Method of forming a semiconductor device having dummy features
View Patent ↗A method for forming a semiconductor device includes providing a plurality of features in a layout, selecting critical features from the plurality of features, placing a first plurality of short-range dummy etch features in the layout at a first distance from the critical features to increase the feature density near the critical features, wherein each of the first plurality of short-range dummy etch features has a first width, removing at least one of the first plurality of short-range dummy etch features from the layout that will subsequently interfere with the electrical performance of at least one active feature so that a second plurality of short-range dummy etch features remains, and using the layout to pattern a layer on a semiconductor substrate.
1. A method for forming a semiconductor device, the method comprising:
providing a plurality of features in a layout;
selecting critical features from the plurality of features;
determining a plurality of first distances between each of the critical features and any of the plurality of features;
placing a first short-range dummy etch feature in the layout at a first distance from a first critical feature when one of the plurality of first distances is no greater than a predetermined distance, whereby placing the first short-range dummy etch feature is performed to change feature density near one of the plurality of the critical features;
determining a plurality of second distances between each of the critical features and the first short-range dummy etch features; and
placing a second short-range dummy etch feature in layout at a second distance from a second critical feature when one of the plurality of the second distances is no greater than the predetermined distance, wherein the second distance is greater than the first distance.
2. The method of claim 1 , further comprising removing a first short-range dummy etch feature before the determining the plurality of second distances.
3. The method of claim 1 , wherein placing the first short-range dummy etch feature in the layout at the first distance from the first critical feature further comprises placing a first short-range dummy etch features in the layout at a first distance, wherein the first distance is less than 1 micrometer.
4. The method of claim 3 , wherein placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature further comprises placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature, wherein the second distance is less than 1 micrometer.
5. The method of claim 1 , wherein placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature further comprises placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature, wherein the second critical feature is different than the first critical feature.
6. The method of claim 1 , wherein placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature further comprises placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature, wherein the second critical feature is the same as the first critical feature.
7. The method of claim 1 , further comprising placing long-range dummy features in the layout.
8. The method of claim 1 , wherein selecting critical features from the plurality of features further comprises selecting critical features, wherein the critical features are active features.
9. The method of claim 1 , wherein selecting critical features from the plurality of features further comprises selecting gate electrodes.
10. The method of claim 1 , wherein placing the first short-range dummy etch feature further comprises placing from a top-view a rectangular shaped feature.
11. The method of claim 1 , wherein placing the second short-range dummy etch feature further comprises placing the second short-range dummy etch feature, wherein from a top view the first short-range dummy etch feature has a first dimension and the second short-range dummy etch feature has a second dimension, wherein the second dimension is different than the first dimension.
12. A method for forming a semiconductor device, the method comprising:
providing a plurality of features in a layout;
selecting critical features from the plurality of features;
placing a first plurality of short-range dummy etch features in the layout at a first distance from the critical, wherein each of the first plurality of short-range dummy etch features has a first width;
removing at least one of the first plurality of short-range dummy etch features from the layout so that a second plurality of short-range dummy etch features remains;
placing a third plurality of short-range dummy etch features in the layout at a second distance from critical features after removing at least one of the first plurality of short-range dummy etch features, wherein each of the third plurality of short-range dummy etch features has a second width and the second width is greater than the first width; and
using the layout to pattern a layer on a semiconductor substrate.
13. The method of claim 12 , further comprising:
determining distances between critical features and between critical features and adjacent short range dummy features that are part of the second plurality of short-range dummy features;
determining when the distances are less than a predetermined distance; and
wherein placing the third plurality of short-range dummy etch features further comprises placing the one of the third plurality of short-range dummy etch features adjacent a critical feature when the distance is less than the predetermined distance.
14. A method for forming a semiconductor device, the method comprising:
providing a semiconductor substrate having a first layer;
forming critical features and dummy etch features in the first layer, wherein locations of the dummy etch features are determined by:
providing a plurality of features in a first level of a layout;
selecting critical features from the plurality of features;
determining a plurality of first distances between each of the critical features and any other of the plurality of features;
placing a first short-range dummy etch features in the layout at a first distance from a first critical feature when the first distance is no greater than a predetermined distance;
determining a plurality of second distances between each of the critical features and the first short-range dummy etch features; and
placing second short-range dummy etch features in the layout at a second distance from a second critical feature when the second distance is no greater than the predetermined distance, wherein the second distance is greater than the first distance; and
patterning the first layer to form the critical features, the first short-range dummy etch features, and the second short-range dummy etch features in the first layer.
15. The method of claim 14 , wherein the locations of the first short-range dummy etch features are further determined by removing any first short-range dummy etch features when the first short-range dummy etch feature will subsequently interfere with circuit functions, wherein the removing is performed before the placing the second short-range dummy etch features.
16. The method of claim 14 , wherein placing the first short-range dummy etch features in the layout at the first distance from the first critical feature further comprises placing the first short-range dummy etch features in the layout at a first distance, wherein the first distance is less than 1 micrometer.
17. The method of claim 14 , wherein placing the second short-range dummy etch features in the layout at the second distance from the second critical feature further comprises placing the second short-range dummy etch feature in the layout at the second distance from the second critical feature, wherein the second critical feature is different than the first critical feature.
18. The method of claim 14 , wherein placing the second short-range dummy etch feature in the layout at the second distance from a second critical feature further comprises placing the second short-range dummy etch features in the layout at the second distance from the second critical feature, wherein the second critical feature is the same as the first critical feature.
19. The method of claim 14 , further comprising placing long-range dummy features in the layout.