Etched hole-fill stand-off
View Patent ↗An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.
1. An assembly comprising:
an etched hole-fill stand-off wherein the etched hole-fill stand-off comprises a copper clad laminate having a dielectric layer laminated between a first and a second copper layer wherein the at least one hole of the stand-off is etched through the first copper layer but not through either the dielectric layer or second copper layer;
a tooling plate contacting the etched hold-fill stand-off, the stand-off and tooling plate being aligned to each other;
a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; and
the device and the stand-off each having at least one hole, the at least one hole of the device being aligned with the at least one hole of the stand-off.
2. The assembly of claim 1 wherein hole of the stand-off is larger in diameter than the hole of the device.
3. The assembly of claim 1 wherein the device comprises a plurality of holes to be filled and the stand-off comprises a plurality of holes wherein each hole to be filled of the device is aligned with a hole of the stand-off.
4. The assembly of claim 1 wherein the stand-off comprises an external copper layer and the device comprises an external copper layer, the layer of the stand-off being in direct contact wit the layer of the device.
5. The assembly of claim 4 , wherein the at least one hole of the stand-off extends only through the external copper layer of the stand-off.
6. The assembly of claim 1 wherein a first set of pins aligns the stand-off to the tooling plate and a second set of pins aligns the device to the stand-off.
7. The assembly of claim 6 wherein the stand-off rests on but is not bonded to tooling-plate other than by the pins aligning the stand-off and the tooling plate, and the device rests on but is not bonded to the stand-off other than by the pins aligning the stand-off and the device.
8. The assembly of claim 1 wherein at least one hole of the device is filled with a fill material that extends partially into a hole of the stand-off without contacting the stand-off.
9. An assembly comprising an etched hole-fill stand-off, the stand-off comprising an etched layer bonded to a non-etched layer; wherein the etched hole-fill stand-off comprises a copper clad laminate having a dielectric layer laminated between a first and a second copper layer wherein the at least one hole of the stand-off is etched through the first copper layer but not through either the dielectric layer or second copper layer.
10. The assembly of claim 9 further comprising:
a tooling plate contacting the non-etched layer of the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other;
a device having holes to be filled removably contacting the etched layer of the stand-off, the stand-off and device being aligned to each other; and
the device and the stand-off each having at least one hole, the hole of the device being aligned wit the hole of the stand-off the hole of the stand-off having a larger diameter than the hole of the device.
11. A method of filling holes in a substrate having a plurality of holes to be filled, comprising:
providing an etched hole-fill stand-off, the stand-off comprising a copper clad laminate having a dielectric layer laminated between a first and a second copper layer wherein at least one hole of the stand-off is aligned with at least one hole of the substrate to be filled, the at least one hole of the stand-off being etched through the first copper layer, but not through either the dielectric layer or second copper layer;
aligning the stand-off to a tooling plate by overlaying the stand-off on the tooling plate;
aligning the substrate to the stand-off and placing the substrate in contact with the stand-off; and
filling the plurality of holes of the substrate.
12. The method of claim 11 wherein the at least one hole of the stand-off is larger in diameter than the at least one hole of the substrate.
13. The method of claim 11 wherein the substrate comprises a plurality of holes to be filled and the stand-off comprises a plurality of holes wherein each hole to be filled of the substrate is aligned with a hole of the stand-off.
14. The method of claim 13 , wherein the at least one hole of the stand-off extends only through the external copper layer of the standoff.
15. The method of claim 11 wherein a first set of pins aligns the stand-off to the tooling plate and a second set of pins aligns the substrate to the stand-off.
16. The method of claim 15 wherein the standoff rests on but is not bonded to tooling-plate other than by the pins aligning the stand-off and the tooling plate, and the substrate rests on but is not bonded to the stand-off other than by the pins aligning the stand-off and the substrate.
17. The method of claim 11 wherein at least one hole of the substrate is filled with a fill material that extends partially into a hole of the stand-off without contacting the stand-off.
18. An etched hole-fill stand-off to support a printed wiring board, comprising:
a non-etched copper layer;
an etched copper layer having a plurality of etchings, wherein at least on etching of the plurality of etchings is aligned with a hole of the printed wiring board, and
a dielectric layer laminated between the non-etched copper layer and the etched copper layer.
19. The etched hole-fill stand-off of claim 18 wherein the at least one etching is larger in than the hole of the printed wiring board.
20. The etched hole-fill stand-off of claim 18 wherein the printed wiring board comprises a plurality of holes to be filled, wherein each hole to be filled of the printed wiring board is aligned with an etching of the plurality of etchings of the stand-off.
21. The etched hole-fill stand-off of claim 20 , wherein the at least one hole of the stand-off extends only through the external copper layer of the stand-off.
22. The etched hole-fill stand-off of claim 18 wherein a first sex of pins aligns the stand-off to the tooling plate and a second set of pins aligns the printed wiring board to the stand-off.
23. The etched hole-fill stand-off of claim 21 wherein the stand-off rests on but is not bonded to the tooling-plate other than by the pins aligning the stand-off and the tooling plate, and the printed wiring board rests on but is not bonded to the stand-off other than by the pins aligning the stand-off and the printed wiring board.
24. The etched hole-fill stand-off of claim 18 wherein at least one hole of the printed wiring board is filled with a fill material that extends partially into an etching of the stand-off without contacting the stand-off.