Granted Patent B2

US 12,745,600 · App. 18/720,209 · Granted Sep 22, 2026

Inventors: Thomas Wagenleitner (St Florian am Inn, AT); Harald Rohringer (St. Florian am Inn, AT)

Assignee: EV Group E. Thallner GmbH

H10P72/53H10W46/00H10W46/301

Abstract

Claims (41)

1 . A method for alignment of a substrate, comprising:

providing a substrate holder with a substrate holder surface designed for mounting of the substrate and an alignment marking field arranged fixed with respect to the substrate holder;

providing another substrate holder with another substrate holder surface designed for mounting of another substrate to be bonded to the substrate;

aligning the substrate to set a bonding distance between the substrate and the other substrate as a bond gap, comprising:

detecting a first alignment mark of a first plane of the alignment marking field by a detection unit;

fixing a focal position of the detection unit after the detecting of the first alignment mark;

moving the substrate holder normal to the first plane of the alignment marking field; and

detecting a second alignment mark of a second plane of the alignment marking field by the detection unit,

wherein the substrate is aligned using the alignment marks of the alignment marking field arranged one above the other,

wherein the first plane and the second plane are arranged parallel with one another, and

wherein a distance between the first plane and the second plane corresponds with the bond gap.

2 . The method according to claim 1 , wherein, during the detecting of the first alignment mark, additional alignment marks on the substrate holder or on the substrate are detected by at least one additional detection unit.

3 . The method according to claim 1 , wherein the detection unit in the focal position continuously measures the alignment marking field during the moving of the substrate holder.

4 . The method according to claim 1 , wherein the detection unit is held fixed after the fixing of the focal position.

5 . The method according to claim 1 , wherein, during the detecting of the first alignment mark and/or during the detecting of the second alignment mark, respective information about a position of the first alignment mark inside the alignment marking field and/or a position of the second alignment mark inside the alignment marking field is additionally provided.

6 . A device for alignment of a substrate, comprising:

a substrate holder with a substrate holder surface designed for mounting of the substrate;

another substrate holder with another substrate holder surface designed for mounting of another substrate to be bonded to the substrate;

an alignment marking field with alignment marks arranged fixed with respect to the substrate holder and to the substrate;

a detection unit for detecting the alignment marks of the alignment marking field; and

a movement arrangement for moving the substrate holder,

wherein the substrate is aligned using the alignment marks arranged one above the other to set a bonding distance between the substrate and the other substrate as a bond gap,

wherein the alignment marks of the alignment marking field are arranged in a first plane and a second plane,

wherein the first plane and the second plane are arranged parallel with one another,

wherein a distance between the first plane and the second plane corresponds with the bond gap,

wherein a first alignment mark of the alignment marks of the first plane is detected in a focal position of the detection unit,

wherein the focal position of the detection unit is fixed,

wherein a second alignment mark of the alignment marks of the second plane is detected in the focal position by the detection unit, and

wherein the substrate holder is moved normal to the first plane by the movement arrangement.

7 . The device according to claim 6 , wherein the alignment marks of the first plane and the alignment marks of the second plane are arranged aligned one above the other in the alignment marking field.

8 . The device according to claim 6 , wherein the alignment marks of the first plane are arranged offset in a step-like manner with respect to the alignment marks of the second plane.

9 . The device according to claim 6 , wherein the alignment marking field is arranged on a rear side of the substrate holder facing away from the substrate holder surface.

10 . The device according to claim 9 , wherein a centre-point of the alignment marking field on the rear side of the substrate holder is at least partially aligned with a centre-point of the substrate holder surface.

11 . The device according to claim 6 , wherein the alignment marking field is arranged on a side of the substrate facing towards the substrate holder surface.

12 . The device according to claim 6 , wherein the alignment marking field comprises at least one further plane with the alignment marks, and

wherein the at least one further plane is arranged at least parallel to the first plane.

13 . The device according to claim 6 , further comprising:

at least one further alignment marking field; and

at least one further detection unit for the detection of the at least one further alignment marking field,

wherein the at least one further alignment marking field is arranged fixed with respect to the substrate holder.

14 . The device according to claim 7 , wherein the alignment marks of the first plane and the alignment marks of the second plane are arranged congruent.

Assignments (1)

Continuity (1)

References Cited (29)