Inductor connectivity and assemblies

1 . An apparatus comprising:

a heat sink element fabricated from a first portion of electrically conductive material;

a first inductive path fabricated from a second portion of the electrically conductive material, the second portion of the electrically conductive material fixedly connected to the heat sink element;

a second inductive path fabricated from a third portion of the electrically conductive material, the third portion of the electrically conductive material fixedly connected to the heat sink element;

wherein the second portion of the electrically conductive material and the third portion of the electrically conductive material extend substantially orthogonal from a first surface of the heat sink element;

wherein a series connectivity of the first inductive path, the heat sink element, and the second inductive path is an inductor device; and

wherein axial ends of the heat sink element extend in a plane beyond the second portion of the electrically conductive material and the third portion of the electrically conductive material.

2 . The apparatus as in claim 1 further comprising:

magnetic permeable material including: i) a first void extending between a first surface of the magnetic permeable material and a second surface of the magnetic permeable material; and ii) a second void extending between the first surface of the magnetic permeable material and the second surface of the magnetic permeable material;

wherein the second portion of the electrically conductive material resides in the first void in the magnetic permeable material; and

wherein the third portion of the electrically conductive material resides in the second void in the magnetic permeable material.

3 . The apparatus as in claim 1 , wherein the second portion of the electrically conductive material includes a first axial end and a second axial end, the first axial end of the second portion fixedly coupled to the heat sink element, the second axial end of the second portion being an input node connected to power switch circuitry of a power converter circuit; and

wherein the third portion of the electrically conductive material includes a first axial end and a second axial end, the first axial end of the third portion fixedly coupled to the heat sink element, the second axial end of the third portion being an output node associated with the power converter circuit.

4 . The apparatus as in claim 3 ,

wherein the series connectivity of the first inductive path, the heat sink element, and the second inductive path extend between the second axial end of the second portion and the second axial end of the third portion.

5 . The apparatus as in claim 3 , wherein the switch circuitry includes a first switch disposed in series with a second switch, the input node directly coupling the first switch to the second switch, the apparatus further comprising:

driver circuitry to drive each of the first switch and the second switch.

6 . The apparatus as in claim 1 further comprising:

a host substrate;

wherein the second portion includes a first axial end and a second axial end, the first axial end of the second portion fixedly coupled to the heat sink element, the second axial end of the second portion fixedly connected to a first node of the host substrate; and

wherein the third portion includes a first axial end and a second axial end, the first axial end of the third portion fixedly coupled to the heat sink element, the second axial end of the third portion being fixedly connected to a second node of the host substrate.

7 . The apparatus as in claim 6 , wherein the second portion of the electrically conductive material is operative to convey heat from the host substrate to the heat sink element; and

wherein the third portion of the electrically conductive material is operative to convey heat from the host substrate to the heat sink element.

8 . The apparatus as in claim 1 ,

wherein the heat sink element includes a first void resulting from bending of the second portion with respect to the a plane in which the heat sink element resides; and

wherein the heat sink element includes a second void resulting from bending of the third portion with respect to the plane in which the heat sink element resides.

9 . The apparatus as in claim 1 further comprising:

a first substrate;

wherein the second portion of the electrically conductive material is enveloped by first magnetic permeable material;

wherein the third portion of the electrically conductive material is enveloped by second magnetic permeable material; and

wherein an axial end of the second portion contacts a first pad disposed on a surface of the first substrate.

10 . The apparatus as in claim 9 further comprising:

a second substrate to which the first substrate is affixed; and

an electrically conductive path of metal operative to provide electrical connectivity between an axial end of the third portion and the second substrate.

11 . The apparatus as in claim 10 , wherein the electrically conductive path of metal is further operative to provide electrical connectivity between the axial end of the third portion and a second node on the surface of the first substrate.

12 . The apparatus as in claim 1 further comprising:

magnetic permeable material enveloping the second portion of the electrically conductive material and the third portion of the electrically conductive material;

a first substrate to which a first axial end of the second portion is coupled;

first circuit components coupled to the first substrate, the first circuit components operative to control a flow of current through the inductor device;

a second substrate to which the first substrate is affixed;

a gap between the magnetic permeable material and the second substrate; and

a second circuit component coupled to the second substrate and residing within the gap.

13 . The apparatus as in claim 1 further comprising:

a host substrate; and

switch circuitry embedded in the host substrate, the switch circuitry operative to control a flow of current through the inductor device.

14 . The apparatus as in claim 1 further comprising:

a first substrate;

a second substrate coupled to the first substrate;

wherein an axial end of the second portion of the electrically conductive material is directly coupled to a first node, the first node disposed on the first substrate; and

wherein an axial end of the third portion of the electrically conductive material is directly coupled to a second node, the second node disposed on the second substrate.

15 . The apparatus as in claim 14 , wherein the second substrate includes switch circuitry operative to control flow of current from the first node through the inductor device to the axial end of the third portion of the electrically conductive material.

16 . The apparatus as in claim 15 ,

wherein the controlled flow of current produces an output voltage supplied from the axial end of the third portion of the electrically conductive material to the second node of the first substrate.

17 . The apparatus as in claim 1 , wherein the first inductive path is surrounded by first magnetic permeable material; and

wherein the second inductive path is surrounded by second magnetic permeable material.

18 . The apparatus as in claim 17 , wherein the first inductive path is oriented to be substantially parallel to the second inductive path; and

wherein the series connectivity of the first inductive path, the heat sink element, and the second inductive path is operative to support flow of current from a first surface of a host substrate through the series connectivity back to the first surface of the host substrate.

19 . An inductor device comprising:

a heat sink element fabricated from electrically conductive material;

a first element of electrically conductive material fixedly connected to the heat sink element, the first element extending substantially orthogonal with respect to a first surface of the heat sink element;

a second element of electrically conductive material fixedly connected to the heat sink element, the second element extending substantially orthogonal with respect to the first surface of the heat sink element;

a first mass of magnetic permeable material disposed between the first element of electrically conductive material and the second element of electrically conductive material; and

a second mass of magnetic permeable material including a hollow volume in which a combination of the first element, the first mass of magnetic permeable material, and the second element resides; and

wherein axial ends of the heat sink element extend in a plane beyond the first element and the second element.

20 . The inductor device as in claim 19 , wherein the heat sink element includes a second surface disposed opposite the first surface, the second surface exposed on a top surface of the inductor device.

21 . The inductor device as in claim 19 , wherein the first element is fabricated via a first bend in the electrically conductive material; and

wherein the second element is fabricated via a second bend in the electrically conductive material.

22 . The inductor device as in claim 19 , wherein a height of the first mass of magnetic permeable material is shorter than a height of the second mass of magnetic permeable material.

23 . The inductor device as in claim 19 , wherein the first element is disposed between the first mass of magnetic permeable material and a first portion of the second mass of magnetic permeable material;

wherein the second element is disposed between the first mass of magnetic permeable material and a second portion of the second mass of magnetic permeable material; and

wherein the second portion of the second mass of magnetic permeable material is disposed opposite the first portion of the second mass of magnetic permeable material.

24 . The inductor device as in claim 23 ,

wherein the first element is a first inductive element; wherein the second element is a second inductive element; and wherein the heat sink element connects the first inductive element and the second conductive element in series between a terminal of the first element and a terminal of the second element.

25 . A method of producing a heat sink assembly, the method comprising:

receiving a heat sink element, the heat sink element fabricated from electrically conductive material;

fabricating the heat sink assembly to include a first element of electrically conductive material disposed substantially orthogonal to a surface of the heat sink element;

fabricating the heat sink assembly to include a second element of electrically conductive material disposed substantially orthogonal to the surface of the heat sink element; and

wherein a series connectivity of the first element, the heat sink element, and the second element is an inductor component; and

wherein axial ends of the heat sink element extend in a plane beyond the first element and the second element.

26 . The method as in claim 25 , wherein the first element is a first bent portion of the electrically conductive material from which the heat sink element is fabricated; and

wherein the second element is a second bent portion of the electrically conductive material from which the heat sink element is fabricated;

the method further comprising:

inserting the first element of electrically conductive material of the heat sink assembly through a first void disposed in first magnetic permeable material; and

inserting the second element of electrically conductive material of the heat sink assembly through a second void disposed in second magnetic permeable material.