Contact probe and probe device
A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
1. A probe device comprising:
a first film having a plurality of first wiring patterns on a surface thereof, said first wiring patterns having first projections extending from said first film;
a second film having a plurality of second wiring patterns on a surface thereof, said second wiring patterns having second projections extending from said second film; and,
a single contact probe main body comprising a plurality of contact pins, each of said first projections from said first film and said second projections from said second film connected to one of said plurality of contact pins on a same surface in said single contact probe main body.
2. The probe device recited in claim 1 , further comprising a printed wiring board, said printed wiring board having third wiring patterns on a first surface and a second surface, said third wiring patterns on said first surface connected to said first wiring patterns on said first film, said third wiring patterns on said second surface connected to said second wiring patterns on said second film.
3. The probe device recited in claim 2 , wherein said first projections from said first film are connected to every other of said plurality of contact pins.
4. The probe device recited in claim 3 , wherein said first projections from said first film comprise copper.
5. The probe device recited in claim 4 , wherein said second projections from said second film comprise nickel.
6. The probe device recited in claim 1 , wherein said first projections from said first film are connected to every other of said plurality of contact pins.
7. The probe device recited in claim 1 , wherein said first projections from said first film comprise copper.
8. The probe device recited in claim 1 , wherein said second projections from said second film comprise nickel.
9. The probe device recited in claim 1 , wherein said contact pins comprise nickel.
10. The probe device recited in claim 1 , wherein said contact pins are coated with gold.
11. A probe device comprising:
a first film having a plurality of first wiring patterns on a surface thereof, said first wiring patterns having first projections extending from said first film;
a second film having a plurality of second wiring patterns on a surface thereof, said second wiring patterns having second projections extending from said second film;
a contact probe main body comprising a plurality of contact pins, each of said first projections from said first film and said second projections from said second film connected to one of said plurality of contact pins; and
a printed wiring board, said printed wiring board having third wiring patterns on a first surface and a second surface, said third wiring patterns on said first surface connected to said first wiring patterns on said first film, said third wiring patterns on said second surface connected to said second wiring patterns on said second film.
12. The probe device recited in claim 11 , wherein said first projections from said first film are connected to every other of said plurality of contact pins.
13. The probe device recited in claim 12 , wherein said first projections from said first film comprise copper.
14. The probe device recited in claim 13 , wherein said second projections from said second film comprise nickel.
15. The probe device recited in claim 11 , wherein said first projections from said first film comprise copper.
16. The probe device recited in claim 11 , wherein said second projections from said second film comprise nickel.
17. The probe device recited in claim 11 , wherein said contact pins comprise nickel.
18. The probe device recited in claim 17 , wherein said contact pins are coated with gold.
19. The probe device recited in claim 11 , wherein said contact pins are coated with gold.