IP Library › Granted Patent US 7,870,751
Granted Patent B2
US 7,870,751 · App. 11/370,858 · Granted Jan 18, 2011

Temperature control system and substrate processing apparatus

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 7,870,751
App. No.
11/370,858
Granted
Jan 18, 2011
Kind
B2
Abstract

A temperature control system and a substrate processing apparatus are provided. The temperature control system for controlling temperatures of one or more members of a substrate processing apparatus includes a circulation system for circulating a first coolant to pass through the inside of each of the members, a heat exchanger for performing heat exchange between the first coolant of the circulation system and a second coolant, and a chiller for supplying the second coolant to the heat exchanger, wherein the circulation system includes a branch line for each of the members passing through the inside thereof, the branch line for each of the members is provided with a heating member for heating the first coolant supplied thereto, and the heat exchanger is installed in a room where the substrate processing apparatus is installed.

Claims (37)

1. A temperature control system that controls temperatures of a plurality of members of a substrate processing apparatus, comprising:

a circulation system that accommodates a first coolant to pass through the inside of each of at least a part of the members;

a heat exchange unit consisting essentially of a heat exchanger that performs heat exchange between the first coolant of the circulation system and a second coolant and a pump that circulates the first coolant in the circulation system; and

a chiller that supplies the second coolant to the heat exchanger,

wherein the circulation system includes one or more branch lines for each of said at least the part of the members passing through the inside thereof,

wherein each of the branch lines is provided with a heating member that heats the first coolant supplied thereto,

wherein the heat exchanger is installed in a room where the substrate processing apparatus is installed,

wherein the temperature control system is configured to control temperatures of said at least the part of the members to be different from each other by using the heating member,

wherein the heating member is provided on an inlet side of each of said at least the part of the members,

wherein a flow rate control valve is installed at each of the branch lines, on an inlet side of the heating member, and

wherein the first coolant is cooled in the heat exchanger to a temperature below target temperatures of said at least the part of the members and heated by the heating member to a respective target temperature.

2. The temperature control system of claim 1 , wherein the room is a clean room.

3. The temperature control system of claim 1 , wherein the circulation system is devoid of a storage tank of the first coolant.

4. The temperature control system of claim 1 , further comprising:

a first coolant collection device that collects therein the first coolant of the circulation system and returns the collected first coolant to the circulation system,

wherein the first coolant collection device is detachable from the circulation system.

5. The temperature control system of claim 4 , wherein the first coolant collection device includes:

a storage tank that stores the first coolant;

a first passageway that introduces the first coolant of the circulation system to the storage tank;

a second passageway that drains the first coolant from the storage tank to the circulation system; and

a gas supply line that supplies a gas into the second passageway.

6. The temperature control system of claim 5 , wherein the storage tank is accommodated in an airtight storage tank accommodating container, and

the gas supply line is configured to supply the gas into the storage tank accommodating container.

7. The temperature control system of claim 1 , the temperature control system further comprising:

an additional circulation system that circulates a coolant medium to pass through the inside of each of another part of the members; and

an additional heat exchanger that performs heat exchange between the coolant medium and a third coolant which serves to cool the second coolant at the chiller.

8. The temperature control system of claim 7 , wherein the first coolant and the coolant medium of the circulation systems are made of an identical material.

9. A substrate processing apparatus, comprising:

a plurality of members; and

a temperature control system including a circulation system that accommodates a first coolant to pass through the inside of each of at least a part of the members, a heat exchange unit consisting essentially of a heat exchanger that performs heat exchange between the first coolant of the circulation system and a second coolant and a pump that circulates the first coolant in the circulation system, and a chiller that supplies the second coolant to the heat exchanger,

wherein the circulation system includes one or more branch lines for each of said at least the part of the members passing through the inside thereof,

wherein each of the branch lines is provided with a heating member that heats the first coolant supplied thereto,

wherein the heat exchanger is installed in a room where the substrate processing apparatus is installed,

wherein the temperature control system is configured to control temperatures of said at least the part of the members to be different from each other by using the heating member,

wherein the heating member is provided on an inlet side of each of said at least the part of the members,

wherein a flow rate control valve is installed at each of the branch lines, and

wherein the first coolant is cooled in the heat exchanger to a temperature below target temperatures of said at least the part of the members.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2006
From: KANEKO, KENGO; HAYAMI, TOSHIHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 017667/0418 →
Priority Claims (1)
JP 2005-068975 · Mar 11, 2005 · national
Continuity (2)
Provisional Application 6066496000 · Mar 25, 2005
Related Publication 20060201172A1 · Sep 14, 2006