Method of forming a silicon oxynitride film with tensile stress
A method for forming a densified silicon oxynitride film with tensile stress and a semiconductor device including the densified silicon oxynitride film. The densified silicon oxynitride film can be formed by depositing a porous SiNC:H film on a substrate in a LPCVD process, and exposing the porous SiNC:H film to an oxygen-containing gas to incorporate oxygen into the SiNC:H film, thereby forming a densified SiONC:H film having a greater density than the porous SiNC:H film. The densified silicon oxynitride film can be included on a substrate including the semiconductor device.
1. A method of forming a silicon oxynitride film, comprising:
depositing a porous SiNC:H film on a substrate; and
exposing the porous SiNC:H film to an oxygen-containing gas to form a densified SiONC:H film having a density greater than the porous SiNC:H film.
2. The method according to claim 1 , wherein the exposing the porous SiNC:H film to an oxygen-containing gas comprises: producing a densified SiONC:H film having a tensile stress equal to or greater than about 1.5 GPa.
3. The method according to claim 1 , wherein the depositing comprises: exposing the substrate to a process gas including an organosilane gas and a nitrogen-containing gas.
4. The method according to claim 1 , wherein the depositing comprises: exposing the substrate to a process gas including BTBAS bis(tertiary-butylaminosilane) and NH 3 .
5. The method according to claim 4 , wherein the exposing comprises: supplying the process gas with a BTBAS: NH 3 ratio greater than 0.5:1.
6. The method according to claim 4 , wherein the exposing comprises: supplying the process gas with a BTBAS: NH 3 ratio between about 2:1 and about 8:1.
7. The method according to claim 4 , wherein the depositing further comprises: maintaining the substrate at a temperature between about 500° C. and about 800° C.
8. The method according to claim 4 , wherein the depositing further comprises: maintaining the substrate at a temperature between about 525° C. and about 575° C.
9. The method according to claim 1 , wherein the depositing further comprises: maintaining a process chamber pressure between about 0.05 Torr and about 200 Torr.
10. The method according to claim 1 , wherein the depositing further comprises: maintaining a process chamber pressure between about 0.3 Torr and about 10 Torr.
11. The method according to claim 1 , wherein the depositing comprises: depositing the SiONC:H film to a thickness between about 5 nm and about 50 nm.
12. The method according to claim 1 , wherein the exposing the porous SiNC:H film to an oxygen-containing gas comprises: exposing the porous SiNC:H film to air.
13. The method according to claim 1 , wherein the exposing the porous SiNC:H film to an oxygen-containing gas comprises: exposing the porous SiNC:H film to at least one of O 2 , H 2 O, O 3 , or a combination thereof.
14. The method according to claim 13 , wherein the exposing the porous SiNC:H film to an oxygen-containing gas comprises: maintaining the process chamber at a pressure between about 1 Torr and about 1000 Torr.
15. The method according to claim 1 , further comprising: repeating the depositing a porous SiNC:H film and exposing the porous SiNC:H film to an oxygen-containing gas until the SiONC:H film has a predetermined thickness.
16. The method according to claim 15 , wherein the repeating the depositing a porous SiNC:H film comprises: continuing the repeating until the SiONC:H film has a thickness of between about 10 nm and about 1000 nm.
17. The method according to claim 1 , wherein the depositing a porous SiNC:H film on a substrate comprises: depositing on a device having at least one doped region and a gate stack formed on the substrate.
18. The method according to claim 1 , wherein the depositing is performed at approximately the same temperature as the exposing, at a lower temperature than the exposing, or at a higher temperature than the exposing.
19. The method according to claim 1 , wherein the exposing the porous SiNC:H film to an oxygen-containing gas comprises: producing a densified SiONC:H film having a tensile stress equal to or greater than about 1.5 GPa but less than about 3.0 GPa.