Method of manufacturing a semiconductor device including recessed-channel-array MOSFET having a higher operational speed
View Patent ↗A semiconductor device includes a recessed-channel-array MOSFET including a gate electrode having a portion received in a recess. The gate insulting film has a first portion made of silicon oxide in contact with the sidewall of the recess and a second portion made of silicon oxynitride in contact with the bottom of the recess. The first portion has an equivalent oxide thickness larger than the equivalent oxide thickness of the second portion to reduce the parasitic capacitance of the gate electrode.
1. A method for manufacturing a semiconductor device comprising:
forming a recess on a semiconductor substrate, wherein the recess comprising a side portion and a bottom portion disposed in the semiconductor substrate;
forming a silicon oxide film on the side portion and the bottom portion of the recess;
selectively nitriding the silicon oxide film on the bottom portion of the recess to form a silicon oxynitride film on the bottom portion of the recess;
forming a gate electrode in the recess, wherein the gate electrode being contact with the silicon oxynitride film over the bottom portion of the recess, and the gate electrode being contact with the silicon oxide film over the side portion of the recess; and
forming source and drain regions in a surface region of the semiconductor substrate,
wherein the gate electrode being disposed between the source region and the drain region.
2. The method according to claim 1 , wherein said selectively nitriding the silicon oxide film is performed by an anisotropic plasma enhanced nitriding treatment for the silicon oxide film on the bottom portion of the recess.
3. The method according to claim 1 , wherein said selectively nitriding the silicon oxide film is performed by an ion-implantation of nitrogen to the silicon oxide film on the bottom portion of the recess.
4. The method according to claim 1 , wherein the source and the drain regions are formed in contact with a part of the silicon oxide film over the side portion of the recess.
5. The method according to claim 3 , wherein the silicon oxynitride film on the bottom portion of the recess is formed at a position lower than a position of bottom surfaces of the source and the drain regions in the semiconductor substrate.
6. The method according to claim 3 , wherein the gate electrode protrudes from a top surface of the semiconductor substrate.