Writer core structures having improved thermal dissipation properties
A data transducer is used for writing data to a disc and has an air bearing surface. The data transducer also includes a bottom pole and a top pole separated from the bottom pole at the air bearing surface by a write gap. A core is formed between the bottom pole and the top pole and a conductive coil is positioned within the core. The data transducer further includes an insulator conformed to turns of the conductive coil and a core fill deposited within the entire core wherein the core fill is a high-thermal conductivity material. The insulator and core fill dissipate thermal energy away from the conductive coil.
1. A data transducer for writing data to a disc, the data transducer having an air bearing surface, the data transducer comprising:
a bottom pole;
a top pole separated from the bottom pole at the air bearing surface by a write gap wherein a core is formed between the bottom pole and the top pole;
a conductive coil positioned within the core;
an insulator conformed to turns of the conductive coil; and
a core fill deposited within the core wherein the core fill is a high-thermal conductivity material that fills the core entirely, and wherein the insulator and core fill dissipate thermal energy away from the conductive coil.
2. The data transducer of claim 1 wherein a thermal conductivity of the core fill is greater than about 1.5 W/m-K.
3. The data transducer of claim 1 wherein the core fill is selected from a group consisting of SiC, AlN, Poly-Si, W, and Mo.
4. The data transducer of claim 1 wherein the core fill is insulating, semiconducting, or conducting.
5. The data transducer of claim 1 wherein the insulator is selected from a group consisting of Al 2 O 3 , Ta 2 O 5 , HfO 2 , TiO 2 , ZrO 2 , CuO, Nb 2 O 5 , SiO 2 , In 2 O 3 , MgO, TiN, TaN, MoN, NbN, SiN, AlN, WN, W 2 N, and BN.
6. A data transducer for writing data to a disc and characterized by a bottom pole, an upper shared pole, a top pole wherein the bottom pole, upper shared pole and top pole define a core, and a thermally dissipative writer core structure formed within the core, the writer core structure comprising:
a first insulator deposited on the bottom pole;
a conductive coil patterned upon the first insulator;
a second insulator encapsulating the coil; and
a core fill deposited into the core wherein the core fill is a highly conductive material that fills the core entirely.
7. The writer core structure of claim 6 wherein the first insulator has a thickness of about 0.3 microns.
8. The writer core structure of claim 6 wherein the first insulator and the second insulator are selected from a group consisting of Al 2 O 3 , Ta 2 O 5 , HfO 2 , TiO 2 , ZrO 2 , CuO, Nb 2 O 5 , SiO 2 , In 2 O 3 , MgO, TiN, TaN, MoN, NbN, SiN, AlN, WN, W 2 N, and BN.
9. The writer core structure of claim 6 wherein the second insulator has a thickness between about 200 angstroms and about 1000 angstroms.
10. The writer core structure of claim 6 wherein the core fill is selected from a group consisting of SiC, AiN, Poly-Si, W, and Mo.
11. The writer core structure of claim 6 wherein the core fill has a thermal conductivity greater than about 1.5 W/m-K.
12. The writer core structure of claim 6 wherein the core fill has a coefficient of thermal expansion less than 6.0×10 −6 /° C.
13. A data transducer for writing data to a disc and characterized by a bottom pole, an upper shared pole, a top pole wherein the bottom pole, upper shared pole and top pole define a core, and a thermally dissipative writer core structure formed within the core, the writer core structure comprising:
a core fill deposited into the core wherein the core fill is a highly conductive material that fills the core entirely;
coil trenches patterned into the core material;
a first insulator conformed to sidewalls of the coil trenches;
a conductive coil patterned within the coil trenches wherein the first insulator separates the coil from the core fill; and
a top insulator deposited on a top surface of the coil.
14. The writer core structure of claim 13 wherein the core fill is selected from a group consisting of SiC, AlN, Poly-Si, W, and Mo.
15. The writer core structure of claim 13 wherein the core fill has a thermal conductivity greater than about 1.5 W/m-K.
16. The writer core structure of claim 13 wherein the core fill has a coefficient of thermal expansion less than 6.0×10 −6 /° C.
17. The writer core structure of claim 13 wherein the first insulator and the top insulator are selected from a group consisting of Al 2 O 3 , Ta 2 O 5 , HfO 2 , TiO 2 , ZrO 2 , CuO, Nb 2 O 5 , SiO 2 , In 2 O 3 , MgO, TiN, TaN, MoN, NbN, SiN, AlN, WN, W 2 N, and BN.