Barrier layer, IC via, and IC line forming methods
A barrier layer forming method includes providing a porous dielectric layer over a substrate, the dielectric layer having a surface with exposed pores, and treating the dielectric layer with a plasma formed from a methane-containing gas. The treating seals the exposed pores. The method includes depositing a barrier layer over the surface, the barrier layer being continuous over the sealed pores. The porous dielectric may be low K. The plasma may be formed at a bias of at least about 100 volts.
1. A barrier layer forming method comprising:
providing a porous dielectric layer over a substrate and an opening in the dielectric layer, the opening having a sidewall and a bottom, the sidewall having exposed pores;
treating the dielectric layer with a plasma formed from a methane-containing gas, the treating sealing the exposed pores of the sidewall, but not sealing the bottom; and
depositing a barrier layer at least over the sidewall, the barrier layer being continuous over the sealed pores.
2. The method of claim 1 wherein the exposed pores comprise open pores.
3. The method of claim 1 further comprising providing a metal fill in the opening with metal containing copper and/or aluminum over the barrier layer, the barrier layer allowing less penetration of the metal into the dielectric layer compared to an otherwise identical barrier layer formed without the treating.
4. The method of claim 1 wherein the plasma is formed at a bias of at least about 100 volts.
5. The method of claim 1 wherein the treating deposits a carbon layer, sealing the exposed pores.
6. The method of claim 1 wherein the methane-containing gas does not comprise a halogen.
7. The method of claim 1 wherein the methane-containing gas consists of methane and, optionally, an inert carrier gas.
8. The method of claim 1 wherein depositing the barrier layer comprises atomic layer deposition.
9. The method of claim 1 wherein depositing the barrier layer comprises chemical vapor deposition.
10. The method of claim 1 wherein the barrier layer comprises titanium, titanium nitride, tantalum, tantalum nitride, or combinations thereof.
11. A barrier layer forming method comprising:
providing a porous, low K dielectric layer over a substrate and an opening in the dielectric layer, the opening having a sidewall and a bottom, the sidewall including open pores;
treating the dielectric layer with a plasma formed from a methane-containing gas at a bias of at least about 100 volts, the treating sealing the open pores of the sidewall, but not sealing the bottom; and
depositing a barrier layer at least over the sidewall, the barrier layer being continuous over the sealed pores.
12. The method of claim 11 wherein the substrate includes an electrical node and the opening is formed through the dielectric layer to expose the node.
13. The method of claim 11 wherein providing the opening comprises a dual damascene process and provides a trench and a via opening.
14. The method of claim 11 wherein the treating deposits a carbon layer, sealing the open pores.
15. The method of claim 11 wherein the methane-containing gas does not comprise a halogen.
16. The method of claim 11 wherein the methane-containing gas consists of methane and, optionally, an inert carrier gas.
17. The method of claim 11 further comprising providing a metal fill in the opening with metal containing copper and/or aluminum over the barrier layer, the barrier layer allowing less penetration of the metal into the dielectric layer compared to an otherwise identical barrier layer formed without the treating.
18. The method of claim 17 wherein the metal fill forms a conductive via.
19. The method of claim 17 wherein the metal fill forms a conductive line extending across the dielectric layer and connecting electrical nodes.
20. The method of claim 11 wherein depositing the barrier layer comprises atomic layer deposition.
21. The method of claim 11 wherein depositing the barrier layer comprises chemical vapor deposition.
22. The method of claim 11 wherein the barrier layer comprises titanium, titanium nitride, tantalum, tantalum nitride, or combinations thereof.
23. An integrated circuit via forming method comprising:
providing a porous, low K dielectric layer over a semiconductive substrate including an electrical node;
forming a masking layer over the dielectric layer and patterning the masking layer to expose a portion of the dielectric layer;
forming a via opening through the exposed portion of the dielectric layer to expose the node, the opening having a sidewall including open pores;
removing the patterned masking layer;
treating the dielectric layer with a plasma formed from a methane-containing gas at a bias of at least about 100 volts, the treating depositing a carbon layer sealing the open pores of the sidewall but not depositing a carbon layer over the node;
atomic layer depositing a barrier layer at least over the sidewall, the barrier layer being continuous over the sealed pores; and
filling the opening with metal containing copper and/or aluminum over the barrier layer and in electrical connection with the node, the metal fill forming a conductive via to the node.
24. The method of claim 23 wherein the patterned masking layer is removed before the treating.
25. The method of claim 23 wherein the patterned masking layer is removed after the treating.
26. The method of claim 23 wherein forming the via opening comprises a dual damascene process and further provides a trench.
27. The method of claim 26 wherein the metal fill further forms a conductive line in the trench extending across the dielectric layer and connecting electrical nodes.
28. The method of claim 23 wherein the methane-containing gas does not comprise a halogen.
29. The method of claim 23 wherein the methane-containing gas consists of methane and, optionally, an inert carrier gas.
30. The method of claim 23 wherein the barrier layer allows less penetration of the metal into the dielectric layer compared to an otherwise identical barrier layer formed without the treating.
31. The method of claim 23 wherein the barrier layer comprises titanium, titanium nitride, tantalum, tantalum nitride, or combinations thereof.