Granted Patent B2

US 12,743,134 · App. 18/409,700 · Granted Sep 22, 2026

Inventor: Wooin Ahn (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

G06F1/1656

Abstract

Claims (47)

1 . An electronic device comprising:

a housing comprising a first surface, a second surface, and a side member comprising a bezel at least partially surrounding a space between the first surface and the second surface;

a speaker hole extending through at least a portion of the side member;

a module case disposed in an interior of the space and surrounding a speaker module comprising a speaker configured to emit sound through the speaker hole; and

a waterproof structure disposed between the side member and the module case,

wherein the waterproof structure includes:

a waterproof tape member comprising a waterproof tape;

a porous member comprising a porous material having a plurality of openings, the openings having sizes smaller than a size of the speaker hole; and

a waterproof bond member comprising a waterproof bonding material extending through the plurality of openings and coupled to the waterproof tape member and the porous member while overlapping with the waterproof tape member and the porous member.

2 . The electronic device of claim 1 , wherein the waterproof structure includes a central area, and a peripheral area around the central area, and

wherein the waterproof bond member and the waterproof tape member are disposed in hollow frame shapes in the central area.

3 . The electronic device of claim 2 , wherein the porous member is disposed between the waterproof bond member and the waterproof tape member in the peripheral area.

4 . The electronic device of claim 1 , wherein the waterproof bond member is thicker than at least any one of the waterproof tape member or the porous member.

5 . The electronic device of claim 1 , wherein at least portion of at least one surface of the waterproof bond member is a curved.

6 . The electronic device of claim 5 , wherein the waterproof bond member has a curved surface convex toward an opposite direction to an introduction direction of the waterproof bond member.

7 . The electronic device of claim 1 ,

wherein at least a portion of the waterproof bond member is pressed while contacting any one of the module case or the side member, and

wherein the waterproof tape member is attached to another one of the module case or the side member.

8 . The electronic device of claim 1 , wherein the porous member includes mesh layers surrounding the plurality of openings, and

wherein the porous member includes at least any one of meshes or nonwoven fabric.

9 . The electronic device of claim 8 , wherein line widths of the mesh layers are smaller than widths and lengths of the openings.

10 . The electronic device of claim 8 , wherein spacing distances between the mesh layers are greater than spacing distances between the plurality of openings.

11 . An electronic device comprising:

a first mechanical structure comprising a surface facing an outside of the electronic device;

a second mechanical structure comprising a surface spaced apart from the first mechanical structure;

a through-hole extending through at least a portion of the first mechanical structure; and

a waterproof structure disposed between the first mechanical structure and the second mechanical structure,

wherein the waterproof structure includes:

a porous member comprising a porous material connected to the through-hole and having a plurality of openings, the openings having sizes smaller than a size of the through-hole; and

a waterproof bond member comprising a waterproof bonding material extending into the plurality of openings and coupled to the first mechanical structure and the porous member while overlapping with the first mechanical structure and the porous member.

12 . The electronic device of claim 11 , wherein when the waterproof structure is viewed from above, the waterproof structure includes a central area, and a peripheral area around the central area, and

wherein the waterproof bond member is formed in hollow frame shapes in the central area.

13 . The electronic device of claim 12 , wherein the porous member is disposed between the waterproof bond member and the first mechanical structure in the peripheral area.

14 . The electronic device of claim 12 , wherein the porous member further includes:

at least one fixing recess disposed in the peripheral area, having a size greater than a size of any one of the plurality of openings,

wherein the first mechanical structure further includes:

at least one fixing boss coupled to the fixing recess.

15 . The electronic device of claim 14 , wherein the waterproof bond member is coupled to the fixing boss.

16 . The electronic device of claim 15 , wherein the waterproof bond member has a curved surface convex toward the second mechanical structure.

17 . The electronic device of claim 11 , wherein the porous member includes mesh layers surrounding the plurality of openings, and

wherein the porous member includes at least any one of meshes and nonwoven fabric.

18 . The electronic device of claim 17 , wherein spacing distances between the mesh layers are greater than spacing distances between the plurality of openings.

19 . The electronic device of claim 11 , wherein the first mechanical structure includes a side member comprising a bezel at least partially surrounding a space between a front surface and a rear surface of the electronic device, and

wherein the second mechanical structure includes a module case surrounding a speaker module disposed in an interior of the side member.

20 . The electronic device of claim 11 , further comprising:

a side member comprising a bezel at least partially surrounding a space between a front surface and a rear surface of the electronic device,

wherein the through-hole includes at least any one of a speaker hole, a microphone hole, and a sensor hole formed through at least a portion of the side member.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (39)