Heat dissipation module
A heat dissipation module is provided. The heat dissipation module includes a substrate, a heat dissipation unit, and an overflow prevention unit. The overflow prevention unit is disposed on a surface of the substrate. The overflow prevention unit is in a sheet shape and has a plurality of mesh holes.
1 . A heat dissipation module, comprising:
a substrate;
a heat dissipation unit; and
an overflow prevention unit, the overflow prevention unit being in a sheet shape and having a plurality of mesh holes;
wherein the overflow prevention unit is disposed on a surface of the substrate, and each of the plurality of mesh holes is defined by six blocking structures to substantially form a regular hexagon;
wherein the plurality of blocking structures is arranged in a symmetrical pattern around each of the plurality of mesh holes;
wherein the heat dissipation unit is disposed on a surface of the overflow prevention unit away from the substrate;
wherein the substrate is configured to be disposed on a heat generating source;
wherein each of the blocking structures has a first projection, a second projection, and a third projection, and each of the first projection, the second projection, and the third projection has a planar top surface;
wherein a length of the first projection, a length of the second projection, and a length of the third projection are the same;
wherein the first projection and the second projection have a first angle therebetween, the second projection and the third projection have a second angle therebetween, and the first projection and the third projection have a third angle therebetween;
wherein, when each of the first angle, the second angle, and the third angle is 120°, the blocking structure is Y-shaped; and
wherein any two of the blocking structures adjacent to each other define a gap between two of the planar top surfaces that are opposing to each other.
2 . The heat dissipation module according to claim 1 , wherein the heat dissipation unit has a first state and a second state, the first state is a solid state, and the second state is a liquid state.
3 . The heat dissipation module according to claim 2 , wherein the heat dissipation unit is formed of a liquid metal of a thermal grease.
4 . The heat dissipation module according to claim 1 , wherein a thickness of the overflow prevention unit is 100% to 120% of a thickness of the substrate.