Semiconductor integrated circuit for reducing number of contact pads to be probed in probe test

1. A semiconductor chip comprising:

a plurality of contact pads;

a plurality of latch circuits connected with said plurality of contact pads, respectively;

an internal circuit electrically connected with said plurality of latch circuits; and

a control circuit,

wherein said plurality of latch circuits are serially connected to form a ring shift register,

wherein said plurality of contact pads include;

first contact pads; and

second contact pads,

wherein an area of said first contact pads is larger than that of said second contact pads, and

wherein said control circuit controls data transfer over said ring shift register.

2. The semiconductor chip according to claim 1 , wherein said plurality of latch circuits include:

first latch circuits connected with said first contact pads; and

second latch circuits connected with said second contact pads,

wherein said second latch circuits latch output data from said internal circuit, and

wherein said control circuit is configured to control said first and second latch circuits so that said output data are transferred to said first contact pads through said first latch circuits.

3. The semiconductor chip according to claim 2 , further comprising:

first I/O circuits connected between said first contact pads and said first latch circuits; and

second I/O circuits connected between said second contact pad and said second latch circuits,

wherein said second I/O circuits are deactivated when said second latch circuits latch said output data.

4. The semiconductor chip according to claim 1 ,

wherein said plurality of contact pads further include third contact pads,

wherein an area of said third contact pads is larger than that of said second contact pads,

wherein said plurality of latch circuits further include third latch circuits connected with said third contact pads and latching input data externally provided through said third contact pads, and

wherein said control circuit is configured to control said first to third latch circuits so that said input data are transferred to said internal circuit.

5. The semiconductor chip according to claim 1 , wherein said first and second contact pads are arranged along different edges of said semiconductor chip.

6. The semiconductor chip according to claim 1 , wherein said semiconductor chip has first to fourth edges said first and third edges being opposed to each other and said second and fourth edges being opposed to each other,

wherein said first contact pads are arranged along said first edge, and said second contact pads are arranged along said second edge.

7. The semiconductor chip according to claim 1 , wherein said first contact pads have a trace of a probe.

8. The semiconductor chip according to claim 1 ,

wherein said plurality of contact pads further include third contact pads,

wherein said plurality of latch circuits further include third latch circuits latching input data externally provided through said third contact pads,

wherein an area of said third contact pads is larger than that of said second contact pads,

wherein said internal circuit is responsive to said input data received by said third latch circuits to output internal circuit output data, and said second latch circuits latch said internal circuit output data, and

wherein said control circuit controls said first and second latch circuits to transfer said internal circuit output data from said second latch circuits to said first latch circuits.

9. The semiconductor chip according to claim 8 , wherein said internal circuit is responsive to said input data received by said third latch circuits to output other internal circuit output data, and said first latch circuits latch said other internal circuit output data, and

wherein said other internal circuit output data are externally output from said first latch circuits through said first contact pads, and then said internal circuit output data are externally output from said first latch circuits through said first contact pads.

10. The semiconductor chip according to claim 8 , wherein said plurality of contact pads further include fourth contact pads,

wherein said plurality of latch circuits further include fourth latch circuits connected with said fourth contact pads,

wherein an area of said fourth contact pads is smaller than those of said first and third contact pads,

wherein said internal circuit is responsive to said input data received by said third latch circuits to output still other internal circuit output data, and said fourth latch circuits latch said other internal circuit output data,

wherein said control circuit controls said third and fourth latch circuit to transfer said still other internal circuit output data from said fourth latch circuits to said third latch circuits, and

wherein said still other internal circuit output data are externally output from said third latch circuits through said third contact pads.