of an additively manufactured component, the method comprising:
emitting an electron beam from an electron beam source to penetrate a component, wherein the electron beam moves along an electron beam path between the electron beam source and the component;
directing the electron beam using a target at an angle such that interaction between the target and the electron beam generate a multidirectional x-ray flux;
directing the multidirectional x-ray flux to a plate defining pinhole therethrough such that the multidirectional x-ray flux is directed through the pinhole toward a component positioned with respect to the angle to direct an x-ray flux onto the component; and
detecting, with at least one detector, x-ray radiation from the x-ray flux penetrating a component at coordinates, wherein the coordinates indicate a spatial reference comprising a three-dimensional area of the component.
15 . The method of claim 14 , further comprising a step of forming an image of containing one or more defects defined within the component.
16 . The method of claim 15 , wherein the one or more defects comprises at least one of voids, pores, trapped powder, porosity, cracks or lack-of-fusion within the component.
17 . The method of claim 15 , further comprising a step of processing the image to identify three-dimensional coordinates of the one or more defects within the component.
18 . The method of claim 17 , further comprising a step of comparing, in real time, at least one of the one or more defects defined within the component with a CAD model of the component.
19 . The method of claim 18 , further comprising repairing the at least one of the one or more defects within the component.
20 . The method of claim 14 , wherein the at least one detector is disposed outside of an enclosure.