Silicon on insulator (SOI) negative differential resistance (NDR) based memory device with reduced body effects
A silicon-on-insulator (SOI) memory device (such as an SRAM) using negative differential resistance (NDR) elements is disclosed. Body effect performances for NDR FETs (and other FETs) that may be used in such device are enhanced by floating a body of some/all the NDR FETs.
1. A method of operating a silicon on insulator (SOI) based memory device having three active elements, including a transfer field effect transistor (FET), a first negative differential resistance (NDR) element and a second NDR element including the steps of:
coupling the transfer FET, the first NDR element and the second NDR element so that they can store a data value for the SOI based memory device using an NDR characteristic of the first NDR element and the second NDR element;
biasing a body region of at least the first NDR element so as to cause said body region to be fully depleted and reduce body effects for the SOI based memory device.
2. The method of claim 1 , wherein said body region of the first NDR element is fully depleted during at least a period when the first NDR element is in an ON state.
3. The method of claim 1 , where the first NDR element is implemented as a SOI-based NDR-capable FET.
4. The method of claim 3 , further including a step: rapidly trapping and de-trapping charge in a charge trap region of the first NDR element to cause said NDR characteristic.
5. The method of claim 3 , wherein the second NDR element is a tunnel diode and/or an NDR capable FET.
6. The method of claim 1 , further including a step of applying a common bias signal to the first NDR element and the second NDR element.
7. The method of claim 6 , wherein said common bias signal is also applied to a first drain region of either the first NDR element or the second NDR element.
8. The method of claim 1 , wherein said data value is stored at a node shared by the first NDR element, the second NDR element, and the transfer FET.