Lithographic apparatus and device manufacturing method
A lithographic apparatus is disclosed. The apparatus includes an illumination system arranged to condition a radiation beam, and an article support configured to support an article to be placed in a beam path of the radiation beam. The article support includes a plurality of bonded layers. At least one of the bonded layers includes a plurality of recesses facing another of the bonded layers, so as to reduce a bonding surface between the bonded layers.
1. A lithographic apparatus comprising:
an illumination system arranged to condition a radiation beam; and
an article support configured to support an article to be placed in a beam path of said radiation beam, said article support comprising a plurality of bonded layers,
wherein at least one of said bonded layers comprises a plurality of recesses facing another of said bonded layers so as to reduce a bonding surface therebetween.
2. A lithographic apparatus according to claim 1 , wherein a first one of said bonded layers comprises a plurality of protrusions forming said recesses, facing a second one of said bonded layers, and wherein said first and said second bonded layers are bonded by a bonding layer.
3. A lithographic apparatus according to claim 2 , wherein said bonding layer is an anodic bonding layer.
4. A lithographic apparatus according to claim 3 , wherein said bonding layer comprises aluminium, and wherein said rigid layers comprise an alkali metal.
5. A lithographic apparatus according to claim 2 , wherein said bonding layer forms an electrode of an electrostatic clamping electrode and one of said bonded layers forms a covering dielectric layer for clamping said article against said article support.
6. A lithographic apparatus according to claim 5 , wherein said covering dielectric layer comprises a plurality of outward facing protrusions.
7. A lithographic apparatus according to claim 5 , wherein a second bonding layer forms another electrode of an electrostatic clamping electrode for clamping said article support against a base plane provided by said lithographic apparatus.
8. A lithographic apparatus according to claim 7 , wherein said second bonding layer is covered by a bonded layer comprising a plurality of outward facing protrusions.
9. A lithographic apparatus according to claim 1 , wherein said bonded layers comprise a flat bonding surface.
10. A lithographic apparatus according to claim 1 , wherein said bonded layers each comprise a rigid material.
11. A lithographic apparatus according to claim 10 , wherein said rigid material comprises a material selected from the group consisting of: ceramic material, crystalline material, ULE®, ZERODUR®, Cordierite, and Sapphire material.
12. A lithographic apparatus according to claim 1 , wherein at least a plurality of said recesses are interconnected and drain in a common drain.
13. A lithographic apparatus according to claim 12 , wherein said common drain is arranged to communicate with a pressure environment provided in said lithographic apparatus.
14. A lithographic apparatus according to claim 13 , wherein said pressure environment is a vacuum pressure environment or a backfill gas pressure environment.
15. An article support configured to support an article to be placed in a beam path of radiation of a lithographic apparatus, said article support comprising a plurality of bonded layers, wherein at least one of said bonded layers comprises a plurality of recesses facing another of said bonded layers so as to reduce a bonding surface therebetween.
16. An article support according to claim 15 , wherein said article support is arranged to support a substrate to be processed into a manufacturing device, or a lithographic projection mask, or a mask handling apparatus, or a mask manufacturing apparatus, or an optical element.
17. A method of bonding objects of a rigid material for use in a lithographic apparatus, the method comprising:
providing a first object of a rigid material comprising a first face side;
providing a second object of a rigid material comprising a second face side;
creating a layout of recesses on at least said second face side of said second object so as to reduce a contact between said first object and said second object; and
bonding said first and said second objects by bonding said first and second face sides.
18. A method according to claim 17 , wherein at least one of said objects is formed as a layer.
19. A method according to claim 18 wherein, after bonding, said at least one layer is machined to provide a thin layer bonded on the other of said at least one object.
20. A method according to claim 19 , wherein said machining comprises polishing, or grinding, or chemical mechanical processing, or any combination thereof.
21. A method according to claim 17 , wherein said bonding comprises anodic bonding.
22. A method according to claim 17 , wherein said layout is arranged to provide a common drain for draining said recesses.
23. A method according to claim 22 , further comprising draining said recesses, and sealing said recesses.
24. A method according to claim 23 , wherein said rigid material comprises a material selected from the group consisting of: a ceramic material, a crystalline material, ULE®, ZERODUR®, Cordierite, and Sapphire material.
25. A bonding structure of bonded rigid materials for use in a lithographic apparatus, the bonding structure comprising:
a first object of a rigid material comprising a first face side;
a second object of a rigid material comprising a second face side, said second face side comprising protrusions formed thereon facing said first face side; and
a bonding material bonding said first and second face sides.
26. A bonding structure according to claim 25 , wherein said bonding material is an aluminium material and/or said rigid material comprises alkali metals for anodic bonding said first and second objects.
27. A bonding structure according to claim 25 , wherein said rigid material comprises a material selected from the group consisting of: ceramic material, crystalline material, ULE®, ZERODUR®, Cordierite, and Sapphire material.
28. A bonding structure according to claim 25 , wherein at least one of said objects comprises layers.
29. A bonding structure according to claim 25 , wherein said structure forms an article support configured to support an article to be placed in a beam path of the lithographic apparatus.
30. A bonding structure according to claim 29 , wherein said structure forms a duct structure in said article support.
31. A bonding structure according to claim 25 , wherein said structure forms a filler structure for housing a substrate in an immersion photolithographic apparatus.
32. A bonding structure according to claim 25 , wherein said structure forms a suspension structure for suspending a sensor element or a mirror.
33. A bonding structure according to claim 25 , wherein the protrusions have surfaces that are bonded to said first face side.
34. A device manufacturing method comprising:
generating a radiation beam;
supporting an article in a beam path of the radiation beam with an article support;
patterning the radiation beam; and
projecting the patterned radiation beam onto a target portion of a substrate,
wherein the article support comprises a plurality of bonded layers, at least one of said bonded layers comprising a plurality of recesses facing another of said bonded layers so as to reduce a bonding surface therebetween.
35. A device manufactured according to the method of claim 34 .