IP Library Granted Patent US 7,109,530
Granted Patent B2
US 7,109,530 · App. 10/796,154 · Granted Sep 19, 2006

Nitride-based semiconductor element

Assignee: Sanyo Electric Co., Ltd.
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Quick Facts
Patent No.
US 7,109,530
App. No.
10/796,154
Granted
Sep 19, 2006
Kind
B2
Abstract

A nitride-based semiconductor element having excellent element characteristics is obtained by fabricating a nitride-based semiconductor layer having excellent crystallinity without performing extended etching. The nitride-based semiconductor element comprises a mask layer, having a recess portion, formed on a substantially flat upper surface of an underlayer to partially expose the upper surface of the underlayer, a nitride-based semiconductor layer formed on the exposed part of the underlayer and the mask layer while forming a void on the recess portion of the mask layer, and a nitride-based semiconductor element layer, formed on the nitride-based semiconductor layer, having an element region. During laterally growth, strain is relaxed thereby improving crystallinity. The underlayer is formed in a substantially flat shape, thereby avoiding extended etching.

Claims (14)

1. A nitride-based semiconductor element comprising:

a mask layer, having a recess portion on an upper surface of said mask layer, formed on projection portions of an underlayer having said projection portions on upper surface on said underlayer to partially expose said upper surface of said underlayer;

a nitride-based semiconductor layer formed on said exposed part of said underlayer and said mask layer while forming a void on said recess portion of said mask layer; and

a nitride-based semiconductor element layer, formed on said nitride-based semiconductor layer, having an element region.

2. The nitride-based semiconductor element according to claim 1 , wherein

said recess portion of said mask layer includes a dent provided on at least part of said upper surface of said mask layer.

3. The nitride-based semiconductor element according to claim 1 , wherein

said recess portion of said mask layer includes a concavely curved upper surface of said mask layer.

4. The nitride-based semiconductor element according to claim 3 , wherein

said mask layer has an overhanging shape, and

said upper surface of said overhanging mask layer is concavely curved.

5. The nitride-based semiconductor element according to claim 1 , wherein

said underlayer includes a substrate, and

said mask layer is formed to be in contact with said upper surface of said substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2017
From: SANYO ELECTRIC CO., LTD.
To: EPISTAR CORPORATION
Reel/Frame 041652/0122 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: FUTURE LIGHT LIMITED LIABILITY COMPANY
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 040523/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2012
From: SANYO ELECTRIC CO., LTD.
To: FUTURE LIGHT, LLC
Reel/Frame 027957/0258 →
Priority Claims (1)
JP 2001-56284 · Mar 1, 2001 · national
Continuity (2)
Division 1008405000 · Feb 28, 2002
Related Publication 20040169193A1 · Sep 2, 2004