IP Library Granted Patent US 7,745,862
Granted Patent B2
US 7,745,862 · App. 12/232,682 · Granted Jun 29, 2010

CMOS image sensor and method for manufacturing the same

Assignee: Dongbu Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,745,862
App. No.
12/232,682
Granted
Jun 29, 2010
Kind
B2
Abstract

A CMOS image sensor and a method for manufacturing the same improves photosensitivity and prevent loss of light by forming a photo-sensing unit under a color filter. The CMOS image sensor may include a plurality of transistors formed on a semiconductor substrate, a metal line formed over the plurality of transistors for electrically connecting the plurality of transistors, and a plurality of photodiodes electrically connected with the plurality of transistors and formed over the metal line.

Claims (15)

1. A CMOS image sensor comprising:

a plurality of transistors formed on a semiconductor substrate;

a metal line formed over the plurality of transistors for electrically connecting the plurality of transistors;

a plurality of photodiodes electrically connected with the transistors and formed over the metal line;

a color filter formed on the plurality of photodiodes;

a planarization layer formed on the color filter; and

a micro-lens formed on the planarization layer.

2. The CMOS image sensor of claim 1 , further comprising a metal dielectric layer formed between the plurality of transistors and the plurality of photodiodes.

3. The CMOS image sensor of claim 2 , wherein the metal dielectric layer comprises a TEOS oxide layer and an SOG oxide layer.

4. The CMOS image sensor of claim 2 , wherein the metal dielectric layer comprises:

a first metal dielectric layer formed between the plurality of transistors and the metal line; and

a second metal dielectric layer formed between the metal line and the plurality of photodiodes.

5. The CMOS image sensor of claim 2 , further comprising a plug formed in the metal dielectric layer for electrically connecting one of the plurality of transistors with one of the plurality of photodiodes.

6. The CMOS image sensor of claim 1 , wherein the metal line is formed of two or more metal line layers.

7. The CMOS image sensor of claim 1 , further comprising an isolation region formed between each of the plurality of photodiodes.

Assignments (2)
CHANGE OF NAME Recorded Apr 29, 2010
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 024308/0418 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2009
From: SOHN, HYUN JOON
To: DONBUANAM SEMICONDUCTOR INC.
Reel/Frame 022544/0834 →
Priority Claims (1)
KR 10-2004-0116557 · Dec 30, 2004 · national
Continuity (2)
Division 1131948700 · Dec 29, 2005
Related Publication 20090072283A1 · Mar 19, 2009