Die-up ball grid array package with printed circuit board attachable heat spreader
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
1. A ball grid array (BGA) package, comprising:
a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein a die attach pad having an area is formed as an exposed metal pad in a first layer of said substrate and a centrally located contact plane having an area and location that corresponds to said die attach pad is formed as an exposed metal pad in a second layer of said substrate, wherein a surface of said first layer is said first surface of said substrate and a surface of said second layer is said second surface of said substrate, and wherein said die attach pad is coupled to said contact plane by at least one thermally conductive via through said substrate;
a rigid metal thermal connector that has a first surface attached to said contact plane, wherein a second surface of said rigid metal thermal connector is capable of being attached to a printed circuit board (PCB);
an integrated circuit (IC) die that is mounted to said die attach pad; and
a first wire bond that couples a first bond pad on said IC die to one of said plurality of contact pads,
wherein a thickness of said contact plane is substantially less than a thickness of said rigid metal thermal connector.
2. The package of claim 1 , further comprising:
a second wire bond that couples a second bond pad on said IC die to said die attach pad.
3. The package of claim 2 , wherein said at least one thermally conductive via is electrically conductive.
4. The package of claim 3 , further comprising:
an electrically conductive adhesive layer for attaching said thermal connector to said contact plane.
5. The package of claim 4 , wherein said second wire bond, said die attach pad, said at least one electrically conductive via, said contact plane, said electrically conductive adhesive layer, and said thermal connector provide an electrically conductive path to a printed circuit board (PCB) when the package is mounted to the PCB.
6. The package of claim 2 , wherein said second bond pad is coupled to a ground potential signal in said IC die.
7. The package of claim 2 , wherein said second bond pad is coupled to a power potential signal in said IC die.
8. The package of claim 2 , further comprising:
an encapsulating material that encapsulates said IC die and said first and second wire bonds on said first surface of said substrate.
9. The package of claim 8 , wherein said encapsulating material is a resin, a mold compound, or an epoxy.
10. The package of claim 1 , further comprising:
a thermally conductive adhesive layer for mounting said IC die to said die attach pad.
11. The package of claim 10 , further comprising:
a second thermally conductive adhesive layer for attaching said thermal connector to said contact plane.
12. The package of claim 11 , wherein said first thermally conductive adhesive layer, said die attach pad, said at least one thermally conductive via, said contact plane, said second thermally conductive adhesive layer, and said thermal connector provide a thermally conductive path to a printed circuit board (PCB) when the package is mounted to the PCB.
13. The package of claim 1 , wherein said substrate is an organic substrate.
14. The package of claim 1 , wherein said thermal connector includes at least one metal.
15. The package of claim 14 , wherein said at least one metal includes copper.
16. The package of claim 14 , wherein said at least one metal includes aluminum.
17. The package of claim 1 , wherein said thermal connector is substantially planar.
18. The package of claim 1 , wherein said die attach pad and said contact plane each include at least one metal.
19. The package of claim 18 , wherein said at least one metal is copper.
20. A ball grid array (BGA) package, comprising:
a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein a die attach pad having an area is formed as an exposed metal pad in a first layer of said substrate and a centrally located contact plane having an area and location that corresponds to said die attach pad is formed as an exposed metal pad in a second layer of said substrate, wherein a surface of said first layer is said first surface of said substrate and a surface of said second layer is said second surface of said substrate, and wherein said die attach pad is coupled to said contact plane by at least one thermally conductive via through said substrate;
a rigid metal heat spreader that has a first surface attached to said contact plane, wherein a second surface of said rigid metal heat spreader is capable of being attached to a printed Circuit board (PCB);
an integrated circuit (IC) die that is mounted to said die attach pad; and
a first wire bond that couples a first bond pad on said IC die to one of said plurality of contact pads,
wherein a thickness of said contact plane is substantially less than a thickness of said rigid metal heat spreader.
21. The package of claim 20 , further comprising:
a second wire bond that couples a second bond pad on said IC die to said die attach pad.
22. A ball grid array (BGA) package, comprising:
a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein a die attach pad having an area is formed as an exposed metal pad in a first layer of said substrate and a centrally located contact plane having an area and location that corresponds to said die attach pad is formed as an exposed metal pad in a second layer of said substrate, wherein a surface of said first layer is said first surface of said substrate and a surface of said second layer is said second surface of said substrate, and wherein said die attach pad is coupled to said contact plane by at least one thermally conductive via through said substrate;
a rigid metal heat sink that has a first surface attached to said contact plane, wherein a second surface of said rigid metal heat sink is capable of being attached to a printed circuit board (PCB);
an integrated circuit (IC) die that is mounted to said die attach pad; and
a first wire bond that couples a first bond pad on said IC die to one of said plurality of contact pads,
wherein a thickness of said contact plane is substantially less than a thickness of said rigid metal heat sink.
23. The package of claim 22 , further comprising:
a second wire bond that couples a second bond pad on said IC die to said die attach pad.
24. A ball grid array (BGA) package, comprising:
a substantially planar substrate having a plurality of contact pads on a first surface electrically connected through said substrate to a plurality of solder ball pads on a second surface of said substrate, wherein said substrate further comprises:
a metal die pad centrally located on the first surface of said substrate, said metal die pad having an area, wherein said metal die pad is formed as an exposed metal pad in a first layer of said substrate;
a metal contact plane on said second surface of said substrate having an area and location that corresponds to said die pad, wherein said metal contact plane is formed as an exposed metal pad in a second layer of said substrate; and
an array of electrically and thermally conductive vias through said substrate that connect said die pad to said contact plane;
a rigid metal thermal connector that has a first surface attached to said contact plane, wherein a second surface of said rigid metal thermal connector is capable of being attached to a printed circuit board (PCB);
an integrated circuit (IC) die that is mounted to said metal die pad; and
a first wire bond that couples a first bond pad on said IC die to one of said plurality of contact pads,
wherein a thickness of said contact plane is substantially less than a thickness of said rigid metal thermal connector.
25. The package of claim 24 , further comprising:
a second wire bond that couples a second bond pad on said IC die to said metal die pad.
26. The package of claim 25 , further comprising:
an electrically conductive adhesive layer for attaching said rigid metal thermal connector to said metal contact plane.
27. The package of claim 26 , wherein said metal die pad, said array of electrically and thermally conductive vias, said metal contact plane, said electrically conductive adhesive layer, and said rigid metal thermal connector provide an electrically conductive path to a printed circuit board (PCB) when the package is mounted to the PCB.