Flip-chip image sensor packages and methods of fabricating the same
There is provided an imager package including an image sensor die attached to a transparent substrate such that sensitive image sensing components on the sensor die face the transparent substrate. In accordance with an embodiment of the present technique, the imager package may be coupled to an external package via bond wires and other interconnect elements. The sensor die and bond wires may be protected by an encapsulant on which the interconnect elements may be disposed. The bond wires may enable placement of the interconnect elements partially or directly above the sensor die, as opposed to around an outer periphery of the sensor die. There is further provided a method of manufacturing an imager package wherein interconnect elements may be located partially or directly above the sensor die, enabling the manufacture of smaller imager packages than previously envisioned.
1. An electronic device comprising:
a transparent substrate having bond pads;
a sensor die coupled to the bond pads on the transparent substrate, wherein an active side of the sensor die faces the transparent substrate;
a plurality of bond wires coupled to the bond pads on the transparent substrate and not coupled to an inactive side of the sensor die;
an encapsulant disposed about the sensor die; and
a plurality of interconnect elements coupled to the bond wires and disposed on a backside of the encapsulant.
2. The electronic device of claim 1 , wherein the interconnect elements comprise balls, bumps, studs, pads, or a combination thereof.
3. The electronic device of claim 1 , wherein the interconnect elements are located around an outer periphery of the sensor die.
4. The electronic device of claim 1 , wherein the interconnect elements are located at least partially above the sensor die.
5. The electronic device of claim 1 , wherein the transparent substrate comprises glass.
6. The electronic device of claim 1 , wherein the sensor die is not attached to the transparent substrate via a sealant.
7. The electronic device of claim 1 , wherein the sensor die comprises an imager sensor.
8. The electronic device of claim 1 , wherein the sensor die comprises an imager sensor.
9. The electronic device of claim 1 , wherein the electronic device comprises an imager package.
10. An electronic device comprising:
a transparent substrate having bond pads;
a sensor die coupled to the bond pads, wherein an active side of the sensor die faces the transparent substrate;
a plurality of conductive elements disposed on an inactive side of the sensor die;
a plurality of bond wires coupled to the bond pads on the transparent substrate and to the conductive elements on the inactive side of the sensor die;
an encapsulant disposed about the sensor die; and
a plurality of interconnect elements coupled to the conductive elements and disposed on a backside of the encapsulant.
11. The electronic device of claim 10 , comprising an insulating substrate disposed on the inactive side of the sensor die.
12. The electronic device of claim 10 , wherein the conductive elements comprise balls, bumps, studs, pads, or a combination thereof.
13. The electronic device of claim 10 , wherein the interconnect elements comprise balls, bumps, studs, pads, or a combination thereof.
14. An electronic device comprising:
a transparent substrate;
a sensor die electrically coupled to the transparent substrate, wherein an active side of the sensor die faces the transparent substrate;
a plurality of electrically conductive paths configured to couple the sensor die to an external package, wherein the electrically conductive paths comprise bond wires; and
an encapsulant completely encasing the sensor die on the transparent substrate.
15. The electronic device of claim 14 , comprising the external package.
16. The electronic device of claim 15 , wherein the external package comprises at least one of a printed circuit board, a printed wiring board, a controller, a memory, or an image processor.
17. The electronic device of claim 14 , wherein the electrically conductive path comprises:
a first conductive element coupled to the active side of the sensor die;
a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad; and
an interconnect element coupled to the bond wire and disposed on a backside of the encapsulant, wherein the interconnect element comprises a solder ball.
18. The electronic device of claim 14 , wherein the electrically conductive path comprises:
a first conductive element coupled to the active side of the sensor die;
a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad; and
an interconnect element coupled to the bond wire and disposed on a backside of the encapsulant, wherein the interconnect element comprises a land pad.
19. The electronic device of claim 14 , wherein the electrically conductive path comprises:
a first conductive element coupled to the active side of the sensor die;
a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad; and
an interconnect element coupled to the bond wire and disposed on a backside of the encapsulant, wherein the interconnect element comprises a conductive grid and solder balls coupled to the conductive grid.
20. The electronic device of claim 14 , wherein the electrically conductive path comprises:
a first conductive element coupled to the active side of the sensor die;
a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad;
a conductive grid disposed on an inactive side of the sensor die, wherein the bond wire is coupled to the conductive grid;
a second conductive element coupled to the conductive grid; and
an interconnect element coupled to the second conductive element.
21. The electronic device of claim 14 , wherein the electrically conductive path comprises:
a first conductive element coupled to the active side of the sensor die;
a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad;
a conductive grid disposed on an insulating substrate disposed on an inactive side of the sensor die, wherein the bond wire is coupled to the conductive grid;
a second conductive element coupled to the conductive grid; and
an interconnect element coupled to the second conductive element.
22. The electronic device of claim 14 , wherein:
the electronic device comprises a side-castellated imager package;
the electrically conductive path comprises a first conductive element coupled to the active side of the sensor die and a bond pad disposed on the transparent substrate and coupled to the first conductive element, wherein the bond wire is coupled to the bond pad; and
the electrically conductive path terminates on a side of the imager package.
23. An electronic device comprising:
a transparent substrate having bond pads;
a sensor die coupled to the bond pads on the transparent substrate, wherein an active side of the sensor die faces the transparent substrate;
an encapsulant completely encasing the sensor die on the transparent substrate; and
a plurality of bond wires coupled to the bond pads on the transparent substrate and routed directly to an exterior of the encapsulant.
24. The electronic device of claim 23 , comprising a plurality of interconnect elements coupled to the bond wires and disposed on the exterior of the encapsulant.
25. The electronic device of claim 24 , wherein the interconnect elements comprise balls, bumps, studs, pads, or a combination thereof.
26. The electronic device of claim 23 , wherein the bond wires are routed directly to a backside of the encapsulant.
27. The electronic device of claim 23 , wherein the bond wires are routed directly to a side wall of the encapsulant.