IP Library Granted Patent US 12,740,010
Granted Patent B2
US 12,740,010 · App. 18/389,116 · Granted Sep 15, 2026

Power module cooling device

Inventors: Sang Hun Lee (Whasung-Si, KR); Hyong Joon Park (Whasung-Si, KR); Se Heun Kwon (Whasung-Si, KR)
Assignees: Hyundai Motor Company; Kia Corporation; Seoul
H05K7/20272H05K7/20927
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,740,010
App. No.
18/389,116
Granted
Sep 15, 2026
Kind
B2
Abstract

A power module cooling device includes a manifold cover and a fin plate contained in the manifold cover, wherein a cooling fluid is ejected perpendicularly to heating surfaces through cooling fins of the fin plate configured perpendicularly to the longitudinal direction of the manifold cover so that a vertical turbulent flow of the cooling fluid is generated, thereby securing cooling efficiency, and flow characteristics of the cooling fluid are improved, minimizing flow rate loss due to the vertical turbulent flow. respective cooling channel portions of the manifold cover corresponding to respective power modules have different cooling performances so that respective power modules are cooled in a balanced manner. Accordingly, cooling imbalance is removed, and the power modules are thus stabilized and maintain performance.

Claims (30)

1 . A power module cooling apparatus comprising:

a manifold cover including:

an internal space in which a cooling fluid is circulated, wherein a plurality of power modules are disposed in the internal space; and

a plurality of cooling channel portions being formed to match with respective power modules,

wherein each of the plurality of cooling channel portions includes a first channel open in a direction in which the cooling fluid flows in and a second channel open in a direction in which the cooling fluid flows out; and

a fin plate disposed in the manifold cover to abut the plurality of power modules, and including cooling fins facing the plurality of cooling channel portions so that the cooling fluid which has flowed into the first channels flows between the cooling fins and then flows out through the second channels,

wherein the plurality of cooling channel portions corresponding to the respective power modules have different number of channels,

wherein the plurality of power modules are disposed in series in the internal space of the manifold cover so that the plurality of cooling channel portions are disposed in series in a direction in which respective power modules are aligned,

wherein a direction of extension of the plurality of cooling channel portions and a direction of extension of the cooling fins intersect perpendicularly, and

wherein a last cooling channel portion adjacent to an outlet among the plurality of cooling channel portions includes a smaller number of first channels formed therein than first channels of remaining channel portions adjacent to an inlet among the plurality of cooling channel portions.

2 . The power module cooling apparatus of claim 1 , wherein respective cooling channel portions include a smaller number of the first channels formed therein than the second channels therein.

3 . The power module cooling apparatus of claim 1 ,

wherein the last cooling channel portion among the plurality of cooling channel portions includes a smaller number of second channels formed therein than second channels of the remaining channel portions among the plurality of cooling channel portions.

4 . The power module cooling apparatus of claim 3 ,

wherein a number of the first channels in the last cooling channel portion among the plurality of cooling channel portions is smaller than a number the second channels formed in the last cooling channel.

5 . The power module cooling apparatus of claim 3 ,

wherein a number of the first channels formed in the last cooling channel portion among the plurality of cooling channel portions is smaller than to a number of the first channels or a number of the second channels formed in the remaining cooling channels.

6 . The power module cooling apparatus of claim 3 ,

wherein a number of the second channels formed in the last cooling channel portion among the plurality of cooling channel portions is smaller than or equal to a number of the first channels formed in the remaining cooling channels.

7 . The power module cooling apparatus of claim 1 ,

wherein the plurality of power modules include a first power module, a second power module, and a third power module,

wherein the plurality of cooling channel portions include a first cooling channel portion, a second cooling channel portion, and a third cooling channel portion, and

wherein the third cooling channel portion includes a smaller number of first channels or second channels formed therein than first channels or second channels of the first cooling channel portion and the second cooling channel portion.

8 . The power module cooling apparatus of claim 1 , wherein the plurality of cooling channel portions include a plurality of first barrier portions extending to delimit the first channels and the second channels, a plurality of second barrier portions connected to the plurality of first barrier portions on first and second sides at end portions of the first channels in a direction in which the cooling fluid flows out, and a plurality of third barrier portions connected to the plurality of first barrier portions on first and second sides at end portions of the second channels in a direction in which the cooling fluid flows in.

9 . The power module cooling apparatus of claim 8 , wherein the plurality of second barrier portions and the plurality of third barrier portions are disposed alternately to connect the plurality of first barrier portions so that the first channels and the second channels are disposed alternately.

10 . The power module cooling apparatus of claim 8 , wherein a direction of extension of the plurality of first barrier portions and the direction of extension of the cooling fins intersect perpendicularly.

11 . The power module cooling apparatus of claim 1 ,

wherein the manifold cover includes a first manifold cover and a second manifold cover including the inlet and the outlet therein, and

wherein the fin plate includes a first fin plate and a second fin plate disposed to abut first and second side surfaces of the plurality of power modules, respectively, the first fin plate including a first circulation hole formed therein and the second fin plate including a second circulation hole formed therein so that the cooling fluid is circulated between respective first and second manifold covers, cooling the first and second surfaces of the plurality of power modules.

12 . The power module cooling apparatus of claim 11 , wherein each of the first manifold cover and the second manifold cover includes the inlet or the outlet formed on a first side thereof, and the first circulation hole of the first fin plate and the second circulation hole of the second fin plate are formed on a second side thereof.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2023
From: LEE, SANG HUN; PARK, HYONG JOON; KWON, SE HEUN
To: HYUNDAI MOTOR COMPANY; KIA CORPORATION
Reel/Frame 065563/0179 →
Priority Claims (1)
KR 10-2023-0080601 · Jun 22, 2023 · national
Continuity (1)
Related Publication 20240431071A1 · Dec 26, 2024
References Cited (11)
US 9445526B2 · Zhou et al. · 2016 [cited by applicant]
US 10798855B2 · Uneme · 2020 [cited by examiner]
US 11602087B2 · Zhou · 2023 [cited by examiner]
US 11849569B2 · Zhou · 2023 [cited by examiner]
US 20060096738A1 · Kang · 2006 [cited by examiner]
US 20140327128A1 · Yoo · 2014 [cited by examiner]
US 20170055378A1 · Zhou · 2017 [cited by examiner]
US 20190341327A1 · Teysseyre · 2019 [cited by examiner]
US 20210337703A1 · Lee · 2021 [cited by examiner]
US 20220248560A1 · Zhou · 2022 [cited by examiner]
KR 1020140084590 · 2014 [cited by applicant]