Plating buss and a method of use thereof
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.
1. A method for manufacturing a printed circuit, the method comprising:
providing a substrate panel;
providing a plurality of printed circuit boards on the substrate, said printed circuit boards having a plurality of conductive traces provided on the substrate; and
interconnecting said plurality of conductive traces with a serpentine plating buss provided on the substrate between adjacent ones of the plurality of printed circuit boards.
2. The method of claim 1 , wherein said substrate panel is non-conductive.
3. The method of claim 1 , wherein the substrate panel is a non-conductive material comprising phenolic, glass-impregnated epoxy, polymide, FR4, FR5, and combinations thereof.
4. The method of claim 1 , wherein the serpentine plating buss is provided along a street between adjacent boards.
5. The method of claim 1 , wherein the serpentine plating buss defines an improved process window for PCB singulation which is wider than a process window defined by a straight-line plating buss.
6. The method of claim 1 , wherein the serpentine plating buss defines a PCB singulation process window greater or equal to about ±0.165 mm from centerline of a street between adjacent boards.
7. The method of claim 1 , wherein the serpentine plating buss is provided in a pattern selected from the group comprising accordion, rectangular, saw toothed, triangular, curvilinear, and combinations thereof.
8. A method for manufacturing a printed circuit, the method comprising:
providing a substrate having at least a pair of adjacent segments, said substrate having a conductive serpentine plating buss interconnecting conductive traces of the pair of adjacent segments; and
singulating said substrate, said singulation removing a portion of said serpentine plating buss which disconnects said conductive traces.
9. The method of claim 8 , wherein the serpentine plating buss is provided in a pattern selected from the group comprising accordion, rectangular, saw toothed, triangular, curvilinear, and combinations thereof.
10. A method for manufacturing a printed circuit board, comprising:
providing an unclad laminated substrate panel used for forming a plurality of printed circuit boards;
associating an image of a desired circuitry pattern with the panel, said image comprises various circuitry traces interconnected by a serpentine plate buss; and
developing the panel, wherein the desired circuitry pattern is defined on the panel.
11. The method of claim 10 wherein the image is a positive image of the desired circuitry pattern.
12. The method of claim 10 wherein the image is a negative image of the desired circuitry pattern.
13. The method of claim 10 wherein the serpentine plating buss is provided in a pattern selected from the group comprising accordion, rectangular, saw toothed, triangular, curvilinear, and combinations thereof.
14. The method of claim 10 further comprising performing electroplating, wherein the serpentine plating buss is used to make electrical contact for improved electrical conductivity and/or wire bondability in termination areas of each of the printed circuit board provided on panel.
15. The method of claim 10 further comprising performing singulation on the panel to separate the plurality of punted circuit boards, wherein singulation removes a portion on the serpentine plating buss thereby disconnecting said conductive traces.