Electronic device test apparatus and method of configuring electronic device test apparatus
A handler is configured by, separably and connectably, a plurality of types of handling modules of different throughputs and a plurality of types of test modules of different numbers of simultaneous measurements and/or test temperatures. Based on the maximum number of measurable pins of the tester outputting a test pattern and examining a response pattern, the number of terminals of the DUTs, and the test time, the throughput of the handling module and the number of simultaneous measurements and/or test temperature of the test module are selected and combined.
1. A method of configuring an electronic device handling apparatus for bringing DUTs into electrical contact with contacts of a test head, the method comprising:
modularizing a handling unit and a test unit forming the apparatus so as to enable exchange, add or reconfigure of the handling unit and the test unit; and
selecting the handling unit having a corresponding throughput from among a plurality of handling units and the test unit having the corresponding number of simultaneous measurements from among a plurality of test units, on the basis of a maximum number of measurable pins of a tester, a number of terminals of the DUTs, and a test time of the DUTs, wherein
the handling unit comprises a stocker unit, a loader unit and an unloader unit, and wherein
the stocker unit comprises:
a first stocker configured to store customer trays on which a plurality of pre-test DUTs are held;
a second stocker configured to store customer trays on which a plurality of tested DUTs are held; and
a tray conveyor configured to move a customer tray to the loader unit or the unloader unit,
the loader unit has a first transfer device configured to transfer the pre-test DUTs from the customer tray to a test tray and move the test tray to the test unit,
the unloader unit receives the test tray from the test unit and has a second transfer device configured to transfer the tested DUTs from the test tray to the customer tray, and
the test unit receives the test tray from the handling unit and brings the DUTs into electrical contact with the contacts while the DUTs are held on the test tray, wherein
the plurality of handling units differing in operating speed of the first transfer device and/or the number of the DUTs which are simultaneously held by the first transfer device.
2. The method of configuring an electronic device handling apparatus as set forth in claim 1 , wherein
the plurality of handling units differ in operating speed of the second transfer device and/or the number of the DUTs which are simultaneously held by the second transfer device.
3. The method of configuring an electronic device handling apparatus as set forth in claim 1 , wherein
the test unit has a plurality of pushers configured to push the DUTs against the contacts of the test head while the DUTs are held on the test tray, wherein
the plurality of test units differ in the number of pushers.
4. The method of configuring an electronic device handling apparatus as set forth in claim 1 , wherein
the selecting further comprises: selecting the test unit having a corresponding test temperature from among the plurality of test units, wherein
the test unit has a cooling device and/or a heating device configured to make the DUTs the target temperature while the DUTs are held on the test tray, wherein
the plurality of test units comprise:
a first test unit having only the cooling device between the cooling device and the heating device;
a second test unit having only the heating device between the cooling device and the heating device: and/or
a third test unit having both the cooling device and the heating device.
5. A method of configuring an electronic device handling apparatus for bringing DUTs into electrical contact with contacts of a test head, the method comprising:
modularizing a handling unit and a test unit forming the apparatus so as to enable exchange, add or reconfigure a handling unit and a test unit forming the apparatus; and
selecting the handling unit having a corresponding throughput from among a plurality of handling units and the test unit having the corresponding number of simultaneous measurements from among a plurality of test units, on the basis of a maximum number of measurable pins of a tester, a number of terminals of the DUTs, and a test time of the DUTs, wherein
the handling unit comprises a stocker unit, a loader unit and an unloader unit, and wherein
the stocker unit comprises:
a first stocker configured to store customer trays on which a plurality of pre-test DUTs are held;
a second stocker configured to store customer trays on which a plurality of tested DUTs are held; and
a tray conveyor configured to move a customer tray to the loader unit or the unloader unit,
the loader unit has a first transfer device configured to transfer the pre-test DUTs from the customer tray to a test tray and move the test tray to the test unit,
the unloader unit receives the test tray from the test unit and has a second transfer device configured to transfer the tested DUTs from the test tray to the customer tray, and
the test unit receives the test tray from the handling unit and brings the DUTs into electrical contact with the contacts while the DUTs are held on the test tray, wherein
the plurality of handling units differ in an operating speed of the second transfer device and/or the number of the DUTs which are simultaneously held by the second transfer device.
6. The method of configuring an electronic device handling apparatus as set forth in claim 5 , wherein
the test unit has a plurality of pushers configured to push the DUTs against the contacts of the test head while the DUTs are held on the test tray, wherein
the plurality of test units differ in the number of pushers.
7. The method of configuring an electronic device handling apparatus as set forth in claim 5 , wherein
the selecting further includes: selecting the test unit having a corresponding test temperature from among a plurality of test units, wherein
the test unit has a cooling device and/or a heating device configured to make the DUTs the target temperature while the DUTs are held on the test tray, wherein
the plurality of test units comprise:
a first test unit having only the cooling device between the cooling device and the heating device;
a second test unit having only the heating device between the cooling device and the heating device: and/or
a third test unit having both the cooling device and the heating device.