Method of forming a semiconductor memory device and semiconductor memory device

1. A method of forming a semiconductor memory device, the method comprising:

forming gate stacks of an array of memory cells and a plurality of select transistors above a carrier;

forming spacers between the gate stacks;

forming an opening between the spacers in an area that is provided for a source line;

applying a sacrificial layer and filling the opening with the sacrificial layer;

patterning the sacrificial layer to form a patterned sacrificial layer having interspaces, the patterned sacrificial layer having a first portion filling the opening, and a second portion substantially parallel to the carrier and disposed above a top surface of the array of memory cells;

filling the interspaces with a planarizing layer of dielectric material;

removing the patterned sacrificial layer;

applying an electrically conductive material to form the source line and a shield; and A 1

applying tetraethylorthosilicate to form a further auxiliary layer after the patterning the sacrificial layer.

2. The method according to claim 1 , wherein the sacrificial layer is formed from polysilicon.

3. The method according to claim 1 , further comprising:

forming further openings between the spacers;

patterning the sacrificial layer to form remaining portions having interspaces that leave the further openings free of the sacrificial layer; and

filling the interspaces with the planarizing layer of dielectric material.

4. The method according to claim 1 , further comprising:

forming openings between the spacers in areas that are provided for the source line and for bitline contacts;

patterning the sacrificial layer to form remaining portions filling the openings; and

applying the electrically conductive material to form the source line, the shield, and a bitline via.

5. The method according to claim 4 , further comprising:

forming recesses in the source line and in the shield;

applying a dielectric material into the recesses; and

applying a metal layer contact-connecting the bitline via.

6. The method according to claim 4 , further comprising:

applying a dielectric layer onto the source line, the shield, and the bitline via;

forming a further via on the bitline via; and

applying a metal layer contact-connecting the further via.

7. The method according to claim 1 , further comprising:

forming recesses in the source line and in the shield;

applying a dielectric material into the recesses;

forming a plug of the electrically conductive material in the dielectric material on the shield, the plug contact-connecting the shield; and

applying a metal layer contact-connecting the plug.

8. The method according to claim 1 , further comprising applying tetraethylorthosilicate to form an auxiliary layer before the applying the sacrificial layer.

9. The method according to claim 1 , further comprising forming the planarizing layer from boronphosphorussilicate glass.

10. A method of forming a semiconductor memory device, the method comprising:

forming gate stacks of an array of memory cells and a plurality of select transistors above a carrier;

forming spacers between the gate stacks;

forming an opening between the spacers in an area that is provided for a source line;

applying a sacrificial layer and filling the opening with the sacrificial layer;

patterning the sacrificial layer to form a patterned sacrificial layer having interspaces, the patterned sacrificial layer having a first portion filling the opening, and a second portion substantially parallel to the carrier and disposed above a top surface of the array of memory cells;

filling the interspaces with a planarizing layer of dielectric material;

removing the patterned sacrificial layer;

applying an electrically conductive material to form the source line and a shield;

applying a hardmask on the planarizing layer after applying the electrically conductive material to form the source line, the hardmask having a smooth upper surface level;

forming a recess in the electrically conductive material;

filling the recess with a dielectric layer;

planarizing the dielectric layer to the upper surface level of the hardmask; and

applying a metal layer.

11. The method according to claim 1 , wherein the sacrificial layer forms a planarized surface above the opening and the gate stacks.

12. The method according to claim 11 , further comprising planarizing the sacrificial layer before patterning the sacrificial layer.

13. A method of forming a semiconductor memory device, the method comprising:

forming gate stacks of an array of memory cells and a plurality of select transistors above a carrier;

forming spacers between the gate stacks;

forming a first opening between the spacers in an area that is provided for a source line;

applying an auxillary layer onto the first opening, the auxillary layer forming a liner around a bottom surface and sidewalls of the first opening;

applying a sacrificial layer onto the auxiliary layer and filling the first opening with the sacrificial layer, wherein a top surface of the sacrificial layer is disposed above a top surface of the gate stacks;

forming a hardmask layer on the top surface of the sacrificial layer;

patterning the sacrificial layer using the hardmask layer;

forming a further auxillary layer over the patterned sacrificial;

forming a cover layer over the further auxillary layer to form interspaces adjacent the patterned sacrificial layer;

removing the cover layer and the further auxiliary layer disposed over the patterned sacrificial layer;

removing the patterned sacrificial layer and the exposed auxillary layer; and

applying an electrically conductive material to form the source line and a shield.

14. The method according to claim 13 , further comprising:

forming a second opening between the spacers in areas that are provided for bitline contacts, wherein applying an auxiliary layer comprises applying the auxillary layer onto the second opening, the auxiliary layer forming a liner around a bottom surface and sidewalls of the second opening; and

filling the second opening with the sacrificial layer, wherein applying an electrically conductive material comprises forming a bitline via.

15. The method according to claim 14 , further comprising:

forming recesses in the source line and in the shield;

applying a dielectric material into the recesses; and

applying a metal layer contact-connecting the bitline via.