Computing device including a stacked semiconductor device
The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip ( 20 ) disposed on a substrate ( 10 ), a first sealing resin ( 26 ) sealing the first semiconductor chip ( 20 ), a built-in semiconductor device ( 30 ) disposed on the first sealing resin ( 26 ), and a second sealing resin ( 36 ) sealing the first sealing resin ( 26 ) and the built-in semiconductor device ( 30 ) and covering a side surface (S) of the substrate ( 10 ). According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.
1. A computing device comprising:
a processor;
an input component;
an output component;
a memory comprising:
a volatile memory; and
a flash memory comprising:
a first semiconductor chip disposed on a first surface of a first substrate, the first substrate comprises a second surface opposing the first surface;
a first sealing resin sealing the first semiconductor chip;
a built-in semiconductor device comprising:
a second substrate;
a second semiconductor chip disposed on the second substrate; and
a second sealing resin sealing the second semiconductor chip, the second sealing resin of the built-in semiconductor device disposed on the first sealing resin; and
a third sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate.
2. The computing device of claim 1 , wherein said computing device is a personal computer (PC).
3. The computing device of claim 1 , wherein said computing device is a personal digital assistant (PDA).
4. The computing device of claim 1 , wherein said computing device is a gaming system.