Granted Patent B2

US 12,740,214 · App. 18/380,972 · Granted Sep 15, 2026

Inventors: Yuanbin Lin (Wuhan, CN); Hao Li (Wuhan, CN); Bibo Li (Wuhan, CN)

H10H20/857H10W90/00H10H20/0364

Abstract

Claims (29)

1 . A display module comprising:

a substrate ( 1 ), a plurality of pixel units ( 11 ) are arrayed on the substrate ( 1 ), and each of the pixel units ( 11 ) is provided with at least three light-emitting chips ( 2 ), and centers of the at least three light-emitting chips ( 2 ) are not collinear; and

projections of the at least three light-emitting chips ( 2 ) along a first direction at least partially overlap, and projections of the at least three light-emitting chips ( 2 ) along a second direction at least partially overlap, wherein the first direction is perpendicular to the second direction, and

wherein one side of the substrate ( 1 ) is provided with at least one common A-pole pad ( 111 ) and a plurality of B-pole pads ( 112 ) in each of the pixel units ( 11 ), the A-poles of the at least three light-emitting chips ( 2 ) are electrically connected to the common A-pole pad ( 111 ), and the B-poles of the light-emitting chips ( 2 ) are respectively electrically connected to the corresponding B-pole pads ( 112 ), wherein polarities of the A-poles and the B-poles are opposite; and

another side of the substrate ( 1 ) is provided with a common pin ( 113 ) in each of the pixel units ( 11 ), and the common pin ( 113 ) is electrically connected to the common A-pole pad ( 111 ).

2 . The display module according to claim 1 , wherein each of the pixel units ( 11 ) is provided with three light-emitting chips ( 2 ), and lines connecting the centers of the three light-emitting chips ( 2 ) form an acute-angled triangle.

3 . The display module according to claim 1 , wherein a surface of the substrate ( 1 ) is covered with exposure dissolving glue ( 3 ), the exposure dissolving glue ( 3 ) forms grooves ( 4 ) on surfaces of the light-emitting chips ( 2 ), the grooves ( 4 ) are filled with colloids ( 5 ), and colors of the colloids ( 5 ) are basically the same as that of the exposure dissolving glue ( 3 ).

4 . The display module according to claim 3 , wherein the surfaces of the exposure dissolving glue ( 3 ) and the colloids ( 5 ) are covered with an optical glue ( 6 ), and the surface of the optical glue ( 6 ) is covered with a polarizer ( 7 ).

5 . A method for manufacturing a first display module, the method comprising:

fixing at least three first light-emitting chips ( 2 ) into one pixel unit ( 11 ) of a first substrate ( 1 ) so as to make centers of the at least three first light-emitting chips ( 2 ) not collinear, projections of the at least three first light-emitting chips ( 2 ) along a first direction at least partially overlap, and projections of the at least three first light-emitting chips ( 2 ) along a second direction at least partially overlap, wherein the first direction is perpendicular to the second direction;

covering a surface of the first substrate ( 1 ) with an exposure dissolving glue ( 3 ) so as to make the exposure dissolving glue ( 3 ) cover the first light-emitting chips ( 2 ); and

lighting up the first light-emitting chips ( 2 ), and dissolving the exposure dissolving glue ( 3 ) at corresponding positions of the first light-emitting chips ( 2 );

wherein the exposure dissolving glue ( 3 ) forms first grooves ( 4 ) on the surfaces of the first light-emitting chips ( 2 );

after dissolving the exposure dissolving glue ( 3 ) at the corresponding positions of the first light-emitting chips ( 2 ), the method further comprising:

filling first colloids ( 5 ) into the grooves ( 4 ), wherein colors of the first colloids ( 5 ) are basically the same as that of the exposure dissolving glue ( 3 );

wherein after filling the first colloids ( 5 ) into the grooves ( 4 ), the method further comprising:

covering the surfaces of the first colloids ( 5 ) and the exposure-dissolving glue ( 3 ) with optical glue ( 6 ); and

covering the surface of the optical glue ( 6 ) with a polarizer ( 7 ).

6 . A method for manufacturing a second display module to a first display module, the method comprising:

fixing at least three first light-emitting chips ( 2 ) into one pixel unit ( 11 ) of a first substrate ( 1 ) so as to make centers of at least three first light-emitting chips ( 2 ) not collinear, projections of at least three first light-emitting chips ( 2 ) along a first direction at least partially overlap, and projections of at least three first light-emitting chips ( 2 ) along a second direction at least partially overlap, wherein the first direction is perpendicular to the second direction;

covering a surface of the first substrate ( 1 ) with exposure dissolving glue ( 3 ) so as to make the exposure dissolving glue ( 3 ) cover the first light-emitting chips ( 2 ); and

lighting up the first light-emitting chips ( 2 ), and dissolving the exposure dissolving glue ( 3 ) at corresponding positions of the first light-emitting chips ( 2 );

fixing at least three second light-emitting chips ( 9 ) to one pixel unit ( 11 ) of a second substrate ( 8 ) so as to make the second light-emitting chips ( 9 ) in the same pixel unit ( 11 ) and the first light-emitting chips ( 2 ) of the first display module mirror images of each other;

covering a surface of the second substrate ( 8 ) with exposure dissolving glue ( 3 ) so as to make the exposure dissolving glue ( 3 ) cover the second light-emitting chips ( 9 );

aligning the first display module with the second substrate ( 8 ) so that the first light-emitting chips ( 2 ) face the second light-emitting chips ( 9 ); and

lighting up the first light-emitting chips ( 2 ), and dissolving the exposure dissolving glue ( 3 ) at corresponding positions of the second light-emitting chips ( 9 ).

7 . The manufacturing method according to claim 6 , wherein the exposure dissolving glue ( 3 ) forms second grooves ( 91 ) on the surfaces of the second light-emitting chips ( 9 );

after dissolving the exposure dissolving glue ( 3 ) at the corresponding positions of the second light-emitting chips ( 9 ), the method further comprising:

filling second colloids ( 5 ) into the second grooves ( 91 ), wherein colors of the second colloids ( 5 ) are basically the same as that of the exposure dissolving glue ( 3 ).

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (43)