Methods of fabricating a molded ball grid array
A method and apparatus for encapsulating a BGA package. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.
1. A method of fabricating a circuit package comprising a substrate, the method comprising the acts of:
coupling a plurality of conductive balls to the substrate;
disposing the substrate between an upper mold and a lower mold;
disposing a liner over the substrate such that the conductive balls are brought in direct contact with the liner;
disposing an encapsulant onto the substrate and about a portion of the conductive balls such that the encapsulant conformally contacts the conductive balls; and
applying a force to one of the liner and the substrate such that the conductive balls compress the liner, wherein the amount of compression defines a portion of the conductive balls about which the encapsulant is not disposed.
2. The method, as set forth in claim 1 , wherein the act of coupling comprises the act of coupling a plurality of solder balls to the substrate.
3. The method, as set forth in claim 1 , wherein the act of coupling comprises the act of coupling a plurality of conductive balls to the substrate, wherein the conductive balls have a diameter of about 0.4 mm.
4. The method, as set forth in claim 1 , wherein the act of disposing comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 40% to about 85% of the diameter of the conductive balls.
5. The method, as set forth in claim 1 , wherein the act of disposing comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 50% to about 70% of the diameter of the conductive balls.
6. The method, as set forth in claim 1 , wherein the act of disposing comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by greater than 50% of the diameter of the conductive balls.
7. The method, as set forth in claim 1 , comprising the act of coupling a semiconductor device to the substrate.
8. The method, as set forth in claim 1 , wherein the act of disposing a liner comprises the act of disposing a liner having a thickness of about 0.3 mm.
9. The method, as set forth in claim 1 , wherein the act of disposing a liner comprises the act of disposing a fluoropolymer film.
10. The method, as set forth in claim 1 , wherein the act of disposing a liner comprises the act of disposing an ethylene tetrafluoroethylene copolymer film.
11. A method of molding a circuit package comprising the acts of:
disposing a first mold adjacent to a circuit package, wherein the circuit package comprises conductive balls coupled to a substrate;
disposing a liner over the substrate and the conductive balls;
pressing the circuit package and the liner together such that the liner is conformally compressed by the conductive balls, wherein the liner conformally covers a portion of the surface area of the conductive balls; and
disposing an encapsulant about a portion of the conductive balls not conformally covered by the liner.
12. The method, as set forth in claim 11 , wherein the act of disposing a liner comprises the act of disposing a liner having a thickness of about 0.3 mm.
13. The method, as set forth in claim 11 , wherein the act of disposing a liner comprises the act of disposing a fluoropolymer film.
14. The method, as set forth in claim 11 , wherein the act of disposing a liner comprises the act of disposing an ethylene tetrafluoroethylene copolymer film.
15. The method, as set forth in claim 11 , wherein the act of disposing a liner comprises the act of disposing a second mold having a resilient surface.
16. The method, as set forth in claim 11 , wherein the act of disposing an encapsulant comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 40% to about 85% of the diameter of the conductive balls.
17. The method, as set forth in claim 11 , wherein the act of disposing an encapsulant comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 50% to about 70% of the diameter of the conductive balls.
18. The method, as set forth in claim 11 , wherein the act of disposing an encapsulant comprises the act of disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by greater than 50% of the diameter of the conductive balls.
19. The method, as set forth in claim 11 , wherein the act of disposing an encapsulant comprises the act of injecting the encapsulant.
20. A method of fabricating a circuit package comprising a semiconductor device and a substrate, the method comprising:
coupling the semiconductor device to a first side of the substrate;
coupling a plurality of conductive balls to a second side of the substrate;
disposing a liner over the substrate such that the conductive balls are brought in direct contact with the liner;
disposing an encapsulant onto the second side of the substrate and about a portion of the conductive balls such that the encapsulant conformally contacts the conductive balls; and
applying force to one of the liner or the substrate such that the conductive balls compress the liner, wherein the amount of compression defines a portion of the conductive balls about which the encapsulant is not disposed.
21. The method, as set forth in claim 20 , wherein coupling the plurality of conductive balls comprises coupling a plurality of solder balls to the substrate.
22. The method, as set forth in claim 20 , wherein coupling the plurality of conductive balls comprises coupling a plurality of conductive balls to the substrate, wherein the conductive balls have a diameter of about 0.4 mm.
23. The method, as set forth in claim 20 , wherein disposing comprises disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 40% to about 85% of the diameter of the conductive balls.
24. The method, as set forth in claim 20 , wherein disposing comprises disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by about 50% to about 70% of the diameter of the conductive balls.
25. The method, as set forth in claim 20 , wherein disposing comprises disposing the encapsulant about a portion of the conductive balls, wherein the portion is a surface area defined by greater than 50% of the diameter of the conductive balls.
26. The method, as set forth in claim 20 , wherein disposing a liner comprises the act of disposing a liner having a thickness of about 0.3 mm.
27. The method, as set forth in claim 20 , wherein disposing a liner comprises disposing a fluoropolymer film.