IP Library Granted Patent US 12,737,525
Granted Patent B2
US 12,737,525 · App. 18/164,776 · Granted Sep 15, 2026

Electrical circuit component for an RF/EM circuit, a method for use in RF/EM circuit design and an electrical circuit design platform

Inventor: Wai Yin Mung (Tai Po, HK)
Assignee: The Education University of Hong Kong
G06F30/398
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,737,525
App. No.
18/164,776
Granted
Sep 15, 2026
Kind
B2
Abstract

An electrical circuit component for an RF/EM circuit, a method for use in RF/EM circuit design and an electrical circuit design platform. The electrical circuit component comprises a double-sided parallel-strip line (DSPSL) having a balanced line arranged to reject external noise from connected circuit components when fed to other electrical circuits during operation of the RF/EM circuit; wherein the DSPSL includes a pair of parallel-strip lines of conducting plate disposed back-to-back on opposite sides of a substrate, and the DSPSL is provided as a computer-implemented circuit component for use on an electrical circuit design platform.

Claims (23)

1 . An electrical circuit component for an RF/EM circuit, comprising a double-sided parallel-strip line (DSPSL) having a balanced line arranged to reject external noise from connected circuit components when fed to other electrical circuits during operation of the RF/EM circuit; wherein the DSPSL includes a pair of parallel-strip lines of conducting plate disposed back-to-back on opposite sides of a substrate,

wherein the electrical circuit component is configured to be simulated on an electrical circuit design platform without using an electromagnetic (EM) simulator by utilizing a lumped-element equivalent circuit model; and

wherein said lumped-element equivalent circuit model utilizes a ground plane defined at a mid-point of a dielectric separation between the pair of parallel-strip lines to decompose the DSPSL into two equivalent microstrip line (MSL) networks.

2 . The electrical circuit component in accordance with claim 1 , wherein the DSPSL is provided as a computer-implemented circuit component for use on an electrical circuit design platform.

3 . The electrical circuit component in accordance with claim 2 , wherein the DSPSL is arranged to operate together with other active and passive components in the RF/EM circuit, wherein the RF/EM circuit is a simulated electrical circuit.

4 . The electrical circuit component in accordance with claim 3 , wherein the RF/EM circuit includes an in-phase power divider, an out-of-phase power divider, a bandpass filter, a rat-race hybrid circuit, and a DC biasing network, a push-pull amplifier and an oscillator.

5 . The electrical circuit component in accordance with claim 3 , wherein the RF/EM circuit includes a balanced circuit, and the pair of parallel-strip lines are electrically connected by a via across the substrate.

6 . The electrical circuit component in accordance with claim 5 , wherein the DSPSL comprises a virtual ground plane between the DSPSL.

7 . The electrical circuit component in accordance with claim 6 , wherein the DSPSL comprises no physical ground planes.

8 . The electrical circuit component in accordance with claim 7 , wherein the virtual ground plane is defined at a mid-point of a dielectric separation between the pair of parallel-strip lines of conducting plate.

9 . The electrical circuit component in accordance with claim 5 , wherein the DSPSL further comprising an inserted conductor plane at a mid-point of a dielectric separation between the pair of parallel-strip lines of conducting plate.

10 . A method for use in RF/EM circuit design, comprising the step of: including a double-sided parallel-strip line (DSPSL) as an electrical circuit component having a balanced line arranged to reject external noise from connected circuit components when fed to other electrical circuits during operation of an RF/EM circuit; wherein the DSPSL includes a pair of parallel-strip lines of conducting plate disposed back-to-back on opposite sides of a substrate,

wherein the method further comprises simulating a circuit performance of the RF/EM circuit including the DSPSL on an electrical circuit design platform without using an electromagnetic (EM) simulator by utilizing a lumped-element equivalent circuit model;

wherein said lumped-element equivalent circuit model utilizes a ground plane defined at a mid-point of a dielectric separation between the pair of parallel-strip lines to decompose the DSPSL into two equivalent microstrip line (MSL) networks for simulation.

11 . The method in accordance with claim 10 , wherein the DSPSL is provided as a computer-implemented circuit component for use on an electrical circuit design platform.

12 . The method in accordance with claim 11 , wherein the DSPSL is arranged to operate together with other active and passive components in the RF/EM circuit, wherein the RF/EM circuit is a simulated electrical circuit.

13 . The method in accordance with claim 12 , wherein the RF/EM circuit includes an inphase power divider, an out-of-phase power divider, a bandpass filter, a rat-race hybrid circuit, and a DC biasing network, a push-pull amplifier and an oscillator.

14 . The method in accordance with claim 12 , wherein the RF/EM circuit includes a balanced circuit and the pair of parallel-strip lines are electrically connected by a via across the substrate.

15 . The method in accordance with claim 14 , wherein the DSPSL comprises a virtual ground plane between the DSPSL.

16 . The method in accordance with claim 15 , wherein the DSPSL comprises no physical ground planes.

17 . The method in accordance with claim 16 , wherein the virtual ground plane is defined at a mid-point of a dielectric separation between the pair of parallel-strip lines of conducting plate.

18 . The method in accordance with claim 14 , wherein the DSPSL further comprising an inserted conductor plane at a mid-point of a dielectric separation between the pair of parallel-strip lines of conducting plate.

19 . An electrical circuit design platform comprising computer-executable instructions, when being executed, arranged to perform a method for use in RF/EM circuit design in accordance with claim 10 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2023
From: MUNG, WAI YIN
To: THE EDUCATION UNIVERSITY OF HONG KONG
Reel/Frame 062599/0479 →
Continuity (1)
Related Publication 20240265189A1 · Aug 8, 2024
References Cited (13)
US 6281843B1 · Evtioushkine · 2001 [cited by examiner]
US 9912072B1 · Mandeville · 2018 [cited by examiner]
US 11966616B2 · Muchherla · 2024 [cited by examiner]
US 12113265B2 · Sutono · 2024 [cited by examiner]
US 12418087B2 · Guo · 2025 [cited by examiner]
US 20140266490A1 · Xiao · 2014 [cited by examiner]
US 20190043816A1 · Sutono · 2019 [cited by examiner]
US 20200062408A1 · Bratianu-Badea · 2020 [cited by examiner]
US 20210367350A1 · Zhao · 2021 [cited by examiner]
US 20220311114A1 · Sutono · 2022 [cited by examiner]
US 20240265189A1 · Mung · 2024 [cited by examiner]
US 20250006666A1 · Sir · 2025 [cited by examiner]
US 20250079721A1 · Kay · 2025 [cited by examiner]