IP Library › Granted Patent US 12,750,950
Granted Patent B2
US 12,750,950 · App. 17/944,857 · Granted Sep 29, 2026

Laser folded 3D electronics

Inventors: Nathan S. Lazarus (Bear, DE); Adam L. Bachmann (Tampa, FL); Michael D. Dickey (Raleigh, NC)
Assignee: The United States of America as represented by the Secretary of the Army
H05K1/028H05K3/0026H05K2201/055H05K2203/1105H05K2203/302
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Quick Facts
Patent No.
US 12,750,950
App. No.
17/944,857
Granted
Sep 29, 2026
Kind
B2
Abstract

A novel methodology of forming a three-dimensional electronic device according to various embodiments of the present invention is described. The methodology comprises, at least, a step of laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, with the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.

Claims (31)

1 . A method of forming a three-dimensional electronic device comprising:

laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.

2 . The method of claim 1 , wherein the printed circuit board comprises electrical circuit patterning and/or electrical circuit components thereon.

3 . The method of claim 1 , wherein the at least one metal layer extends substantially over a surface of the printed circuit board in a region it is to be folded.

4 . The method of claim 1 , wherein the printed circuit board comprises a polymer, plastic, rubber, ceramic, or fiberglass.

5 . The method of claim 4 , wherein the polymer comprises polyimide, polyester, polyethylene naphthalate, polytetrafluoroethylene, aramid, or epoxy.

6 . The method of claim 1 , wherein the at least one metal layer comprises copper, aluminum, nickel, gold, or silver.

7 . The method of claim 1 , further comprising: laser cutting, using the laser, the printed circuit board at least partially covered with the at least one metal layer before and/or after the laser folding.

8 . The method of claim 1 , further comprising: reducing the reflectivity of the surface of the at least one metal layer to the laser light for folding.

9 . The method of claim 8 , where reducing the reflectivity comprises: applying a coating to the surface of the at least one metal layer to reduce the reflectivity of the laser light for folding.

10 . The method of claim 9 , wherein the coating comprises a graphite or electroless nickel immersion gold (ENIG) coating.

11 . The method of claim 8 , wherein no light absorbing coating is applied or required.

12 . The method of claim 8 , wherein reducing the reflectivity comprises: oxidizing the surface of the metal layer, using the laser, before the laser folding to reduce the reflectivity of the laser light for laser folding.

13 . The method of claim 8 , wherein reducing the reflectivity comprises: laser roughening, using the laser, the surface of the at least one metal layer to reduce the reflectivity of the laser light for laser folding.

14 . The method of claim 1 , wherein the laser folding comprises: using the laser to execute one or more upward folds via a temperature gradient mechanism of the printed circuit board and/or one or more downward folds via a buckling mechanism of the printed circuit board.

15 . The method of claim 1 , further comprising: forming electrical circuit patterning on the printed circuit board from the at least one metal layer prior to laser folding.

16 . The method of claim 1 , further comprising: attaching or forming electrical components on the printed circuit board prior to laser folding.

17 . The method of claim 1 , further comprising:

clamping the two-dimensional electrically insulating printed circuit board at least partially covered with the at least one metal layer prior to laser folding.

18 . A method of laser forming a three-dimensional electronic device comprising:

providing a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer;

reducing the reflectivity of the surface of the at least one metal layer to the laser light for laser folding; and

laser folding, using only a laser, the two-dimensional printed circuit board at least partially covered with the at least one metal layer, the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.

19 . An apparatus for forming a three-dimensional electronic device comprising:

a clamp fixture to secure a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer; and

at least one laser configured to:

(i) reduce the reflectivity of the surface of the at least one metal layer to reduce the reflectivity of the laser light for laser folding;

(ii) laser cut fold a two-dimensional printed circuit board at least partially covered with the at least one metal layer; and

(iii) laser fold the two-dimensional printed circuit board at least partially covered with the at least one metal layer, the laser impinging upon the at least one metal layer to form a three-dimensional electronic device structure.

20 . The apparatus of claim 19 , wherein the at least one laser comprises a single laser which can operate in different power modes for performing steps (i), (ii) and (iii).

21 . The apparatus of claim 19 , further comprising equipment configured to: (iv) form electrical circuit patterning on the printed circuit board from the at least one metal layer prior to laser folding, and/or (v) attach electrical components on the printed circuit board prior to laser folding.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2026
From: NORTH CAROLINA STATE UNIVERSITY
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 075614/0570 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2026
From: DICKEY, MICHAEL D.
To: NORTH CAROLINA STATE UNIVERSITY
Reel/Frame 075614/0673 →
Continuity (1)
Related Publication 20240090126A1 · Mar 14, 2024
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