Method and system for double-sided patterning of substrates
The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.
1. A method for patterning a substrate with a mold assembly, the substrate having first and second opposed sides, the method comprising the steps of:
positioning the substrate on a chuck having a cavity, the first side of the substrate positioned toward the mold assembly, and the second side of the substrate positioned toward the chuck;
obtaining a first spatial relationship between the substrate and the mold assembly such that the first side of the substrate is in superimposition with the mold assembly, the mold assembly and the first side of the substrate having a material positioned therebetween;
forming a pattern in the material on the first side of the substrate with the mold assembly, defining a first patterned layer;
obtaining a second spatial relationship, differing from the first spatial relationship, between the substrate and the mold assembly such that the second side of the substrate is in superimposition with the mold assembly, with the mold assembly and the second side of the substrate having a material positioned therebetween, wherein obtaining the second spatial relationship includes positioning the substrate on the chuck such that the first patterned layer is within the cavity of the chuck to minimize damage to the first patterned layer during patterning of the second side of the substrate; and
forming a pattern in the material on the second side of the substrate with the mold assembly, defining a second patterned layer.
2. The method as recited in claim 1 wherein the step of obtaining the second spatial relationship further comprises a step of flipping the substrate.
3. The method as recited in claim 1 wherein the step of obtaining the second spatial relationship further comprises a step of flipping the substrate 180 degrees with respect to the mold assembly.
4. The method as recited in claim 1 , further including detecting, by at least one imaging unit, positioning of the substrate to provide the first spatial relationship between the substrate and the mold assembly.
5. The method as recited in claim 4 , wherein the at least one imaging unit detects a center location of the substrate.
6. The method as recited in claim 1 , further including detecting, by at least one imaging unit, positioning of the substrate to provide the second spatial relationship between the substrate and the mold assembly.