Integrated photonics optical gyroscopes with improved sensitivity utilizing high density silicon nitride waveguides
Aspects of the present disclosure are directed to introducing structural modifications in a waveguide-based optical structure in order to more tightly pack adjacent waveguide turns in the optical structure. The optical structure can be used as the rotational sensing element of an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of a waveguide-based gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement. The structural modifications can be in the form of air-gaps or fluid-filled or metal-filled gaps, or various types of sub-wavelength structures (like gratings or photonic crystals).
1 . A method of manufacturing an integrated photonics chip, the method comprising:
fabricating a waveguide coil that encloses a central area, wherein the waveguide coil comprises a plurality of waveguide turns looping around the central area, and each waveguide turn is parallel to adjacent waveguide turns;
surrounding a waveguide core by a cladding material; and
introducing a structural modification on either side of each waveguide turn to reduce crosstalk between the adjacent waveguide turns, wherein the structural modification comprises a sub-wavelength structure introduced between the adjacent waveguide turns,
wherein the sub-wavelength structure comprises a grating, and wherein a periodicity of the grating depends on a wavelength of light propagating within the waveguide coil.
2 . The method of claim 1 , wherein introducing the structural modification further comprises:
forming a discontinuity in the cladding material.
3 . The method of claim 1 , wherein the waveguide core comprises silicon nitride.
4 . The method of claim 3 , wherein the cladding material comprises oxide.
5 . The method of claim 1 , further comprising:
using the waveguide coil as a rotational sensing element of an optical gyroscope.
6 . The method of claim 5 , wherein a sensitivity of the rotational sensing element depends on a total number of waveguide turns in the waveguide coil as well as on an area of the central area enclosed by the waveguide coil.
7 . A method of manufacturing an integrated photonics chip, the method comprising:
fabricating a waveguide coil that encloses a central area, wherein the waveguide coil comprises a plurality of waveguide turns looping around the central area, and each waveguide turn is parallel to adjacent waveguide turns;
surrounding a waveguide core by a cladding material; and
introducing a structural modification on either side of each waveguide turn to reduce crosstalk between the adjacent waveguide turns, wherein the structural modification comprises a sub-wavelength structure introduced between the adjacent waveguide turns,
wherein the sub-wavelength structure comprises a structure representing a photonic crystal, with periodic trenches deep-etched through an upper portion of the cladding material past the waveguide core and extending deep into a lower portion of the cladding material in a longitudinal direction.
8 . The method of claim 1 , the structural modification introduced on either side of each waveguide turn reduces a pitch between the adjacent waveguide turns without increasing crosstalk between the adjacent waveguide turns.
9 . The method of claim 8 , wherein reducing the pitch between the adjacent waveguide turns increases a total number of waveguide turns that can be fabricated within a predetermined area of the integrated photonics chip, wherein the predetermined area includes the waveguide coil and the central area enclosed by the waveguide coil.
10 . The method of claim 9 , further comprising:
calculating a dimension of the predetermined area based on an exposure field of a reticle used to fabricate the waveguide coil with the plurality of waveguide turns.
11 . The method of claim 7 , wherein introducing the structural modification further comprises:
forming a discontinuity in the cladding material.
12 . The method of claim 7 , wherein the waveguide core comprises silicon nitride.
13 . The method of claim 12 , wherein the cladding material comprises oxide.
14 . The method of claim 7 , the structural modification introduced on either side of each waveguide turn reduces a pitch between the adjacent waveguide turns without increasing crosstalk between the adjacent waveguide turns.
15 . The method of claim 14 , wherein reducing the pitch between the adjacent waveguide turns increases a total number of waveguide turns that can be fabricated within a predetermined area of the integrated photonics chip, wherein the predetermined area includes the waveguide coil and the central area enclosed by the waveguide coil.
16 . The method of claim 15 , further comprising:
calculating a dimension of the predetermined area based on an exposure field of a reticle used to fabricate the waveguide coil with the plurality of waveguide turns.
17 . The method of claim 7 , further comprising:
using the waveguide coil as a rotational sensing element of an optical gyroscope.
18 . The method of claim 17 , wherein a sensitivity of the rotational sensing element depends on a total number of waveguide turns in the waveguide coil as well as on an area of the central area enclosed by the waveguide coil.