Die package with sealed die enclosures
Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.
1 . An apparatus comprising:
a die;
a perimeter metallization disposed on a perimeter of the die;
a package substrate; and
a seal coupled to the perimeter metallization and the package substrate, wherein the seal is configured to seal the die to the package substrate;
wherein the perimeter metallization continuously extends along the perimeter of the die.
2 . The apparatus of claim 1 , further comprising:
a cavity disposed in the package substrate, wherein the die is disposed on an open side of the cavity and the seal is configured to seal the cavity.
3 . The apparatus of claim 2 , further comprising:
a plurality of resonators disposed on a surface of the die that is sealed in with the cavity.
4 . The apparatus of claim 3 , wherein the die and the package substrate form at least one of a Bulk Acoustic Wave (BAW) acoustic filter or Surface Acoustic Wave (SAW) acoustic filter.
5 . The apparatus of claim 2 , wherein the die is at least partially embedded in the cavity.
6 . The apparatus of claim 5 , wherein the perimeter metallization is disposed at least partially on a side of the die.
7 . The apparatus of claim 6 , wherein the seal is coupled at least partially to a sidewall of the cavity.
8 . The apparatus of claim 2 , wherein the die is disposed above the cavity.
9 . The apparatus of claim 8 , wherein the perimeter metallization is disposed on a bottom of the die facing the package substrate.
10 . The apparatus of claim 9 , wherein the seal is coupled at least partially to a topside of the package substrate facing the die.
11 . The apparatus of claim 2 , further comprising:
a heat-slug disposed in the package substrate, wherein the heat-slug is configured to allow access to the cavity through the package substrate.
12 . The apparatus of claim 11 , further comprising:
a heat-slug seal configured to seal the heat-slug and the cavity.
13 . The apparatus of claim 1 , further comprising:
an electromagnetic shield disposed over the die and at least partially disposed over the package substrate.
14 . The apparatus of claim 13 , wherein the electromagnetic shield is disposed between the die and a package encapsulant.
15 . The apparatus of claim 1 , further comprising:
a package encapsulant disposed over the die and at least partially disposed over the package substrate.
16 . The apparatus of claim 1 , wherein the perimeter metallization further comprises a plurality of perimeter pads.
17 . The apparatus of claim 1 , wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, alloys, or combinations thereof.
18 . The apparatus of claim 1 , wherein the perimeter metallization comprises at least one of a plurality of conductive pillars, a conductive film, a sputtered conductive layer, part of a copper-tin-copper bond, or combinations thereof.
19 . The apparatus of claim 1 , wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, polymer, or combinations thereof.
20 . The apparatus of claim 1 , wherein the apparatus comprises at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in an automotive vehicle.
21 . A method for fabricating an apparatus, the method comprising:
forming a die;
forming a perimeter metallization on a perimeter of the die;
forming a package substrate; and
coupling a seal to the perimeter metallization and the package substrate, wherein the seal is configured to seal the die to the package substrate;
wherein the perimeter metallization continuously extends along the perimeter of the die.
22 . The method of claim 21 , further comprising:
forming a cavity disposed in the package substrate, wherein the die is disposed on an open side of the cavity and the seal is configured to seal the cavity.
23 . The method of claim 22 , further comprising:
forming a plurality of resonators disposed on a surface of the die that is sealed in with the cavity.
24 . The method of claim 23 , wherein the die and the package substrate form at least one of a Bulk Acoustic Wave (BAW) acoustic filter or Surface Acoustic Wave (SAW) acoustic filter.
25 . The method of claim 22 , wherein the die is at least partially embedded in the cavity.
26 . The method of claim 25 , wherein the perimeter metallization is disposed at least partially on a side of the die.
27 . The method of claim 26 , wherein the seal is coupled at least partially to a sidewall of the cavity.
28 . The method of claim 22 , wherein the die is disposed above the cavity.
29 . The method of claim 28 , wherein the perimeter metallization is disposed on a bottom of the die facing the package substrate.
30 . The method of claim 29 , wherein the seal is coupled at least partially to a topside of package substrate facing the die.
31 . The method of claim 22 , further comprising:
forming a heat-slug disposed in the package substrate, wherein the heat-slug is configured to allow access to the cavity through the package substrate.
32 . The method of claim 31 , further comprising:
forming a heat-slug seal configured to seal the heat-slug and the cavity.
33 . The method of claim 21 , further comprising:
forming an electromagnetic shield disposed over the die and at least partially disposed over the package substrate.
34 . The method of claim 33 , wherein the electromagnetic shield is disposed between the die and a package encapsulant.
35 . The method of claim 21 , further comprising:
disposing a package encapsulant over the die and at least partially over the package substrate.
36 . The method of claim 21 , wherein the perimeter metallization further comprises a plurality of perimeter pads.
37 . The method of claim 21 , wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, alloys, or combinations thereof.
38 . The method of claim 21 , wherein the perimeter metallization comprises at least one of a plurality of conductive pillars, a conductive film, a sputtered conductive layer, part of a copper-tin-copper bond, or combinations thereof.
39 . The method of claim 21 , wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, polymer, or combinations thereof.
40 . The apparatus of claim 1 , further comprising:
one or more connectors configured to electrically couple the die to the package substrate.